EXTREME EDGE SHEATH AND WAFER PROFILE TUNING THROUGH EDGE-LOCALIZED ION TRAJECTORY CONTROL AND PLASMA OPERATION

• US 20170018411A1
• Filed: 03/10/2016
• Published: 01/19/2017
• Est. Priority Date: 07/13/2015
• Status: Active Grant

• Current Assignee: Lam Research Corporation
• Original Assignee: Lam Research Corporation
• Inventors: Kamp, Tom A., Sriraman, Saravanapriyan, Paterson, Alexander
• Granted Patent: US 10,163,610 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01J 37/3211 Antennas, e.g. particular shapes of coils
• CPC Class Codes: H01J 37/32495 Means for protecting the vessel against plasma
• CPC Class Codes: H01J 37/32541 Shape
• CPC Class Codes: H01J 37/32568 Relative arrangement or disposition of electrodes; moving means
• CPC Class Codes: H01J 37/32577 Electrical connecting means
• CPC Class Codes: H01J 37/32642 Focus rings
• CPC Class Codes: H01J 37/32697 Electrostatic control
• CPC Class Codes: H01J 37/32715 Workpiece holder

Abstract

An edge ring assembly for a plasma processing chamber is provided, including: an edge ring configured to surround an electrostatic chuck (ESC) that is configured for electrical connection to a first RF power supply, the ESC having a top surface for supporting a substrate and an annular step surrounding the top surface, the annular step defining an annular shelf that is lower than the top surface; an annular electrode disposed below the edge ring in the annular step and above the annular shelf; a dielectric ring disposed below the annular electrode for isolating the annular electrode from the ESC, the dielectric ring positioned in the annular step over the annular shelf; and, a plurality of insulated connectors disposed through the ESC and through the dielectric ring, each of the plurality of insulated connectors providing electrical connection between a second RF power supply and the annular electrode.

Claims

1. An edge ring assembly for a plasma processing chamber, comprising:

an edge ring configured to surround an electrostatic chuck (ESC) that is configured for electrical connection to a first RF power supply, the ESC having a top surface for supporting a substrate and an annular step surrounding the top surface, the annular step defining an annular shelf that is lower than the top surface;

an annular electrode disposed below the edge ring and above the annular shelf;

a dielectric ring disposed below the annular electrode for isolating the annular electrode from the ESC, the dielectric ring positioned over the annular shelf; and

a plurality of insulated connectors disposed through the ESC and through the dielectric ring, each of the plurality of insulated connectors providing electrical connection between a second RF power supply and the annular electrode.

2. The edge ring assembly of claim 1, wherein each of the plurality of insulated connectors is defined by a coaxial connector.

3. The edge ring assembly of claim 1, wherein the plurality of insulated connectors are configured to isolate the second RF power supply from the first RF power supply.

4. The edge ring assembly of claim 1, wherein the edge ring has a top surface, the top surface of the edge ring having a stepped edge defined at an inner diameter of the edge ring, a lower portion of the stepped edge is configured to sit at a lower height than the top surface of the ESC, such that the substrate when present extends over the lower portion of the stepped edge.

6. The edge ring assembly of claim 1, wherein application of RF power to the annular electrode during plasma processing causes a plasma sheath that is defined during the plasma processing to be radially extended in a spatial region that is defined substantially over the edge ring.

7. The edge ring assembly of claim 6, wherein the application of RF power to the annular electrode during plasma processing reduces ion focusing at an edge region of the substrate.

8. The edge ring assembly of claim 7, wherein the application of RF power to the annular electrode during plasma processing reduces tilting of ion trajectories at the edge region of the substrate away from normal to a top surface of the substrate.

9. The edge ring of assembly of claim 1, wherein the annular electrode has a radial width of about 5 to 28 millimeters.

10. The edge ring assembly of claim 1, wherein the annular electrode has a thickness of about 0.5 mm to 5 millimeters.

11. The edge ring assembly of claim 1, wherein the annular electrode is defined by a plurality of concentric electrodes, each of the plurality of concentric electrodes being electrically connected to the second RF power supply.

12. The edge ring assembly of claim 1, wherein the annular electrode is defined by a mesh-like structure of a conductive material.

13. The edge ring assembly of claim 1, wherein the annular electrode is integrated with the edge ring.

14. The edge ring assembly of claim 1, wherein the annular electrode has a radial width that is at least as wide as a radial width of the edge ring.

5. The edge ring assembly of claim 5, wherein at least a portion of the annular electrode is disposed below the stepped edge of the edge ring.

15. A system for plasma processing, comprising:

a process chamber;

an electrostatic chuck (ESC) disposed in the process chamber, the ESC having a top surface that is configured to support a substrate during plasma processing, the ESC further including an annular step surrounding the top surface, the annular step defining an annular shelf at a lower height than the top surface, the annular shelf configured to accommodate an edge ring assembly, the edge ring assembly including an edge ring configured to surround the ESC, an annular electrode disposed below the edge ring, and a dielectric ring disposed below the annular electrode and over the annular shelf;

a bias electrode disposed within the ESC, the bias electrode configured to receive RF power from a first RF power supply to generate a bias voltage on the substrate;

a plurality of insulated connectors disposed through the ESC, the plurality of insulated connectors configured to be disposed through the dielectric ring, each of the plurality of insulated connectors configured to provide electrical connection between a second RF power supply and the annular electrode.

16. The system of claim 15, wherein each of the plurality of insulated connectors is defined by a coaxial connector.

17. The system of claim 15, wherein the plurality of insulated connectors are configured to isolate the second RF power supply from the first RF power supply.

18. A system for plasma processing, comprising:

a process chamber;

an electrostatic chuck (ESC) disposed in the process chamber, the ESC having a top surface that is configured to support a substrate during plasma processing, the ESC further including an annular step surrounding the top surface, the annular step defining an annular shelf at a lower height than the top surface, the annular shelf configured to accommodate an edge ring assembly, the edge ring assembly including an edge ring configured to surround the ESC, the edge ring assembly further including a dielectric ring;

a bias electrode disposed within the ESC, the bias electrode configured to receive RF power from a first RF power supply to generate a bias voltage on the substrate;

an annular electrode disposed within the ESC, the annular electrode being disposed below a peripheral region of the top surface of the ESC; and

a plurality of insulated connectors disposed through the ESC, each of the plurality of insulated connectors configured to provide electrical connection between a second RF power supply and the annular electrode;

wherein the dielectric ring is disposed below the annular electrode and over the annular shelf.

19. The system of claim 18, wherein the annular electrode and the plurality of insulated connectors are configured to isolate the second RF power supply from the first RF power supply.

20. The system of claim 18, wherein a first portion of the annular electrode is disposed below the substrate when present on the top surface of the ESC, and wherein a second portion of the annular electrode extends radially beyond a diameter of the substrate.

21. The system of claim 18, wherein the first RF power supply and the second RF power supply are configured to provide respective RF powers at a predefined phase angle difference.