Carrier-Attached Copper Foil, Laminate, Method For Producing Printed Wiring Board, And Method For Producing Electronic Device

• US 20170042044A1
• Filed: 08/05/2016
• Published: 02/09/2017
• Est. Priority Date: 08/06/2015
• Status: Active Grant

• Current Assignee: JX Nippon Mining & Metals Corporation (ENEOS Holdings, Inc.)
• Original Assignee: JX Nippon Mining & Metals Corporation (ENEOS Holdings, Inc.)
• Inventors: Miyamoto, Nobuaki
• Granted Patent: US 10,251,283 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H05K 1/09 Use of materials for the conductive, e.g. metallic pattern
• CPC Class Codes: H05K 2201/0355 Metal foils
• CPC Class Codes: H05K 2203/0307 Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
• CPC Class Codes: H05K 2203/0376 Etching temporary metallic carrier substrate
• CPC Class Codes: H05K 2203/0384 Etch stop layer, i.e. a buried barrier layer for preventing etching of layers under the etch stop layer
• CPC Class Codes: H05K 2203/06 Lamination
• CPC Class Codes: H05K 3/0035 of blind holes, i.e. having a metal layer at the bottom
• CPC Class Codes: H05K 3/007 Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier H05K1/187, H05K3/20 and H05K3/4682 take precedence
• CPC Class Codes: H05K 3/025 by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
• CPC Class Codes: H05K 3/108 by semi-additive methods; masks therefor characterised by metallic etch mask H05K3/062; electroplating methods or apparatus H05K3/241
• CPC Class Codes: H05K 3/4611 by laminating two or more circuit boards H05K3/4652 takes precedence
• CPC Class Codes: H05K 3/4661 Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor other insulating materials H05K3/387
• CPC Class Codes: H05K 3/4682 Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil

Abstract

Provided herein is a carrier-attached copper foil having desirable fine circuit formability. The carrier-attached copper foil includes a carrier, an interlayer, and an ultrathin copper layer in this order, wherein D2-D1 is 0.30 to 3.83 μm, where D1 is the gravimetrically measured thickness of the carrier-attached copper foil excluding the carrier and the interlayer, and D2 is the maximum thickness of the layer remaining on a bismaleimide-triazine resin substrate in case of detaching the carrier after the carrier-attached copper foil is laminated to the resin substrate from the ultrathin copper layer side by being heat pressed under a pressure of 20 kgf/cm² at 220° C. for 2 hours.

Claims

1. A carrier-attached copper foil comprising a carrier, an interlayer, and an ultrathin copper layer in this order, wherein D2-D1 is 0.30 to 3.83 μ

m, where D1 is the gravimetrically measured thickness of the carrier-attached copper foil excluding the carrier and the interlayer, and D2 is the maximum thickness of the layer remaining on a bismaleimide-triazine resin substrate in case of detaching the carrier after the carrier-attached copper foil is laminated to the resin substrate from the ultrathin copper layer side by being heat pressed under a pressure of 20 kgf/cm² at 220°

C. for 2 hours.

2. The carrier-attached copper foil according to claim 1, wherein the difference D2-D1 is 3.50 μ

m or less.

3. The carrier-attached copper foil according to claim 2, wherein the difference D2-D1 is 2.80 μ

m or less.

4. The carrier-attached copper foil according to claim 3, wherein the difference D2-D1 is 2.58 μ

m or less.

5. The carrier-attached copper foil according to claim 4, wherein the difference D2-D1 is 1.20 μ

m or less.

6. The carrier-attached copper foil according to claim 1, which comprises one or more layers selected from the group consisting of a roughening treatment layer, a heat-resistant layer, an antirust layer, a chromate treatment layer, and a silane coupling process layer,

said one or more layers being provided on one or both of the surfaces on the side of the ultrathin copper layer and on the side of the carrier when the carrier-attached copper foil of claim 1 has the interlayer and the ultrathin copper layer in this order seen from the carrier, on one side of the surfaces of the carrier,

said one or more layers being provided on one or both surfaces on the ultrathin copper layer side when the carrier-attached copper foil of claim 1 has the interlayer and the ultrathin copper layer in this order seen from the carrier, on the both surfaces of the carrier.

7. The carrier-attached copper foil according to claim 3, which comprises one or more layers selected from the group consisting of a roughening treatment layer, a heat-resistant layer, an antirust layer, a chromate treatment layer, and a silane coupling process layer,

said one or more layers being provided on one or both of the surfaces on the side of the ultrathin copper layer and on the side of the carrier when the carrier-attached copper foil of claim 3 has the interlayer and the ultrathin copper layer in this order seen from the carrier, on one side of the surfaces of the carrier,

said one or more layers being provided on one or both surfaces on the ultrathin copper layer side when the carrier-attached copper foil of claim 3 has the interlayer and the ultrathin copper layer in this order seen from the carrier, on the both surfaces of the carrier.

8. The carrier-attached copper foil according to claim 4, which comprises one or more layers selected from the group consisting of a roughening treatment layer, a heat-resistant layer, an antirust layer, a chromate treatment layer, and a silane coupling process layer,

said one or more layers being provided on one or both of the surfaces on the side of the ultrathin copper layer and on the side of the carrier when the carrier-attached copper foil of claim 4 has the interlayer and the ultrathin copper layer in this order seen from the carrier, on one side of the surfaces of the carrier,

said one or more layers being provided on one or both surfaces on the ultrathin copper layer side when the carrier-attached copper foil of claim 4 has the interlayer and the ultrathin copper layer in this order seen from the carrier, on the both surfaces of the carrier.

9. The carrier-attached copper foil according to claim 6, wherein the roughening treatment layer is a layer comprised of a simple substance selected from the group consisting of copper, nickel, phosphorous, tungsten, arsenic, molybdenum, chromium, iron, vanadium, cobalt, and zinc, or an alloy containing one or more simple substances selected from the group consisting of copper, nickel, phosphorous, tungsten, arsenic, molybdenum, chromium, iron, vanadium, cobalt, and zinc.

10. The carrier-attached copper foil according to claim 1, which comprises a resin layer on the ultrathin copper layer.

11. The carrier-attached copper foil according to claim 6, wherein the resin layer is provided on one or more layers selected from the group consisting of a roughening treatment layer, a heat-resistant layer, an antirust layer, a chromate treatment layer, and a silane coupling process layer.

12. The carrier-attached copper foil according to claim 7, wherein the resin layer is provided on one or more layers selected from the group consisting of a roughening treatment layer, a heat-resistant layer, an antirust layer, a chromate treatment layer, and a silane coupling process layer.

13. The carrier-attached copper foil according to claim 8, wherein the resin layer is provided on one or more layers selected from the group consisting of a roughening treatment layer, a heat-resistant layer, an antirust layer, a chromate treatment layer, and a silane coupling process layer.

14. A laminate produced by using the carrier-attached copper foil of claim 1.

15. A laminate comprising the carrier-attached copper foil of claim 1, and a resin, wherein the resin covers end surfaces of the carrier-attached copper foil either in part or as a whole.

16. A laminate comprising a first carrier-attached copper foil laminated from the carrier side or the ultrathin copper layer side to the carrier side or the ultrathin copper layer side of a second carrier-attached copper foil, the first and the second carrier-attached copper foils being the carrier-attached copper foil of claim 1.

17. A method for producing a printed wiring board using the laminate of claim 14.

18. A method for producing a printed wiring board,

the method comprising:

providing a dual layer of resin layer and circuit at least once one side or both sides of the laminate of claim 14; and

detaching the ultrathin copper layer or the carrier from the carrier-attached copper foil included in the laminate after the dual layer of resin layer and circuit is formed at least once.

19. A method for producing a printed wiring board by using the carrier-attached copper foil of claim 1.

20. A method for producing an electronic device by using a printed wiring board produced by using the method of claim 19.

21. A method for producing a printed wiring board,

the method comprising:

preparing the carrier-attached copper foil of claim 1, and an insulating substrate;

laminating the carrier-attached copper foil and the insulating substrate to each other;

forming a copper-clad laminated board by detaching the carrier of the carrier-attached copper foil after the carrier-attached copper foil and the insulating substrate are laminated to each other; and

forming a circuit by using any of a semi-additive process, a subtractive process, a partly additive process, and a modified semi-additive process.

22. A method for producing a printed wiring board,

the method comprising:

forming a circuit on the surface of the carrier-attached copper foil of claim 1 on the side of the ultrathin copper layer or on the side of the carrier;

forming a resin layer on the ultrathin copper layer- or carrier-side surface of the carrier-attached copper foil so as to make the circuit embedded in the resin layer;

detaching the carrier or the ultrathin copper layer; and

removing the ultrathin copper layer or the carrier after detaching the carrier or the ultrathin copper layer to expose the circuit formed on the ultrathin copper layer- or carrier-side surface and embedded in the resin layer.

23. A method for producing a printed wiring board,

the method comprising:

laminating the surface of the carrier-attached copper foil of claim 1 to a resin substrate on the side of the ultrathin copper layer, or on the side of the carrier;

providing a dual layer of resin layer and circuit at least once on the ultrathin copper layer- or carrier-side surface of the carrier-attached copper foil opposite the surface laminated to the resin substrate; and

detaching the carrier or the ultrathin copper layer from the carrier-attached copper foil after the formation of the dual layer of resin layer and circuit.