ELECTRONIC APPARATUS

• US 20170023988A1
• Filed: 01/19/2016
• Published: 01/26/2017
• Est. Priority Date: 07/22/2015
• Status: Abandoned Application

• Current Assignee: Celestica Technology Consultancy (Shanghai) Co., Ltd.
• Original Assignee: Celestica Technology Consultancy (Shanghai) Co., Ltd.
• Inventors: Dao, Hank, HUANG, SHAOSONG, WANG, YU
• Application Number:
  US15/000,779
• Publication Number:
  US 20170023988A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: G06F 1/18 Packaging or power distribution
• CPC Class Codes: G06F 1/181 Enclosures for portable computers G06F1/1613
• CPC Class Codes: G06F 1/185 Mounting of expansion boards
• CPC Class Codes: G06F 1/20 Cooling means
• CPC Class Codes: G06F 1/26 Power supply means, e.g. regulation thereof for memories G11C
• CPC Class Codes: G06F 13/4022 using switching circuits, e.g. switching matrix, connection or expansion network G06F13/4009 takes precedence
• CPC Class Codes: G06F 13/4068 Electrical coupling
• CPC Class Codes: G06F 13/4282 on a serial bus, e.g. I2C bus, SPI bus on daisy chain buses G06F13/4247
• CPC Class Codes: G06F 2213/0042 Universal serial bus [USB]
• CPC Class Codes: G06F 2213/3802 Harddisk connected to a computer port
• CPC Class Codes: G06F 2213/3812 USB port controller
• CPC Class Codes: G06F 2213/4004 Universal serial bus hub with a plurality of upstream ports
• CPC Class Codes: H02J 9/00 Circuit arrangements for emergency or stand-by power supply, e.g. for emergency lighting
• CPC Class Codes: H05K 5/0217 Mechanical details of casings covers, lids, hoods or members for covering apertures H05K5/03
• CPC Class Codes: H05K 7/026 Multiple connections subassemblies
• CPC Class Codes: H05K 7/1487 Blade assemblies, e.g. blade cases or inner arrangements within a blade
• CPC Class Codes: H05K 7/20736 within cabinets for removing heat from server blades

Abstract

The present invention relates to an electronic apparatus, which lays out an I/O module and a power supply module in a case reasonably and neatly, and specifically causes the I/O module and the power supply module to be set in a first receiving space of the case with equal height and equal length, so that more modules can be laid out in a limited case space, thus having a high utilization rate and a low cost; moreover, the I/O module and the power supply module are separately designed, and the modules cooperate with each other; the modules are snap structures, and can be assembled and disassembled by hand, which increases operation and maintenance efficiency.

Claims

1. An electronic apparatus, comprising:

a case comprising two sidewalls and a bottom plate connecting the two sidewalls, the case having a first end along a direction of the two sidewalls and a second end opposite the first end, the case having a first receiving space adjacent to the first end, and the first receiving space being divided into multiple front-end regions;

multiple I/O modules respectively received in the front-end region in the first receiving space, whose length direction is parallel to the direction of the sidewalls; and

a power supply module received, flush with the I/O module, in the front-end region in the first receiving space, whose length direction is parallel to the direction of the sidewalls, providing power for the electronic apparatus.

2. The electronic apparatus as in claim 1, wherein the I/O module comprises a node I/O module and a shared I/O module.

3. The electronic apparatus as in claim 2, wherein heights of the node I/O module, the shared I/O module and the power supply module are the same as that of the front-end regions, which are respectively received in the corresponding front-end region.

4. The electronic apparatus as in claim 3, wherein there are an even number of node I/O modules, which are disposed in the corresponding front-end regions bilaterally symmetrical relative to the shared I/O module.

5. The electronic apparatus as in claim 4, wherein the number of the node I/O modules is four, the number of the shared I/O module is one, and the node I/O modules, the shared I/O module and the power supply module are disposed in the front-end regions from left to right or from right to left in a sequence as follows:

the power supply module, two node I/O modules, the shared I/O module, two node I/O modules.

6. The electronic apparatus as in claim 1, wherein the power supply module comprises two power supply units, the number of the power supply units is two, and one of the two power supply units is a power supply unit that provides redundant backup.

7. The electronic apparatus as in claim 6, wherein the power supply units in the power supply module are stacked in the front-end region.

8. The electronic apparatus as in claim 1, wherein the shared I/O module comprises two shared I/O units, the number of the shared I/O units is two, and one of the two shared I/O units is a shared I/O unit that provides redundant backup.

9. The electronic apparatus as in claim 8, wherein the two shared I/O units of the shared I/O module are stacked in the front-end region.

10. The electronic apparatus as in claim 2, wherein lengths of the node I/O module, the shared I/O module and the power supply module are the same, and correspond to the length of the front-end region.

11. The electronic apparatus as in claim 1, wherein the size of the electronic apparatus is 2U.