Underfill Material, Laminated Sheet and Method for Producing Semiconductor Device
First Claim
1. An underfill material, whereina melt viscosity at 150°
- C. before heating treatment is 50 Pa·
s or more and 3,000 Pa·
s or less,a viscosity change rate represented by (η
2/η
1)×
100% is 500% or less, where ri1 is a melt viscosity at 150°
C. before heating treatment and η
2 is a melt viscosity at 150°
C. after heating treatment at 130°
C. for 1 hour, anda reaction rate represented by {(Qt−
Qh)/Qt}×
100% is 90% or more, where Qt is a total calorific value in a process of temperature rise from −
50°
C. to 300°
C. and Qh is a total calorific value in a process of temperature rise from −
50°
C. to 300°
C. after heating at 175°
C. for 2 hours in a DSC measurement.
1 Assignment
0 Petitions
Accused Products
Abstract
An underfill material having sufficient curing reactivity, and capable of achieving a small change in viscosity and good electrical connection even when loaded with thermal history, a laminated sheet including the underfill material, and a method for manufacturing a semiconductor device. The underfill material has a melt viscosity at 150° C. before heating treatment of 50 Pa·s or more and 3,000 Pa·s or less, a viscosity change rate of 500% or less, at 150° C. as a result of the heating treatment, and a reaction rate represented by {(Qt−Qh)/Qt}×100% of 90% or more, where Qt is a total calorific value in a process of temperature rise from −50° C. to 300° C. and Qh is a total calorific value in a process of temperature rise from −50° C. to 300° C. after heating at 175° C. for 2 hours in a DSC measurement.
10 Citations
6 Claims
-
1. An underfill material, wherein
a melt viscosity at 150° - C. before heating treatment is 50 Pa·
s or more and 3,000 Pa·
s or less,a viscosity change rate represented by (η
2/η
1)×
100% is 500% or less, where ri1 is a melt viscosity at 150°
C. before heating treatment and η
2 is a melt viscosity at 150°
C. after heating treatment at 130°
C. for 1 hour, anda reaction rate represented by {(Qt−
Qh)/Qt}×
100% is 90% or more, where Qt is a total calorific value in a process of temperature rise from −
50°
C. to 300°
C. and Qh is a total calorific value in a process of temperature rise from −
50°
C. to 300°
C. after heating at 175°
C. for 2 hours in a DSC measurement. - View Dependent Claims (2, 3, 4, 5, 6)
- C. before heating treatment is 50 Pa·
Specification