Secure Printed Memory

• US 20170024330A1
• Filed: 10/03/2016
• Published: 01/26/2017
• Est. Priority Date: 02/15/2011
• Status: Abandoned Application

• Current Assignee: ChengDu HaiCun IP Technology LLC
• Original Assignee: ChengDu HaiCun IP Technology LLC
• Inventors: ZHANG, Guobiao
• Application Number:
  US15/284,527
• Publication Number:
  US 20170024330A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: G06F 12/1408 by using cryptography for digital transmission H04L9/00
• CPC Class Codes: G06F 21/79 in semiconductor storage media, e.g. directly-addressable memories
• CPC Class Codes: G06F 2212/402 Encrypted data
• CPC Class Codes: G11C 16/22 Safety or protection circuits preventing unauthorised or accidental access to memory cells
• CPC Class Codes: G11C 17/14 in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM
• CPC Class Codes: G11C 17/143 using laser-fusible links
• CPC Class Codes: G11C 17/16 using electrically-fusible links
• CPC Class Codes: H01L 2224/48145 the bodies being stacked
• CPC Class Codes: H01L 2225/06506 Wire or wire-like electrical connections between devices
• CPC Class Codes: H01L 25/0657 Stacked arrangements of devices
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H10B 20/00 Read-only memory [ROM] devices
• CPC Class Codes: H10B 20/20 Programmable ROM [PROM] devices comprising field-effect components H10B20/10 takes precedence

Abstract

The present invention discloses a secure printed memory. It comprises a laser-programmable read-only memory (LP-ROM) which stores at least a key. The key is written during manufacturing and different LP-ROMs store different keys. The output of the secure printed memory is encrypted with the key stored in the LP-ROM and is different for different devices. Compromising a single device does not compromise other devices.

Claims

1. A secure printed memory in a secure printed-memory family, comprising:

a semiconductor substrate;

a printed memory formed on said semiconductor substrate for storing content data, wherein said content data are same for all devices in said secure printed-memory family;

a laser-programmable read-only-memory (LP-ROM) formed on said semiconductor substrate for storing at least a key, wherein said key is written during manufacturing and different LP-ROMs store different keys;

an encryption circuit formed on said semiconductor substrate for encrypting said content data in said printed memory with said key in said LP-ROM;

wherein the output of said secure printed memory is the encrypted content data from said encryption circuit and is different for different devices in said secure printed-memory family.

2. The secure printed memory according to claim 1, wherein said printed memory is a mask-programmed read-only memory (mask-ROM).

3. The secure printed memory according to claim 1, wherein said printed memory is an imprinted memory.

4. The secure printed memory according to claim 1, wherein said LP-ROM stores a plurality of keys.

5. The secure printed memory according to claim 4, wherein said secure printed memory further comprises a key-selection logic for selecting at least a key from said plurality of keys.

6. The secure printed memory according to claim 5, wherein said encryption circuit provides file-dependent encryption.

7. The secure printed memory according to claim 6, wherein said key-selection logic selects said key base on file.

8. The secure printed memory according to claim 5, wherein said encryption circuit provides time-variant encryption.

9. The secure printed memory according to claim 8, wherein said key-selection logic selects said key base on time.

10. A secure three-dimensional printed memory (3D-P) in a secure 3D-P family, comprising:

a semiconductor substrate;

at least a printed-memory level stacked above and coupled to said semiconductor substrate, said printed-memory level storing content data, wherein said content data are same for all devices in said 3D-P family;

a laser-programmable read-only-memory (LP-ROM) between said printed-memory level and said semiconductor substrate, said LP-ROM storing at least a key, wherein said key is written during manufacturing and different LP-ROMs store different keys;

an encryption circuit formed on said semiconductor substrate for encrypting said content data in said printed-memory level with said key in said LP-ROM;

wherein the output of said secure printed memory is the encrypted content data from said encryption circuit and is different for different devices in said secure 3D-P family.

11. The secure 3D-P according to claim 10, wherein said printed-memory level comprises a printed-memory array.

12. The secure 3D-P according to claim 11, wherein said printed-memory array covers at least a portion of said LP-ROM.

13. The secure 3D-P according to claim 10, wherein said 3D-P is a three-dimensional mask-programmed read-only memory (3D-MPROM).

14. The secure 3D-P according to claim 10, wherein said 3D-P is a three-dimensional imprinted memory.

15. The secure 3D-P according to claim 10, wherein said LP-ROM stores a plurality of keys.

16. The secure 3D-P according to claim 15, wherein said secure printed memory further comprises a key-selection logic for selecting at least a key from said plurality of keys.

17. The secure 3D-P according to claim 16, wherein said encryption circuit provides file-dependent encryption.

18. The secure 3D-P according to claim 17, wherein said key-selection logic selects said key base on file.

19. The secure 3D-P according to claim 16, wherein said encryption circuit provides time-variant encryption.

20. The secure 3D-P according to claim 19, wherein said key-selection logic selects said key base on time.