LAYERED HEAT PIPE STRUCTURE FOR COOLING ELECTRONIC COMPONENT

• US 20170023306A1
• Filed: 07/22/2015
• Published: 01/26/2017
• Est. Priority Date: 07/22/2015
• Status: Abandoned Application

• Current Assignee: Compulab Ltd.
• Original Assignee: Compulab Ltd.
• Inventors: STAVI, Irad, Yampolsky, Gideon (Genady)
• Application Number:
  US14/806,018
• Publication Number:
  US 20170023306A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: F28D 15/0233 the conduits having a particular shape, e.g. non-circular cross-section, annular F28D15/0241, F28D15/0266 take precedence
• CPC Class Codes: F28D 15/0275 Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
• CPC Class Codes: F28D 15/04 with tubes having a capillary structure
• CPC Class Codes: F28D 2015/0216 having particular orientation, e.g. slanted, or being orientation-independent
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445

Abstract

A structure for transferring heat from a heat producing element to a heat sink includes a first layer including a first flat heat pipe array of a substantially parallel and adjacent heat pipes for conveying heat substantially along a first array axis and configured to be thermally coupled to the heat producing element. A second layer includes a second flat heat pipe array of substantially parallel and adjacent heat pipes for conveying heat substantially along a second array axis. The first flat heat pipe array and the second flat heat pipe array partially overlap and are in thermal contact. The first array axis and the second array axis form a nonzero angle, so that the second flat heat pipe array extends beyond the first flat heat pipe array. The second flat heat pipe array is configured to be thermally coupled to the heat sink.

Claims

1. A structure for transferring heat from a heat producing element to a heat sink, the structure comprising:

a first layer comprising a first flat heat pipe array of a plurality of substantially parallel and adjacent heat pipes for conveying heat substantially along a first array axis and configured to be thermally coupled to the heat producing element; and

a second layer comprising a second flat heat pipe array of a plurality of substantially parallel and adjacent heat pipes for conveying heat substantially along a second array axis,

wherein the first flat heat pipe array and the second flat heat pipe array partially overlap and are in thermal contact, the first array axis and the second array axis forming a nonzero angle, so that the second flat heat pipe array extends beyond the first flat heat pipe array, the second flat heat pipe array configured to be thermally coupled to the heat sink.

2. The structure of claim 1, wherein the second array axis is substantially perpendicular to the first array axis.

3. The structure of claim 1, wherein thermal coupling between the first flat heat pipe array and the heat producing element comprises a heat conducting plate.

4. The structure of claim 1, wherein the first array axis is configured to be substantially horizontal when the heat producing element is in operation.

5. The structure of claim 1, configured such that the second array axis is substantially vertical when the heat producing element is in operation.

6. The structure of claim 1, wherein the first flat heat pipe array comprises a central region that is configured to be thermally coupled to the heat producing element, and wherein the second flat heat pipe array overlaps an end region of the first flat heat pipe array.

7. The structure of claim 6, wherein the second layer comprises two flat heat pipe arrays, each of the two flat heat pipe arrays overlapping and in thermal contact with a different end regions of the first flat heat pipe array.

8. The structure of claim 1, wherein an interface at the thermal contact between the second flat heat pipe array and the first flat heat pipe array includes a thermal interface material.

9. The structure of claim 9, wherein the thermal interface material comprises a thermal adhesive.

10. An assembly comprising:

a heat producing element;

a heat sink; and

a structure for transferring heat from the heat producing element to the heat sink, the structure comprising;

a first layer comprising a first flat heat pipe array of a plurality of substantially parallel and adjacent heat pipes for conveying heat substantially along a first array axis from a first region of said at least one first flat heat pipe array that is thermally coupled to the heat producing element, to a second region of the first flat heat pipe array; and

a second layer comprising at least one second flat heat pipe array of a plurality of substantially parallel and adjacent heat pipes for conveying heat substantially along a second array axis that forms a nonzero angle with the first array axis, the second flat heat array overlapping and in thermal contact with the second region of the first flat heat pipe array and thermally coupled to the heat sink.

11. The assembly of claim 10, wherein the second array axis is substantially perpendicular to the first array axis.

12. The assembly of claim 10, further comprising a heat conducting plate, one face of which is in thermal contact with the heat producing element, and another face of which is in thermal contact with the first region the first flat heat pipe array.

13. The assembly of claim 12, wherein an interface of thermal contact between the heat conducting plate and the heat producing element comprises an uncured thermal interface material.

14. The assembly of claim 10, wherein the heat producing element is held in a socket of a circuit board.

15. The assembly of claim 10, configured such that the first array axis is substantially horizontal and the second array axis is substantially vertical when the assembly is operating.

16. The assembly of claim 10, wherein the heat sink is configured to be passively cooled.

17. The assembly of claim 16, wherein the heat sink comprises a plurality of channels configured to produce an internal flow of air when heat is conveyed from the heat producing element to the heat sink and when the channels are substantially vertical.

18. The assembly of claim 10, wherein a length of said at least one second flat heat pipe array is substantially equal to a length of the heat sink.

19. The assembly of claim 10, wherein the first region of the first flat heat pipe array comprises a central region of the first flat heat pipe array, the second region of the first flat heat pipe array comprises an end region of the first flat heat pipe array.

20. The assembly of claim 19, wherein said at least one second flat heat pipe array comprises two flat heat pipe arrays, each of the two flat heat pipe arrays overlapping and in thermal contact with a different end region of the first flat heat pipe array.