PROXIMITY SENSOR AND MANUFACTURING METHOD THEREFOR

• US 20170052040A1
• Filed: 12/28/2015
• Published: 02/23/2017
• Est. Priority Date: 08/21/2015
• Status: Active Grant

• Current Assignee: Stmicroelectronics Pte Limited (STMicroelectronics NV)
• Original Assignee: Stmicroelectronics Pte Limited (STMicroelectronics NV)
• Inventors: LUAN, Jing-En
• Granted Patent: US 10,244,638 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: G01D 11/245 Housings for sensors
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H05K 2201/0108 Transparent
• CPC Class Codes: H05K 2201/10151 Sensor
• CPC Class Codes: H05K 2203/1327 Moulding over PCB locally or completely applying non-metallic protective coatings for encapsulating mounted components H05K3/284
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: H05K 3/32 electrically connecting electric components or wires to printed circuits

Abstract

A proximity sensor is provided according to the embodiments of the present disclosure, comprising: a sensor chip; a light-emitting device; a substrate, the sensor chip and the light-emitting device being located on the substrate; a transparent molding material covering a light-emitting surface of the light-emitting device; and a non-transparent molding material separating the transparent molding material from the sensor chip.

Claims

1. A proximity sensor, comprising:

a substrate;

a sensor chip coupled to the substrate, the sensor chip having a sensor region;

a light-emitting device coupled to the substrate, the light-emitting device having a light emitting surface;

transparent molding material covering the light-emitting surface of the light-emitting device; and

non-transparent molding material on the substrate between the transparent molding material and the sensor chip.

2. The proximity sensor as claimed in claim 1, wherein the light-emitting device is sealed by the transparent molding material.

3. The proximity sensor as claimed in claim 2, further comprising an insulative attachment material and a conductive attachment material, wherein the sensor chip is coupled to the substrate by the insulative attachment material, and the light-emitting device is coupled to the substrate by the conductive attachment material.

4. The proximity sensor as claimed in claim 1, further comprising:

a filtering component covering the sensor region of the sensor chip.

5. The proximity sensor as claimed in claim 1, wherein the transparent molding material covers the sensor region of the sensor chip.

6. The proximity sensor as claimed in claim 1, wherein the non-transparent molding material partially covers a surface of the sensor chip and does not cover the sensor region of the sensor chip.

7. The proximity sensor as claimed in claim 1, wherein the non-transparent molding material partially covers the transparent molding material, wherein a light emergent path of the light-emitting device is not covered by the non-transparent molding material.

8. An electronic apparatus, comprising:

a proximity sensor including;

a substrate having a first surface;

a sensor chip coupled to the first surface, the sensor chip including a sensor region;

a light-emitting device coupled to the first surface, the light-emitting device having a light emitting surface;

transparent molding material covering the light-emitting surface of the light-emitting device and the sensor region of the sensor chip;

non-transparent molding material between the transparent molding material and the sensor chip; and

a controller coupled to the proximity sensor.

9. The electronic apparatus as claimed in claim 8, wherein the non-transparent molding material is between the transparent molding material.

10. The electronic apparatus as claimed in claim 8, further comprising conductive wires that electrically couple the sensor chip to the substrate.

11. The electronic apparatus as claimed in claim 8, wherein the electronic apparatus is at least one of a mobile phone, a personal digital assistant, a laptop, a desktop computer, a wearable device, a camera, and a video device.

12. A method for manufacturing a proximity sensor, comprising:

coupling a light-emitting device to a surface of a substrate;

electrically coupling the light-emitting device to the substrate;

covering a light-emitting surface of the light-emitting device with a transparent molding material;

coupling a sensor chip to the surface of the substrate;

electrically coupling the sensor chip to the substrate; and

forming a non-transparent molding material between the transparent molding material and the sensor chip.

13. The method as claimed in claim 12, wherein covering the light-emitting surface of the light-emitting device with the transparent molding material comprises:

sealing the light-emitting device on the substrate with the transparent molding material.

14. The method as claimed in claim 12, wherein:

coupling the sensor chip to the surface of the substrate comprises using an insulative attachment material to attach the sensor chip to the surface of the substrate, and

coupling the light-emitting device to the surface of the substrate comprises using a conductive attachment material to attach the light-emitting device to the surface of the substrate.

15. The method as claimed in claim 12, further comprising:

placing a filtering component over a sensor region of the sensor chip.

16. The method as claimed in claim 12, further comprising covering a sensor region of the sensor chip with transparent molding material.

17. The method as claimed in claim 12, further comprising:

covering a portion of a surface of the sensor chip with the non-transparent molding material, wherein a sensor region at the surface of the sensor chip is not covered by the non-transparent molding material.

18. The method as claimed in claim 12, further comprising:

covering a portion of the transparent molding material with the non-transparent molding material, wherein a light emergent path of the light-emitting device is not covered by the non-transparent molding material.

19. The method as claimed in claim 12, wherein:

coupling the light-emitting device comprises coupling a plurality of light-emitting devices to the surface of the substrate;

electrically coupling the light-emitting devices comprises electrically coupling the a plurality of light-emitting devices to the surface of the substrate;

covering the light-emitting surface comprises cover light-emitting surfaces of the light-emitting devices with transparent molding material;

coupling the sensor chip comprises coupling a plurality of sensor chips to the surface of the substrate;

electrically coupling the sensor chip comprises electrically coupling the plurality of sensor chips to the substrate; and

forming the non-transparent molding material comprises forming the non-transparent molding material between the transparent molding material and the plurality of sensor chips, the method further comprising;

performing singulation processing to form individual packages.

20. The method as claimed in claim 16, wherein:

covering the light-emitting surface comprises using a mold process to cover the light-emitting surfaces of the light-emitting devices with the transparent molding material; and

forming the non-transparent molding material comprises using a mold process for forming the non-transparent molding material between the transparent molding material and the sensor chips.