CHIPLETS WITH CONNECTION POSTS
First Claim
1. A printable component, comprising:
- a chiplet having a semiconductor substrate; and
a plurality of electrical connections, wherein each electrical connection comprises an electrically conductive connection post protruding from the semiconductor substrate, wherein the connection post is a multi-layer connection post.
3 Assignments
0 Petitions
Accused Products
Abstract
A component includes a plurality of electrical connections on a process side opposed to a back side of the component. Each electrical connection includes an electrically conductive multi-layer connection post protruding from the process side. A printed structure includes a destination substrate and one or more components. The destination substrate has two or more electrical contacts and each connection post is in contact with, extends into, or extends through an electrical contact of the destination substrate to electrically connect the electrical contacts to the connection posts. The connection posts or electrical contacts are deformed. Two or more connection posts can be electrically connected to a common electrical contact.
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Citations
85 Claims
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1. A printable component, comprising:
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a chiplet having a semiconductor substrate; and a plurality of electrical connections, wherein each electrical connection comprises an electrically conductive connection post protruding from the semiconductor substrate, wherein the connection post is a multi-layer connection post. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 82, 83, 84, 85)
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9-23. -23. (canceled)
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24. A printed structure comprising a destination substrate and one or more printable components, each of the printable components comprising:
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a chiplet having a semiconductor substrate; a plurality of electrical connections, wherein each electrical connection comprises an electrically conductive connection post protruding from the semiconductor substrate or a layer in contact with the semiconductor substrate, wherein the destination substrate comprises two or more backplane contact pads, wherein each connection post is in contact with, extends into, or extends through a backplane contact pad of the destination substrate to electrically connect the backplane contact pads to the connection posts, and wherein one or more of the backplane contact pads, one or more of the connection posts, or both one or more of the backplane contact pads and one or more of the connection posts is deformed or crumpled, or has a non-planar surface. - View Dependent Claims (27, 31)
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25-26. -26. (canceled)
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28-30. -30. (canceled)
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32-46. -46. (canceled)
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47. A printable component, comprising:
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a first dielectric layer having connection posts protruding from the dielectric layer; a chiplet having a semiconductor substrate and chiplet contact pads, the chiplet disposed on the first dielectric layer; and conductors electrically connecting the connection posts to the chiplet contact pads.
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48-81. -81. (canceled)
Specification