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Underfill Material, Laminated Sheet and Method for Producing Semiconductor Device

  • US 20170018472A1
  • Filed: 02/20/2015
  • Published: 01/19/2017
  • Est. Priority Date: 03/07/2014
  • Status: Active Grant
First Claim
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1. An underfill material, whereina melt viscosity at 150°

  • C. before heating treatment is 50 Pa·

    s or more and 3,000 Pa·

    s or less,a viscosity change rate represented by (η

    2/η

    1)×

    100% is 500% or less, where ri1 is a melt viscosity at 150°

    C. before heating treatment and η

    2 is a melt viscosity at 150°

    C. after heating treatment at 130°

    C. for 1 hour, anda reaction rate represented by {(Qt−

    Qh)/Qt}×

    100% is 90% or more, where Qt is a total calorific value in a process of temperature rise from −

    50°

    C. to 300°

    C. and Qh is a total calorific value in a process of temperature rise from −

    50°

    C. to 300°

    C. after heating at 175°

    C. for 2 hours in a DSC measurement.

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