MULTI-LAYER GROUND SHIELD STRUCTURE OF INTERCONNECTED ELEMENTS

• US 20170033059A1
• Filed: 07/27/2015
• Published: 02/02/2017
• Est. Priority Date: 07/27/2015
• Status: Active Grant

• Current Assignee: Qualcomm, Inc.
• Original Assignee: Qualcomm, Inc.
• Inventors: SONG, Young Kyu, JOW, Uei-Ming, LEE, Jong-Hoon
• Granted Patent: US 9,691,720 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01L 21/765 by field effect H01L21/76264 takes precedence
• CPC Class Codes: H01L 2224/04105 Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
• CPC Class Codes: H01L 2224/12105 Bump connectors formed on an encapsulation of the semiconductor or solid-state body, e.g. bumps on chip-scale packages
• CPC Class Codes: H01L 2224/16145 the bodies being stacked
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/17181 On opposite sides of the body
• CPC Class Codes: H01L 23/49822 Multilayer substrates multilayer metallisation on monolayer substrate H01L23/498
• CPC Class Codes: H01L 23/49838 Geometry or layout
• CPC Class Codes: H01L 23/5225 Shielding layers formed together with wiring layers
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 23/585 comprising conductive layers or plates or strips or rods or rings H01L23/60, H01L23/62, H01L23/64, H01L23/66 take precedence
• CPC Class Codes: H01L 23/645 Inductive arrangements H01L23/647, H01L23/66 take precedence
• CPC Class Codes: H01L 25/0652 the devices being arranged next and on each other, i.e. mixed assemblies
• CPC Class Codes: H01L 28/10 Inductors
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA

Abstract

A multi-layer ground shield structure of interconnected elements is disclosed. The ground shield structure may include a first patterned layer of a ground shield structure, a second patterned layer of the ground shield structure, and a spacer between the first patterned layer and the second patterned layer. The first patterned layer includes first conductive elements interconnected within the first patterned layer according to a first pattern. The second patterned layer includes second conductive elements interconnected within the second patterned layer according to a second pattern.

Claims

1. A device comprising:

a first patterned layer of a ground shield structure, the first patterned layer including first conductive elements interconnected within the first patterned layer according to a first pattern;

a second patterned layer of the ground shield structure, the second patterned layer including second conductive elements interconnected within the second patterned layer according to a second pattern; and

a spacer between the first patterned layer and the second patterned layer.

2. The device of claim 1, wherein the first conductive elements are interconnected to provide a first conductive path that extends between a first side of the first patterned layer and a second side of the first patterned layer.

3. The device of claim 2, wherein the first conductive elements are interconnected such that no conductive path extends between the first side of the first patterned layer and a third side of the first patterned layer.

4. The device of claim 1, wherein the second conductive elements are interconnected to provide a second conductive path that extends between a first side of the second patterned layer and a second side of the second patterned layer, and wherein the second conductive elements are interconnected such that no conductive path extends between the first side of the second patterned layer and a third side of the second patterned layer.

5. The device of claim 1, wherein the first patterned layer includes at least one conductive element that is electrically isolated from the first conductive elements.

6. The device of claim 1, wherein the first patterned layer includes a first plurality of first unit cells and the second patterned layer includes a second plurality of second unit cells.

7. The device of claim 6, wherein each of the first unit cells and each of the second unit cells has a rectangular shape.

8. The device of claim 6, wherein each of the first unit cells and each of the second unit cells has a hexagonal shape.

9. The device of claim 6, wherein the first plurality of unit cells are interconnected to provide a first conductive path that extends between a first side of the first patterned layer and a second side of the first patterned layer across multiple unit cells.

10. The device of claim 9, wherein the second plurality of unit cells are interconnected to provide a second conductive path that extends between a first side of the second patterned layer and a second side of the second patterned layer across multiple unit cells.

11. The device of claim 10, wherein the first conductive path extends generally in a particular direction across the first patterned layer and the second conductive path extends generally in the particular direction across the first patterned layer.

12. The device of claim 10, further comprising a ground connection coupled to the first conductive path and a second ground connection coupled to the second conductive path.

13. The device of claim 1, wherein the spacer electrically isolates the first patterned layer from the second patterned layer.

14. The device of claim 1, wherein the spacer comprises a dielectric material.

15. The device of claim 1, further comprising an apparatus selected from a mobile phone, a computer, a set top box, a music player, a video player, an entertainment unit, a navigation device, a communications device, a personal digital assistant (PDA), and a fixed location data unit into which the first patterned layer and the second patterned layer are integrated.

16. The device of claim 1, further comprising a first component on a first side of the ground shield structure and a second component of a second side of the ground shield structure, wherein the ground shield structure provides electrical isolation between the first component and the second component.

17. The device of claim 16, wherein at least one of the first component or the second component includes an inductor.

18. A computer-readable medium storing instructions that are executable by a processor to perform operations comprising:

initiating formation of a first patterned layer of a ground shield structure, the first patterned layer including first conductive elements interconnected within the first patterned layer according to a first pattern; and

initiating formation of a second patterned layer of the ground shield structure, the second patterned layer including second conductive elements interconnected within the second patterned layer according to a second pattern, wherein a spacer is between the first patterned layer and the second patterned layer.

19. The computer-readable medium of claim 18, wherein formation of the first patterned layer includes depositing conductive material on the spacer to form the first pattern and formation of the second patterned layer includes depositing conductive material on the spacer to form the second pattern.

20. The computer-readable medium of claim 18, wherein operations further comprise causing a plurality of the first conductive elements to be coupled to ground and causing a plurality of the second conductive elements to be coupled to ground.

21. A ground shield structure comprising:

means for conducting charge, the means for conducting charge comprising a first layer of interconnected elements and a second layer of interconnected elements, the first layer of interconnected elements and the second layer of interconnected elements configured to electrically shield a first structure from an electric field associated with a second structure; and

means for impeding conduction of charge, the means for impeding conduction of charge located between the first layer of interconnected elements and the second layer of interconnected elements.

22. The ground shield structure of claim 21, wherein the second structure includes an inductor.

23. The ground shield structure of claim 21, wherein the first layer of interconnected elements and the second layer of interconnected elements are connected to ground.

24. The ground shield structure of claim 21, wherein the means for conducting charge and the means for impeding conduction of charge are integrated in at least one electronic device.

25. A method of forming a ground shield structure, the method comprising:

forming a first patterned layer of the ground shield structure, the first patterned layer including first conductive elements interconnected within the first patterned layer according to a first pattern; and

forming a second patterned layer of the ground shield structure, the second patterned layer including second conductive elements interconnected within the second patterned layer according to a second pattern, wherein a spacer is located between the first patterned layer and the second patterned layer.

26. The method of claim 25, further comprising coupling at least one of the first conductive elements and at least one of the second conductive elements to ground.

27. The method of claim 26, wherein the first conductive elements are interconnected such that an eddy current induced at a first portion of the first patterned layer can flow to ground via a first ground connection and cannot flow to ground via a second ground connection.

28. The method of claim 25, further comprising:

receiving a data file including design information corresponding to an electronic device; and

fabricating the electronic device according to the design information, wherein the electronic device includes the ground shield structure, and wherein fabricating the electronic device includes forming the first patterned layer and forming the second patterned layer.

29. The method of claim 28, wherein the data file has a GDSII format.

30. The method of claim 28, wherein the data file has a GERBER format.