ORGANIC LIGHT-EMITTING DIODE PACKAGING STRUCTURE, METHOD FOR PACKAGING ORGANIC LIGHT-EMITTING DIODE, AND DISPLAY DEVICE
First Claim
1. An organic light-emitting diode packaging structure, comprising:
- a display area of an organic light-emitting diode arranged on a substrate;
a cathode pattern arranged on the display area;
a first inorganic blocking layer arranged on the cathode pattern;
a first organic buffer layer arranged on the first inorganic blocking layer, wherein the first organic buffer layer is electrically connected at its edge to the cathode pattern in a peripheral area of the display area; and
a second inorganic blocking layer, wherein the second inorganic blocking layer is connected directly at its edge to the substrate in the peripheral area of the display area, so as to cover all the other layers;
wherein the first inorganic blocking layer and the second inorganic blocking layer are both transparent, and the first organic buffer layer is conductive and transparent.
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Abstract
The present disclosure provides an organic light-emitting diode packaging structure, a method for packaging an organic light-emitting diode and a display device. The packaging structure includes: a display area of an organic light-emitting diode arranged on a substrate; a cathode pattern arranged on the display area; a first inorganic blocking layer arranged on the cathode pattern; an organic buffer layer arranged on the first inorganic blocking layer, wherein the organic buffer layer is electrically connected at its edge to the cathode pattern in a peripheral area of the display area; and a second inorganic blocking layer, wherein the second inorganic blocking layer is connected directly at its edge to the substrate in the peripheral area of the display area, so as to cover all the other layers.
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Citations
20 Claims
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1. An organic light-emitting diode packaging structure, comprising:
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a display area of an organic light-emitting diode arranged on a substrate; a cathode pattern arranged on the display area; a first inorganic blocking layer arranged on the cathode pattern; a first organic buffer layer arranged on the first inorganic blocking layer, wherein the first organic buffer layer is electrically connected at its edge to the cathode pattern in a peripheral area of the display area; and a second inorganic blocking layer, wherein the second inorganic blocking layer is connected directly at its edge to the substrate in the peripheral area of the display area, so as to cover all the other layers; wherein the first inorganic blocking layer and the second inorganic blocking layer are both transparent, and the first organic buffer layer is conductive and transparent. - View Dependent Claims (2, 3, 4, 5, 6, 7, 17, 18, 19, 20)
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8. A method for packaging an organic light-emitting diode, comprising:
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forming a first inorganic blocking layer on a substrate comprising a display area of the organic light-emitting diode on which a cathode pattern is arranged; forming a first organic buffer layer on the first inorganic blocking layer, wherein the first organic buffer layer is electrically connected at its edge to the cathode pattern in a peripheral area of the display area; forming a second inorganic blocking layer, wherein the second inorganic blocking layer is connected directly at its edge to the substrate in the peripheral area of the display area, so as to cover all the other layers; wherein the first inorganic blocking layer and the second inorganic blocking layer are both transparent, and the first organic buffer layer is conductive and transparent. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15, 16)
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Specification