HOUSING ASSEMBLY OF A POWER OPERATED DEVICE AND METHOD OF MANUFACTURING THEREOF

• US 20170027070A1
• Filed: 06/29/2016
• Published: 01/26/2017
• Est. Priority Date: 07/23/2015
• Status: Abandoned Application

• Current Assignee: Magna Closures Inc (Magna International Incorporated)
• Original Assignee: Magna Closures Inc (Magna International Incorporated)
• Inventors: Siddiqui, Abdullah, Guillermo, Neil, Okeke, Uzochukwu, Woo, Kar Wang
• Application Number:
  US15/196,086
• Publication Number:
  US 20170027070A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: E05B 81/06 using rotary motors
• CPC Class Codes: E05B 81/54 Electrical circuits for locking several wings simultaneously E05B77/48
• CPC Class Codes: E05B 81/64 Monitoring or sensing, e.g. by using switches or sensors
• CPC Class Codes: E05B 85/02 Lock casings
• CPC Class Codes: H02K 5/04 Casings or enclosures characterised by the shape, form or construction thereof
• CPC Class Codes: H02K 5/08 Insulating casings
• CPC Class Codes: H02K 5/225 Terminal boxes or connection arrangements specially adapted for submersible motors H02K5/132
• CPC Class Codes: H05K 2201/0999 Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
• CPC Class Codes: H05K 2203/107 Using laser light
• CPC Class Codes: H05K 3/105 by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
• CPC Class Codes: H05K 3/246 Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating

Abstract

A housing assembly for a power operated device and method of manufacturing the housing assembly are disclosed. The housing assembly includes a housing body with a motor platform and a switch platform and a connector platform each extending upwardly from the housing body. A connector is attached to the housing body in engagement with the connector platform and includes a plurality of connector terminals electrically connected to the connector platform. A plurality of traces are formed by laser directed structuring on the housing body and are electrically connected to and extend from the switch and motor platforms to the connector platform. A motor engages the motor platform for moving components of the power operated device and a switch engages the switch platform to detect the position of the components.

Claims

1. A housing assembly for a power operated device comprising:

a housing body for securing and attaching components of the power operated device;

at least one contact platform coupled to said housing body;

a connector attached to said housing body and defining an inner cavity and including a plurality of connector terminals disposed in said inner cavity; and

a trace substrate coupled to said housing body and including a plurality of traces formed on said trace substrate and electrically connected to and extending from said at least one contact platform to said connector.

2. A housing assembly as set forth in claim 1, wherein said housing body defines a top surface and a bottom surface opposite said top surface and said top surface comprises said trace substrate.

3. A housing assembly as set forth in claim 2, wherein said contact platforms extend upwardly from said top surface of said housing body.

4. A housing assembly as set forth in claim 1, wherein said trace substrate comprises a cartridge disposed on said housing body.

5. A housing assembly as set forth in claim 4, wherein said cartridge has an upper surface and a lower surface and said contact platforms are disposed on said upper surface of said cartridge.

6. A housing assembly as set forth in claim 1, wherein said at least one contact platform includes at least one of a motor platform and a switch platform.

7. A housing assembly as set forth in claim 1, wherein said plurality of traces are formed using laser directed structuring.

8. A housing assembly as set forth in claim 1, wherein said plurality of traces are formed using microscopic integrated processing technology.

9. A housing assembly as set forth in claim 1, wherein said plurality of traces are formed using a protopaint applied to said trace substrate.

10. A housing assembly for a power operated device comprising:

a trace substrate including a plurality of traces formed on said trace substrate by a molded interconnect technology;

a connector coupled to said trace substrate and including a plurality of connector terminals;

a motor platform coupled to said trace substrate for coupling to a motor adapted to electrically connect to said plurality of traces to move components of the power operated device; and

a switch platform coupled to said trace substrate for coupling to a switch adapted to electrically connect to said plurality of traces to detect one of movement and position of the components.

11. A housing assembly as set forth in claim 10, further including a housing body defining a top surface and a bottom surface opposite said top surface and wherein said top surface comprises said trace substrate.

12. A housing assembly as set forth in claim 10, wherein said trace substrate comprises a cartridge.

13. A housing assembly as set forth in claim 10, wherein said molded interconnect technology includes laser directed structuring.

14. A housing assembly as set forth in claim 10, wherein said molded interconnect technology includes microscopic integrated processing technology.

15. A housing assembly as set forth in claim 10, wherein said molded interconnect technology includes the application of protopaint to said trace substrate.

16. A method of manufacturing a housing assembly of a power operated device comprising;

molding a trace substrate,

writing a plurality of conductive paths onto the trace substrate using a laser, and

plating the plurality of conductive paths to form traces.

17. A method as set forth in claim 16, further including the step of applying a protopaint to the trace substrate and wherein the step of writing a plurality of conductive paths onto the trace substrate using a laser includes activating the protopaint with the laser to form a plurality of conductive paths.

18. A method as set forth in claim 16, further including the step of cleaning the trace substrate.

19. A method as set forth in claim 16, wherein the step of plating the conductive paths to form traces is further defined as depositing a layer of nickel and a layer of gold to the plurality of conductive paths to form traces.

20. A method as set forth in claim 16, further including the step of applying an application specific coating including at least one of tin, silver, palladium/gold, and organic solderability preservative.