IMPROVED LED LAMPS AND LUMINAIRES
First Claim
1. An LED downlight lighting module comprising:
- an LED module comprising one or more single LED(s) on a first printed circuit board;
a heat sink comprising a heat sink structure, wherein the first printed circuit board being in good thermal contact with the heat sink such that heat from the LED(s) on the LED module is dissipated through the heat sink; and
a second printed circuit board adapted to accommodate a power and control circuitry for the LED(s),wherein the second printed circuit board is located within a driver box accommodated within one of a void and a recess in the heat sink structure, and wherein the driver box is thermally insulated from both the heat sink and from the first printed circuit board, and thus from the LED(s).
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Accused Products
Abstract
An LED downlight lighting module is provided including an LED module having one or more single LEDs on a first printed circuit board, a heat sink, and a second printed circuit board. In an embodiment, the first printed circuit board is in good thermal contact with the heat sink such that heat from the LEDs is dissipated through the heat sink. In an embodiment, the second printed circuit board is adapted to accommodate a power and control circuitry for the LEDs, and is thermally insulated from the heat sink and from the first printed circuit board, and thus from the LED module. According to an aspect, the LEDs serve as the principal heat generating component on the printed circuit board, thus helping to increase the light output from the LEDs and/or increase the lifespan of the LED downlight lighting module.
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Citations
37 Claims
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1. An LED downlight lighting module comprising:
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an LED module comprising one or more single LED(s) on a first printed circuit board; a heat sink comprising a heat sink structure, wherein the first printed circuit board being in good thermal contact with the heat sink such that heat from the LED(s) on the LED module is dissipated through the heat sink; and a second printed circuit board adapted to accommodate a power and control circuitry for the LED(s), wherein the second printed circuit board is located within a driver box accommodated within one of a void and a recess in the heat sink structure, and wherein the driver box is thermally insulated from both the heat sink and from the first printed circuit board, and thus from the LED(s). - View Dependent Claims (2, 3, 4, 5, 6, 7, 11, 12, 17, 26, 27)
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8-10. -10. (canceled)
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13-16. -16. (canceled)
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18-25. -25. (canceled)
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28-29. -29. (canceled)
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30. An LED downlight lighting module comprising:
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an LED module comprising one or more single LED(s) on a first printed circuit board; a heat sink comprising a substantially hollow body, the substantially hollow body comprising a plurality of fins arranged within the substantially hollow body, wherein the substantially hollow body and the fins are formed from a material comprising a thermally conductive material and the first printed circuit board is in good thermal contact with the substantially hollow body such that heat from the LED(s) is dissipated through both the substantially hollow body and the fins; and a second printed circuit board adapted to accommodate a power and control circuitry for the LED(s), wherein the second printed circuit board is located within a driver box accommodated within one of a void and a recess in the substantially hollow body, and wherein the driver box is thermally insulated from the substantially hollow body of the heat sink and from the first printed circuit board, and thus from the LED(s). - View Dependent Claims (31, 32, 33, 34, 35, 36)
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37. An LED light fitting comprising:
an LED downlight lighting module comprising; an LED module comprising one or more single LED(s) on a first printed circuit board; a heat sink comprising a heat sink structure, wherein the first printed circuit board is in good thermal contact with the heat sink such that heat from the LED(s) is dissipated through the heat sink; and a second printed circuit board adapted to accommodate a power and control circuitry for the LED(s), wherein the second printed circuit board is located within a driver box accommodated within one of a void and a recess in the heat sink structure, and wherein the driver box is thermally insulated from both the heat sink and from the first printed circuit board, and thus from the LED(s).
Specification