MOLDED BODY AND ELECTRICAL DEVICE HAVING A MOLDED BODY FOR HIGH VOLTAGE APPLICATIONS

• US 20170040239A1
• Filed: 08/05/2016
• Published: 02/09/2017
• Est. Priority Date: 08/07/2015
• Status: Active Grant

• Current Assignee: Vishay Dale Electronics, LLC (Vishay Intertechnology Incorporated)
• Original Assignee: Vishay Dale Electronics, LLC (Vishay Intertechnology Incorporated)
• Inventors: Glenn, Darin
• Granted Patent: US 9,865,532 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01L 23/3107 the device being completely enclosed
• CPC Class Codes: H01L 23/49562 for devices being provided for in H01L29/00
• CPC Class Codes: H01L 23/49589 Capacitor integral with or on the leadframe

Abstract

An electrical device comprising a ribbed molded body housing an electrical component is provided. The ribbed molded body includes at least one surface or portion having a plurality of ribs along at least a portion of the surface. The electrical component may be a passive or active electrical component. The electrical component may be connected to a lead frame and molded into the ribbed molded body.

Claims

1. An electrical device for high voltage applications, comprising:

an electrical component connected to a first lead and a second lead;

a molded body formed around the electrical component and portions of the first lead and the second lead, the first lead extending from a first side of the molded body, and the second lead extending from a second side of the molded body;

wherein at least one portion of the molded body between the first lead and the second lead comprises a ribbed portion.

2. The electrical device of claim 1, wherein the molded body comprises a top surface, opposite bottom surface, front surface, opposite back surface, left side surface and opposite right side surface, and wherein the ribbed portion comprises at least a portion of one of the top surface, bottom surface, front surface or back surface.

3. The electrical device of claim 1, further comprising a third lead connected to the same side of the electrical component as the second lead.

4. The electrical device of claim 3, wherein the first lead extends from the left side surface and the second lead and the third lead extend from the right side surface.

5. The electrical device of claim 2, wherein at least a portion of the bottom surface comprises a plurality of ribs between the first lead and the second lead.

6. The electrical device of claim 5, wherein at least a portion of the front surface comprises a plurality of ribs between the first lead and the second lead.

7. The electrical device of claim 6, wherein at least a portion of the back surface comprises a plurality of ribs between the first lead and the second lead.

8. The electrical device of claim 7, wherein at least some of the ribs extend contiguously along the front surface, bottom surface, and back surface.

9. The electrical device of claim 8, wherein the top surface is generally flat.

10. The electrical device of claim 1, wherein the electrical device is a passive component or an active component.

11. The electrical device of claim 10, wherein the electrical device is a passive component comprising a resistor, an inductor, a capacitor or a chip divider.

12. The electrical device of claim 10, wherein the electrical device is an active component comprising a diode, semiconductor, rectifier, transistor, or integrated circuit.

13. The electrical device of claim 4, wherein the leads are turned along the first and second side surfaces and along at least portions of the bottom of the device to form a surface mount device.

14. The electrical device of claim 1, wherein the molded body includes a first surface mount portion adjacent the first side surface, and a second surface mount portion adjacent the second side surface, and wherein the first and second surface mount portions do not include ribs.

15. The electrical device of claim 10, wherein the electrical component is mounted on a lead frame comprising at least a first lead and a second lead.

16. The electrical device of claim 15, wherein the molded body encases the electrical component and lead frame, leaving at least portions of the leads exposed.

17. The electrical device of claim 1, wherein the ribbed molded body comprises a material having a comparative tracking index (CTI) of 600V.

18. The electrical device of claim 1, wherein the electrical component has at least two leads.

19. The electrical device of claim 6, further comprising steps formed in the molded body adjacent at least a part of the ribbed portion.

20. A method of making an electrical device for high voltage applications, comprising the steps of:

connecting an electrical component to a lead frame comprising at least two leads;

molding a ribbed molded body comprising at least a ribbed portion around the electrical component and portions of the lead frame, leaving portions of the at least two leads exposed; and

forming the ends of the leads around the ribbed molded body.

21. The method of claim 20, further comprising the step of applying a moisture barrier to a portion of the electrical component prior to molding the ribbed molded body around the electrical component.

22. The method of claim 21, further comprising the step of marking a portion of the ribbed molded body.

23. The method of claim 22, further comprising the step of trimming the lead frame.

24. The method of claim 23, further comprising the step of testing the device.

25. The method of claim 24, wherein the ribbed molded body comprises a material having a comparative tracking index (CTI) of 600V.