DEVICE FARADAY CAGE
First Claim
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1. A device, comprising:
- a circuit board that includes a heat generating component;
a thermal module positioned over the heat generating component;
an electrically conductive structure positioned under the heat generating component; and
,a biasing sub-assembly that physically biases the thermal module toward the heat generating component and that operates cooperatively with the thermal module and the electrically conductive structure to form a Faraday cage around the heat generating component,wherein the thermal module and the electrically conductive structure form generally parallel planar surfaces of the Faraday cage and wherein the biasing sub-assembly forms at least a portion of the Faraday cage between the generally parallel planar surfaces.
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Abstract
The description relates to devices, such as computing devices. One example can include a shielded and cooled circuit board assembly including a biasing sub-assembly that can bias a heat generating component and a thermal module together. The biasing sub-assembly can also define a portion of a Faraday cage around the heat generating component.
22 Citations
23 Claims
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1. A device, comprising:
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a circuit board that includes a heat generating component; a thermal module positioned over the heat generating component; an electrically conductive structure positioned under the heat generating component; and
,a biasing sub-assembly that physically biases the thermal module toward the heat generating component and that operates cooperatively with the thermal module and the electrically conductive structure to form a Faraday cage around the heat generating component, wherein the thermal module and the electrically conductive structure form generally parallel planar surfaces of the Faraday cage and wherein the biasing sub-assembly forms at least a portion of the Faraday cage between the generally parallel planar surfaces. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 10, 11)
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9. (canceled)
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12. A device, comprising:
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a circuit board that includes a heat generating component; a thermal module positioned over the heat generating component; an electrically conductive structure positioned under the heat generating component; and
,a biasing sub-assembly that physically biases the thermal module toward the heat generating component and that operates cooperatively with the thermal module and the electrically conductive structure to form a Faraday cage around the heat generating component, wherein the biasing sub-assembly defines openings that facilitate airflow between the thermal module and the circuit board and wherein a maximum dimension of the openings is less than a wavelength of radio frequency energy that the Faraday cage is configured to shield from the heat generating component. - View Dependent Claims (13)
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14. A device, comprising:
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a circuit board having a processor; and
,a Faraday cage formed around the processor, at least one portion of the Faraday cage comprising a thermal module and another portion of the Faraday cage comprising a biasing sub-assembly that biases the thermal module toward the processor, the biasing sub-assembly being secured directly to the circuit board. - View Dependent Claims (15, 16, 17, 18)
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19. A device, comprising:
a shielded and cooled circuit board including a biasing sub-assembly that biases a heat generating component and a thermal module together and wherein the biasing sub-assembly further comprises a portion of a Faraday cage around the heat generating component. - View Dependent Claims (20, 21, 22, 23)
Specification