CHIPLETS WITH CONNECTION POSTS

• US 20170048976A1
• Filed: 08/10/2015
• Published: 02/16/2017
• Est. Priority Date: 08/10/2015
• Status: Active Grant

• Current Assignee: X Display Company Technology Limited (Sensinnovat BVBA)
• Original Assignee: X-Celeprint Limited
• Inventors: Prevatte, Carl, Bower, Christopher, Cok, Ronald S., Meitl, Matthew
• Granted Patent: US 10,468,363 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01L 21/4803 Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks H01L21/4846 takes precedence; printed circuit boards H05K1/00
• CPC Class Codes: H01L 21/4846 Leads on or in insulating or insulated substrates, e.g. metallisation H01L21/4821 takes precedence; metallisation of ceramics in general C04B41/51; printed circuits H05K3/00
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/1144 by transfer printing
• CPC Class Codes: H01L 2224/11466 Conformal deposition, i.e. blanket deposition of a conformal layer on a patterned surface
• CPC Class Codes: H01L 2224/1161 Physical or chemical etching
• CPC Class Codes: H01L 2224/11612 by physical means only
• CPC Class Codes: H01L 2224/1182 Applying permanent coating, e.g. in-situ coating
• CPC Class Codes: H01L 2224/13017 being non uniform along the bump connector
• CPC Class Codes: H01L 2224/13023 the whole bump connector protruding from the surface
• CPC Class Codes: H01L 2224/131 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/1357 Single coating layer
• CPC Class Codes: H01L 2224/136 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/1403 Bump connectors having different sizes, e.g. different diameters, heights or widths
• CPC Class Codes: H01L 2224/1411 the bump connectors being bonded to at least one common bonding area
• CPC Class Codes: H01L 2224/1412 Layout
• CPC Class Codes: H01L 2224/1418 being disposed on at least two different sides of the body, e.g. dual array
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/1624 the bump connector connecting between the body and an opposite side of the item with respect to the body
• CPC Class Codes: H01L 2224/17107 the bump connectors connecting two common bonding areas
• CPC Class Codes: H01L 2224/81005 : being a temporary or sacrificial substrate
• CPC Class Codes: H01L 2224/81191 : wherein the bump connectors are disposed only on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/81193 : wherein the bump connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/81801 : Soldering or alloying
• CPC Class Codes: H01L 2224/81815 : Reflow soldering
• CPC Class Codes: H01L 2224/95001 : involving a temporary auxiliary member not forming part of the bonding apparatus, e.g. removable or sacrificial coating, film or substrate
• CPC Class Codes: H01L 24/05 : of an individual bonding area
• CPC Class Codes: H01L 24/06 : of a plurality of bonding areas
• CPC Class Codes: H01L 24/08 : of an individual bonding area
• CPC Class Codes: H01L 24/11 : Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 24/13 : of an individual bump connector
• CPC Class Codes: H01L 24/14 : of a plurality of bump connectors
• CPC Class Codes: H01L 24/17 : of a plurality of bump connectors
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 24/95 : at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
• CPC Class Codes: H01L 24/98 : Methods for disconnecting semiconductor or solid-state bodies
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/12043 : Photo diode
• CPC Class Codes: H01L 2924/12044 : OLED
• CPC Class Codes: H01L 2924/1304 : Transistor
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H05K 1/112 : directly combined with via connections
• CPC Class Codes: H05K 2201/09409 : Multiple rows of pads, lands, terminals or dummy patterns; Multiple rows of mounted components
• CPC Class Codes: H05K 2201/09472 : Recessed pad for surface mounting; Recessed electrode of component
• CPC Class Codes: H05K 2201/0979 : Redundant conductors or connections, i.e. more than one current path between two points
• CPC Class Codes: H05K 2201/10143 : Solar cell
• CPC Class Codes: H05K 3/305 : Affixing by adhesive
• CPC Class Codes: H05K 3/3436 : having an array of bottom contacts, e.g. pad grid array or ball grid array components
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product

Abstract

A component includes a plurality of electrical connections on a process side opposed to a back side of the component. Each electrical connection includes an electrically conductive multi-layer connection post protruding from the process side. A printed structure includes a destination substrate and one or more components. The destination substrate has two or more electrical contacts and each connection post is in contact with, extends into, or extends through an electrical contact of the destination substrate to electrically connect the electrical contacts to the connection posts. The connection posts or electrical contacts are deformed. Two or more connection posts can be electrically connected to a common electrical contact.

Claims

1. A printable component, comprising:

a chiplet having a semiconductor substrate; and

a plurality of electrical connections, wherein each electrical connection comprises an electrically conductive connection post protruding from the semiconductor substrate, wherein the connection post is a multi-layer connection post.

2. The printable component of claim 1, wherein the connection post comprises a bulk material coated with a conductive material different from the bulk material.

3. The printable component of claim 2, wherein the bulk material is electrically conductive.

4. The printable component of claim 2, wherein the conductive material has a melting point less than the melting point of the bulk material.

5. The printable component of claim 2, wherein the bulk material is an electrical insulator.

6. The printable component of claim 2, wherein the bulk material is a resin, a polymer, or a cured resin.

7. The printable component of claim 2, wherein the bulk material is softer than the conductive material.

8. The printable component of claim 2, wherein the conductive material is softer than the bulk material.

82. The printable component of claim 1, wherein two or more adjacent connection posts are directly electrically connected to each other.

83. The printable component of claim 82, wherein the two or more adjacent connection posts comprise a first and a second connection post of different heights.

84. The printable component of claim 82, wherein the connection posts are disposed in groups and a spacing between adjacent connection posts within a given group is less than a spacing between adjacent groups.

85. The printable component of claim 84, wherein the connection posts within a group are electrically shorted together.

9-23. -23. (canceled)

24. A printed structure comprising a destination substrate and one or more printable components, each of the printable components comprising:

a chiplet having a semiconductor substrate;

a plurality of electrical connections, wherein each electrical connection comprises an electrically conductive connection post protruding from the semiconductor substrate or a layer in contact with the semiconductor substrate, wherein the destination substrate comprises two or more backplane contact pads, wherein each connection post is in contact with, extends into, or extends through a backplane contact pad of the destination substrate to electrically connect the backplane contact pads to the connection posts, and wherein one or more of the backplane contact pads, one or more of the connection posts, or both one or more of the backplane contact pads and one or more of the connection posts is deformed or crumpled, or has a non-planar surface.

27. The printed structure of claim 24, wherein a conductive material other than a material of the backplane contact pad or the connection post adheres or electrically connects (e.g., or both) the backplane contact pad to the conductive post.

31. The printed structure of claim 24, wherein the backplane contact pads are non-planar and the connection posts are inserted into the backplane contact pads.

25-26. -26. (canceled)

28-30. -30. (canceled)

32-46. -46. (canceled)

47. A printable component, comprising:

a first dielectric layer having connection posts protruding from the dielectric layer;

a chiplet having a semiconductor substrate and chiplet contact pads, the chiplet disposed on the first dielectric layer; and

conductors electrically connecting the connection posts to the chiplet contact pads.

48-81. -81. (canceled)