BREACH SENSOR

• US 20170010232A1
• Filed: 07/07/2015
• Published: 01/12/2017
• Est. Priority Date: 07/07/2015
• Status: Active Grant

• Current Assignee: NXP B.V. (NXP Semiconductors NV)
• Original Assignee: NXP B.V. (NXP Semiconductors NV)
• Inventors: Nguyen, Viet Hoang, Nenadovic, Nebojsa, Bancken, Pascal, Daamen, Roel
• Granted Patent: US 9,891,183 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: G01N 2021/8854 Grading and classifying of flaws
• CPC Class Codes: G01N 21/8851 Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges G01N21/8806 and G01N21/93 - G01N21/95692 take precedence; optical measurement of dimensions G01B11/00; optical scanning G02B26/10; image transformation G06T3/00; computerised image enhancement G06T5/00; image processing per se for flaw detection G06T7/0002
• CPC Class Codes: G01N 27/223 for determining moisture content, e.g. humidity rain detectors on vehicle windows B60S1/0825
• CPC Class Codes: G01N 27/24 Investigating the presence of flaws
• CPC Class Codes: G06F 21/87 by means of encapsulation, e.g. for integrated circuits
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/57 Protection from inspection, reverse engineering or tampering
• CPC Class Codes: H01L 23/576 using active circuits
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: Y04S 40/20 Information technology specific aspects, e.g. CAD, simulation, modelling, system security

Abstract

One example discloses a breach sensor, comprising: a substrate including an integrated circuit; a passivation layer coupled to the substrate; a breach sensing element coupled to the circuit; wherein the breach sensing element is on a first side of the passivation layer and the substrate is on a second side of the passivation layer; a barrier configured to separate the breach sensing element from an ambient environment; wherein the breach sensing element is responsive to barrier damage.

Claims

1. A breach sensor, comprising:

a substrate including an integrated circuit;

a passivation layer coupled to the substrate;

a breach sensing element coupled to the circuit;

wherein the breach sensing element is on a first side of the passivation layer and the substrate is on a second side of the passivation layer; and

a barrier configured to separate the breach sensing element from an ambient environment;

wherein the breach sensing element is responsive to barrier damage.

2. The breach sensor of claim 1:

wherein the breach sensing element includes a humidity sensing element configured to detect a humidity level change in response to barrier damage.

3. The breach sensor of claim 2:

wherein the humidity sensing element is pre-calibrated with a first humidity level;

further comprising a second humidity sensing element pre-calibrated with a second humidity level, different from the first humidity level; and

wherein the first and second humidity sensing elements are separated by a second barrier;

4. The breach sensor of claim 2:

wherein the humidity sensor includes at least one of;

a capacitive sensing structure or a polyimide.

5. The breach sensor of claim 1:

wherein the barrier is directly bonded to the breach sensing element.

6. The breach sensor of claim 1:

wherein the barrier includes at least one of;

a encapsulation material, a cover, a wrapper, a glue, or a seal.

7. The breach sensor of claim 1:

wherein the barrier damage includes at least one of;

a focused ion beam hole, a de-capping, a shear, a tear, an etch, or a physical attack.

8. The breach sensor of claim 1:

wherein the breach sensor includes a light sensor and the breach sensing element includes a light sensing element configured to detect a photo current change in response to barrier damage.

9. The breach sensor of claim 8:

wherein the light sensor includes an avalanche photodiode.

10. The breach sensor of claim 1:

wherein the circuit, in response to the barrier damage, is configured to at least one of;

damage the circuit, erase a memory, transmit an alert, enter a decoy mode, or blow a fuse.

11. The breach sensor of claim 1:

further comprising an antenna coupled to the circuit and configured to transmit a breach signal in response to barrier damage.

12. The breach sensor of claim 1:

wherein the breach sensor includes a light sensor and the breach sensing element includes a light sensing element configured to generate power in response to barrier damage.

13. The breach sensor of claim 12:

wherein the circuit is coupled to receive the power generated by the light sensor.

14. The breach sensor of claim 1:

further comprising a second breach sensing element, proximate to the first breach sensing element; and

wherein the two breach sensing elements are separated by a second barrier configured to separate the second breach sensing element from the first breach sensing element.

15. The breach sensor of claim 14:

wherein the two breach sensors are at least one of;

stacked or side-by-side.

16. An article of manufacture including at least one non-transitory, tangible machine readable storage medium containing executable machine instructions for breach sensing, comprising:

wherein the article includes,

a substrate including an integrated circuit;

a passivation layer coupled to the substrate;

a breach sensing element coupled to the circuit;

wherein the breach sensing element is on a first side of the passivation layer and the substrate is on a second side of the passivation layer;

a barrier configured to separate the breach sensing element from an ambient environment;

wherein the breach sensing element is responsive to barrier damage; and

wherein the instructions include,

monitoring an output signal of the breach sensing element; and

detecting a change in the output signal in response to barrier damage.

17. The article of claim 16, wherein the monitoring instruction includes:

monitoring at least one of a humidity level change or a photo current change in response to barrier damage.

18. The article of claim 16, wherein in response to the barrier damage the instructions include at least one of:

damaging the circuit;

erasing a memory;

transmitting an alert;

placing the circuit into a decoy mode;

or

blowing a fuse.

19. The article of claim 16, wherein the instructions include:

distinguishing between barrier damage due to at least one of;

a focused ion beam hole, a de-capping, a shear, a tear, an etch, or a physical attack.

20. The article of claim 16:

wherein the breach sensor includes a light sensor; and

wherein the instructions includes generating power with the light sensor in response to barrier damage.