FILM-FORMING PROCESSING APPARATUS, FILM-FORMING METHOD, AND STORAGE MEDIUM

• US 20170009345A1
• Filed: 07/01/2016
• Published: 01/12/2017
• Est. Priority Date: 07/06/2015
• Status: Abandoned Application

• Current Assignee: Tokyo Electron Limited
• Original Assignee: Tokyo Electron Limited
• Inventors: KATO, Hitoshi, HASEBE, Kazuhide
• Application Number:
  US15/200,258
• Publication Number:
  US 20170009345A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: C23C 16/45551 for relative movement of the substrate and the gas injectors or half-reaction reactor compartments
• CPC Class Codes: C23C 16/46 characterised by the method used for heating the substrate C23C16/48, C23C16/50 take precedence

Abstract

A film-forming processing apparatus includes a first heater heating an entire heat treatment region of a substrate, a second heater heating the substrate to have an in-plane temperature distribution having a concentric shape, a gas supplier supplying a process gas to a rotary table; and a control part outputting a control signal for executing a first step of setting a rotation position of the rotary table such that the substrate on the rotary table is placed in a position corresponding to the second heater and forming the in-plane temperature distribution having the concentric shape on the substrate by heating the substrate by the second heater, and a second step of performing a film forming process on the substrate by rotating the rotary table in a state where a heating energy received by the substrate from the second heater is smaller than that in the first step.

Claims

1. A film-forming processing apparatus for performing a film formation by supplying a process gas to a substrate which is mounted on one surface side of a rotary table installed in a vacuum vessel, the substrate being revolved by a rotation of the rotary table, comprising:

a first heating part configured to heat an entire heat treatment region of the substrate in the vacuum vessel;

a second heating part installed to face the rotary table, corresponding to the substrate mounted on the rotary table and configured to heat the substrate to have an in-plane temperature distribution having a concentric shape;

a process gas supply part configured to supply the process gas to the one surface side of the rotary table; and

a control part configured to output a control signal for executing a first step of setting a rotation position of the rotary table such that the substrate on the rotary table is placed in a position corresponding to the second heating part and forming the in-plane temperature distribution having the concentric shape on the substrate by heating the substrate by the second heating part, and a second step of performing a film forming process on the substrate by rotating the rotary table in a state where a heating energy received by the substrate from the second heating part is smaller than that in the first step.

2. The apparatus of claim 1, further comprising:

a making-close or making-far mechanism for positioning the rotary table close to or far from the second heating part, and

wherein a distance between the rotary table and the second heating part is greater in the second step than that in the first step.

3. The apparatus of claim 1, wherein a heating value of the second heating part is smaller in the second step than that in the first step.

4. The apparatus of claim 1, wherein the control part is configured to output the control signal for repeatedly performing the first step and the second step.

5. The apparatus of claim 1, wherein the control part is configured to output the control signal for executing a step of heating the entire substrate on the rotary table by the second heating part at a temperature higher than the highest temperature in the in-plane of the substrate when the in-plane temperature distribution having the concentric shape is formed in the first step, before the substrate subjected to the film forming process is unloaded from the vacuum vessel.

6. A method of forming a film by supplying a process gas to a substrate which is mounted on one surface side of a rotary table installed in a vacuum vessel, the substrate being revolved by a rotation of the rotary table, comprising:

using a first heating part and a second heating part, the second heating part being installed to face the rotary table, corresponding to the substrate mounted on the rotary table;

heating an entire heat treatment region of the substrate in the vacuum vessel by the first heating part;

setting a rotation position of the rotary table such that the substrate on the rotary table is placed in a position corresponding to the second heating part and forming an in-plane temperature distribution having a concentric shape on the substrate by heating the substrate by the second heating part; and

performing a film forming process by supplying a process gas to the substrate by rotating the rotary table in a state where a heating energy received by the substrate from the second heating part is smaller than that in the first step.

7. A non-transitory computer-readable recording medium storing a program for use in a film-forming processing apparatus for performing a film formation by supplying a process gas to a substrate which is mounted on one surface side of a rotary table installed in a vacuum vessel, the substrate being revolved by a rotation of the rotary table,

wherein the program has groups of steps organized to execute the method of forming a film of claim 6.