POROUS PLATE-SHAPED FILLER, METHOD FOR PRODUCING SAME, AND HEAT INSULATION FILM

• US 20170036303A1
• Filed: 10/19/2016
• Published: 02/09/2017
• Est. Priority Date: 04/23/2014
• Status: Active Grant

• Current Assignee: NGK Insulators Limited
• Original Assignee: NGK Insulators Limited
• Inventors: ORIBE, Akinobu, TOMITA, Takahiro, KOBAYASHI, Hiroharu
• Granted Patent: US 10,464,287 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: B23K 2103/16 Composite materials , e.g. fibre reinforced
• CPC Class Codes: B23K 2103/18 Dissimilar materials
• CPC Class Codes: B23K 2103/42 Plastics B23K2103/16 takes precedence
• CPC Class Codes: B23K 2103/50 Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
• CPC Class Codes: B23K 2103/52 Ceramics
• CPC Class Codes: B23K 26/0624 using ultrashort pulses, i.e. pulses of 1ns or less
• CPC Class Codes: B23K 26/362 Laser etching
• CPC Class Codes: B23K 26/38 by boring or cutting
• CPC Class Codes: B23K 26/402 involving non-metallic material, e.g. isolators
• CPC Class Codes: B26D 3/08 Making a superficial cut in the surface of the work without removal of material, e.g. scoring, incising
• CPC Class Codes: B32B 5/16 characterised by features of a layer formed of particles, e.g. chips, powder or granules layer formed of natural mineral particles B32B19/00; layer being formed of wood fibres, chips or particles B32B21/02
• CPC Class Codes: B32B 5/30 one layer being formed of particles, e.g. chips, granules, powder
• CPC Class Codes: C01G 25/02 Oxides
• CPC Class Codes: C01P 2004/20 extending in two dimensions, e.g. plate-like
• CPC Class Codes: C01P 2004/22 with a polygonal circumferential shape
• CPC Class Codes: C04B 20/0008 Materials specified by a shape not covered by C04B20/0016 - C04B20/0056, e.g. nanotubes
• CPC Class Codes: C04B 2111/28 Fire resistance, i.e. materials resistant to accidental fires or high temperatures
• CPC Class Codes: C04B 2201/32 for the thermal conductivity, e.g. K-factors
• CPC Class Codes: C04B 2235/3225 Yttrium oxide or oxide-forming salts thereof
• CPC Class Codes: C04B 2235/3246 Stabilised zirconias, e.g. YSZ or cerium stabilised zirconia
• CPC Class Codes: C04B 2235/52 : Constituents or additives characterised by their shapes
• CPC Class Codes: C04B 2235/5276 : Whiskers, spindles, needles or pins
• CPC Class Codes: C04B 2235/5292 : Flakes, platelets or plates
• CPC Class Codes: C04B 2235/5296 : with a defined aspect ratio, e.g. indicating sphericity
• CPC Class Codes: C04B 2235/5436 : micrometer sized, i.e. from 1 to 100 micron
• CPC Class Codes: C04B 2235/6025 : Tape casting, e.g. with a doctor blade
• CPC Class Codes: C04B 2235/6026 : Computer aided shaping, e.g. rapid prototyping
• CPC Class Codes: C04B 2235/612 : Machining
• CPC Class Codes: C04B 2235/6567 : Treatment time
• CPC Class Codes: C04B 2235/77 : Density
• CPC Class Codes: C04B 2235/9607 : Thermal properties, e.g. thermal expansion coefficient
• CPC Class Codes: C04B 35/486 : Fine ceramics
• CPC Class Codes: C04B 35/491 : based on lead zirconates and lead titanates , e.g. PZT
• CPC Class Codes: C04B 35/622 : Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
• CPC Class Codes: C04B 38/0074 : expressed as porosity percentage
• CPC Class Codes: C04B 38/009 : Porous or hollow ceramic granular materials, e.g. microballoons C04B18/027, C04B20/002 take precedence
• CPC Class Codes: C04B 38/02 : by adding chemical blowing agents
• CPC Class Codes: C04B 38/06 : by burning-out added substances by burning natural expanding materials or by sublimating or melting out added substances
• CPC Class Codes: C04B 38/08 : by adding porous substances
• CPC Class Codes: C08G 77/04 : Polysiloxanes
• CPC Class Codes: C08K 2201/016 : Additives defined by their aspect ratio
• CPC Class Codes: C08K 3/22 : of metals
• CPC Class Codes: C08K 7/24 : inorganic
• CPC Class Codes: C08L 83/04 : Polysiloxanes
• CPC Class Codes: C09D 1/00 : Coating compositions, e.g. paints, varnishes or lacquers, based on inorganic substances
• CPC Class Codes: C09D 183/04 : Polysiloxanes
• CPC Class Codes: C09D 201/00 : Coating compositions based on unspecified macromolecular compounds
• CPC Class Codes: C09D 5/00 : Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced electrically insulating plastics, resins or waxes H01B3/30; Filling pastes
• CPC Class Codes: C09D 7/40 : Additives
• CPC Class Codes: C09D 7/61 : inorganic
• CPC Class Codes: F16L 59/00 : Thermal insulation in general
• CPC Class Codes: F16L 59/029 : layered

Abstract

A porous plate-shaped filler of the present invention is a plate shape having an aspect ratio of 3 or more, a surface shape is one of a round shape, an oval and a round-corner polygonal shape, and its minimum length is from 0.1 to 50 μm. Furthermore, a sectional shape is one of an arch shape, an elliptic shape, and a quadrangular shape in which at least a part of corners is rounded. Consequently, it is possible to obtain the heat insulation film in which the porous plate-shaped fillers 1 are easy to be laminated and the heat insulation effect improves.

Claims

1. A porous plate-shaped filler which is a plate shape having an aspect ratio of 3 or more and in which a surface shape is one of a round shape, an oval, and a round-corner polygonal shape and a minimum length is from 0.1 to 50 μ

m.

2. The porous plate-shaped filler according to claim 1,

wherein a radius R of an arc of the round-corner polygonal shape in the surface shape is not less than the minimum length.

3. The porous plate-shaped filler according to claim 1,

wherein a sectional shape is one of an arch shape, an elliptic shape, and a quadrangular shape in which at least a part of corners is rounded.

4. The porous plate-shaped filler according to claim 3,

wherein a radius R of an arc of the quadrangular shape in which at least a part of corners in the sectional shape is rounded is ⅕

or more of the minimum length.

5. The porous plate-shaped filler according to claim 1,

which includes pores having an average pore diameter of 10 to 500 nm.

6. The porous plate-shaped filler according to claim 1,

wherein a thermal conductivity is 1 W/(m·

K) or less.

7. The porous plate-shaped filler according to claim 1,

wherein a heat capacity is from 10 to 3000 kJ/(m³·

K) or less.

8. A method for producing the porous plate-shaped filler according to claim 1, which comprises processing a green sheet made from a material including a component of the porous plate-shaped filler by use of a laser processing machine capable of performing irradiation with laser at a pulse width of 10 picoseconds or less, before or after firing, to form the porous plate-shaped filler having a predetermined surface shape.

9. A method for producing the porous plate-shaped filler according to claim 1, which comprises dropping or discharging slurry made from a material including a component of the porous plate-shaped filler and adjusted into a viscosity of 100 to 10000 cps, to form the porous plate-shaped filler whose sectional shape is one of an arch shape, an elliptic shape, and a quadrangular shape in which at least a part of corners is rounded.

10. The method for producing the porous plate-shaped filler according to claim 9, which comprises dropping or discharging the slurry by use of an ink jet type spotter device.

11. A method for producing the porous plate-shaped filler according to claim 1, which comprises adhering, to an adhering portion having a predetermined shape, slurry made from a material including a component of the porous plate-shaped filler and adjusted into a viscosity of 100 to 10000 cps;

and pressing the adhering portion onto a substrate surface, thereby adhering the slurry adhered to the adhering portion to the substrate surface, to form the porous plate-shaped filler whose sectional shape is one of an arch shape, an elliptic shape, and a quadrangular shape in which at least a part of corners is rounded.

12. The method for producing the porous plate-shaped filler according to claim 11, which comprises adhering the slurry to the substrate surface by use of a needle type dispenser device.

13. A heat insulation film which includes the porous plate-shaped filler according to claim 1.

14. The heat insulation film according to claim 13,

wherein the porous plate-shaped fillers are arranged in the form of layers.

15. The heat insulation film according to claim 13,

wherein a thickness is from 1 μ

m to 5 mm.

16. The heat insulation film according to claim 13,

wherein a thermal conductivity is 1 W/(m·

K) or less.