Method of Bonding a Metallic Component to a Non-Metallic Component Using a Compliant Material

• US 20170015596A1
• Filed: 01/21/2015
• Published: 01/19/2017
• Est. Priority Date: 01/24/2014
• Status: Active Grant

• Current Assignee: Rtx Corporation
• Original Assignee: United Technologies Corporation (Rtx Corporation)
• Inventors: Fisk, Benjamin T., Cook, Grant O. III
• Granted Patent: US 9,969,654 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: B23K 20/02 by means of a press ; Diffusion bonding B23K20/001, B23K20/04 take precedence
• CPC Class Codes: B23K 20/021 Isostatic pressure welding
• CPC Class Codes: B23K 20/04 by means of a rolling mill
• CPC Class Codes: B23K 20/16 with interposition of special material to facilitate connection of the parts, e.g. material for absorbing or producing gas
• CPC Class Codes: B23K 20/2333 one layer being aluminium, magnesium or beryllium
• CPC Class Codes: B23K 2103/16 Composite materials , e.g. fibre reinforced
• CPC Class Codes: B32B 15/04 comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material next to a bituminous or tarry layer B32B11/08; next to a water-setting substance layer B32B13/06; next to a glass layer B32B17/061; next to a cellulosic plastic layer B32B23/042
• CPC Class Codes: B32B 2311/24 Aluminium
• CPC Class Codes: B32B 2315/02 Ceramics
• CPC Class Codes: B32B 2605/18 Aircraft
• CPC Class Codes: B32B 7/04 Interconnection of layers
• CPC Class Codes: C04B 2237/121 based on aluminium
• CPC Class Codes: C04B 2237/60 Forming at the joining interface or in the joining layer specific reaction phases or zones, e.g. diffusion of reactive species from the interlayer to the substrate or from a substrate to the joining interface, carbide forming at the joining interface
• CPC Class Codes: C04B 37/026 consisting of metals or metal salts

Abstract

A means for attaching a metallic component to a non-metallic component using a compliant material having thermal properties intermediate those of the metallic component to a non-metallic component is provided. The method can accommodate CTE mismatches and wear-type problems common to many assemblies of dissimilar materials. In particular, the method provides a sufficient wear surface to accommodate relative motion and provide a durable wear surface that does not excessively wear/gall/mico-weld itself together and provides the necessary damping and motion for proper operation in aeronautical applications.

Claims

1. A method of bonding a metallic component to a non-metallic component comprising the steps of:

applying a compliant material between the metallic component and the non-metallic component to create an assembly, the compliant material having one or more thermal properties intermediate those of the metallic component and the non-metallic component;

heating the assembly to a first temperature suitable to temporarily liquefy the compliant material without melting the metallic component; and

bonding the metallic component and the non-metallic component by maintaining the assembly at a bonding temperature until the compliant material forms a solid bonding layer, wherein the bonding layer has a higher melting point than the first temperature.

2. The method of claim 1 wherein:

the compliant material is applied by a process selected from the group consisting of foil layup, powder application, plating, chemical vapor deposition, physical vapor deposition, cold spraying, and plasma spraying.

3. The method of claim 1 wherein:

the heating step is accomplished by a process selected from the group consisting of radiation, conduction, radio-frequency induction, resistance, laser, and infrared heating.

4. The method of claim 1 wherein:

during the bonding step the compliant material diffuses into both the metallic component and into the non-metallic component.

5. The method of claim 1 wherein:

during the bonding step the compliant material is precipitation hardened by holding the assembly at a hardening temperature lower than the first temperature for a specified period of time.

6. The method of claim 1 wherein:

one of the one or more thermal properties is the coefficient of thermal expansion.

7. The method of claim 6 wherein:

the non-metallic component is a ceramic matrix composite.

8. The method of claim 1 wherein:

the compliant material consists essentially of a single thin homogenous interlayer.

9. The method of claim 8 wherein:

the interlayer is a selected from the group consisting of a thin foil, a powder and a paste.

10. The method of claim 9 wherein:

the interlayer is a thin foil of aluminum.

11. The method of claim 1 wherein the compliant material comprises a multi-layer interlayer, the method comprising the additional step of:

homogenizing the compliant material that forms the bond by maintaining the assembly at a suitable second temperature.

12. The method of claim 11 wherein:

the second temperature is different from the first temperature.

13. The method of claim 3 wherein:

the metallic component is a platform and the non-metallic component is a vane or fin structure mountable to the platform.

14. A bonded assembly comprising:

a metallic component;

a non-metallic component; and

a compliant material located in a bonding region between the metallic component and the non-metallic component, the compliant material having one or more thermal properties intermediate those of the metallic component and the non-metallic component.

15. The bonded assembly of claim 14 wherein:

one of the one or more thermal properties is the coefficient of thermal expansion.

16. The bonded assembly of claim 15 wherein:

the non-metallic component is a ceramic matrix composite.

17. The bonded assembly of claim 15 wherein:

the compliant material consists essentially of a single thin homogenous interlayer.

18. The bonded assembly of claim 17 wherein:

the interlayer is a selected from the group consisting of a thin foil, a powder and a paste.

19. The bonded assembly of claim 18 wherein:

the interlayer is a thin foil of aluminum.

20. A method of joining a metallic component to a non-metallic component made of ceramic matrix composite material, the method comprising the steps of:

providing a compliant material having a coefficient of thermal expansion intermediate the coefficient of thermal expansions of the metallic component and the non-metallic component;

placing the compliant material between the metallic component and the non-metallic component to create an assembly;

liquefying the compliant material at a first temperature; and

bonding the metallic component to the non-metallic component by maintaining the assembly at a temperature at which the compliant material forms a diffusion bond with both the metallic component and the non-metallic component.