Acoustic Imaging System Architecture

• US 20170053151A1
• Filed: 08/17/2016
• Published: 02/23/2017
• Est. Priority Date: 08/20/2015
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Yeke Yazandoost, Mohammad, King, Brian Michael, Yip, Marcus, Khajeh, Ehsan, Tucker, Aaron, Gozzini, Giovanni, Yousefpor, Marduke
• Granted Patent: US 11,048,902 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: A61B 5/1172 using fingerprinting
• CPC Class Codes: A61B 5/6898 Portable consumer electronic devices, e.g. music players, telephones, tablet computers
• CPC Class Codes: A61B 8/00 Diagnosis using ultrasonic, sonic or infrasonic waves imaging of objects using sonar G01S15/00
• CPC Class Codes: B06B 1/0207 Driving circuits specially adapted for particular applications, see the relevant subclass, e.g. G01; circuits for steering transducer arrays G10K11/34; basic circuits H03
• CPC Class Codes: G06V 40/1306 non-optical, e.g. ultrasonic or capacitive sensing

Abstract

An acoustic imaging system includes multiple transducers disposed to circumscribe a portion of substrate. An acoustic imaging system also includes a controller and an image resolver. The transducers convert electrical signals into mechanical energy and/or mechanical energy into electrical signals. The controller is adapted to apply an electrical signal to the transducers which, in response, induce a mechanical wave, such as a surface wave, into the circumscribed portion. The controller is also adapted to receive electrical signals from the transducers. The image resolver uses the electrical signals received by the controller in order to construct an image of an object in physical contact with the substrate.

Claims

1. An acoustic imaging sensor, the acoustic imaging sensor comprising:

a distribution of transducers disposed to circumscribe a portion of a substrate, each transducer of the distribution of transducers operable to;

operate in a drive mode in which the transducer mechanically deforms in response to a drive signal; and

operate in a sense mode in which the transducer produces an electronic signal when a section of the substrate adjacent the transducer mechanically deforms as a result of a mechanical wave propagating over or through the section;

a controller configured to;

generate at least one drive signal to cause a mechanical wave to be generated across a top surface of and/or within the substrate toward the circumscribed portion of the substrate; and

receive an electrical signal from at least one transducer of the distribution of transducers; and

an image resolver in communication with the controller, the image resolver configured to construct an image of at least a portion of an object engaging the top surface of the substrate based on the electronic signal received by the controller.

2. The acoustic imaging sensor of claim 1, wherein the controller is disposed below the distribution of transducers.

3. The acoustic imaging sensor of claim 1, wherein the controller comprises:

a drive circuit configured to generate the at least one drive signal; and

a sense circuit configured to receive the electronic signal.

4. The acoustic imaging sensor of claim 3, wherein the sense circuit is disposed below the distribution of transducers.

5. The acoustic imaging sensor of claim 3, wherein the sense circuit is disposed adjacent to the drive circuit.

6. The acoustic imaging sensor of claim 1, wherein each of the distribution of transducers are coupled to a bottom surface of the substrate.

7. The acoustic imaging sensor of claim 1, wherein:

the substrate is rectangular; and

the distribution of transducers is arranged as a row adjacent to an upper perimeter of the circumscribed portion.

8. The acoustic imaging sensor of claim 7, wherein the distribution of transducers is a first distribution of transducers and the acoustic imaging sensor further comprises:

a second distribution of transducers, the second distribution of transducers arranged as a column adjacent to a side perimeter of the circumscribed portion.

9. The acoustic imaging sensor of claim 1, the distribution of transducers is arranged as a row adjacent a rectilinear edge of the substrate.

10. The acoustic imaging sensor of claim 1, the distribution of transducers is arranged as multiple parallel rows adjacent a rectilinear edge of the substrate.

11. The acoustic imaging sensor of claim 1, wherein the substrate is formed from glass, sapphire, or metal.

12. The acoustic imaging sensor of claim 1, wherein a transducer of the distribution of transducers is formed from a material configured to expand and contract in response to a voltage signal.

13. An acoustic imaging sensor coupled a substrate, the acoustic imaging sensor comprising:

a group of transducers circumscribing a rectangular area of the substrate, the group of transducers comprising;

a first subgroup of transducers adjacent an upper edge of the substrate;

a second subgroup of transducers adjacent a lower edge of the substrate;

a third subgroup of transducers adjacent a right edge of the substrate; and

a fourth subgroup of transducers adjacent a left edge of the substrate;

a controller at least partially below the group of transducers and operable to;

supply a voltage signal to one or more of the first, second, third, or fourth subgroup of transducers; and

receive a voltage from one or more of the first, second, third, or fourth subgroup of transducers;

an image resolver in communication with the controller, the image resolver configured to construct an image of an object engaging the substrate based on the voltage received by the controller.

14. The acoustic imaging sensor of claim 13, wherein the first subgroup of transducers is arranged as at least two parallel rows of transducers.

15. The acoustic imaging sensor of claim 13, wherein the substrate is formed from glass, sapphire, or metal;

and

wherein each of the transducers of the distribution of transducers is formed from a piezoelectric material.

16. An acoustic imaging sensor, the acoustic imaging sensor comprising:

a first distribution of transducers disposed to circumscribe a portion of a substrate, each transducer of the first distribution of acoustic comprising;

a drive mode in which the transducer mechanically deforms in response to a drive signal;

a second distribution of transducers disposed adjacent the circumscribed portion, each transducer of the second distribution of transducers comprising;

a sense mode in which the transducer produces an electronic signal when a section of the substrate adjacent the transducer mechanically deforms as a result of a mechanical wave propagating over or through the section;

a controller configured to;

actuate at least one transducer of the first distribution of transducers to cause a mechanical wave to be generated across a top surface and/or through the thickness of the substrate toward an interior portion of the substrate; and

receive an electrical signal from at least one transducer of the second distribution of transducers; and

an image resolver in communication with the controller, the image resolver configured to construct an image of at least a portion of an object engaging the top surface of the substrate based on the electronic signal received by the controller.

17. The acoustic imaging sensor of claim 16, wherein the controller comprises:

a drive circuit configured to generate the at least one drive signal; and

a sense circuit configured to receive the electronic signal.

18. The acoustic imaging sensor of claim 16, wherein each of the first distribution of transducers and the second distribution of transducers are coupled to a bottom surface of the substrate.

19. The acoustic imaging sensor of claim 16, wherein the first distribution of transducers is arranged as a row positioned adjacent to a rectilinear edge of the substrate.

20. The acoustic imaging sensor of claim 19, wherein the second distribution of transducers is arranged as a row positioned adjacent the first distribution of transducers.

21. The acoustic imaging sensor of claim 19, wherein the second distribution of transducers is arranged interstitially with the first distribution of transducers.

22. The acoustic imaging sensor of claim 16, wherein the first distribution of transducers is arranged as a series of parallel rows, aligned adjacent to a rectilinear edge of the substrate.

23. The acoustic imaging sensor of claim 22, wherein the second distribution of transducers is arranged as a series of parallel rows, aligned parallel to the first distribution of transducers.

24. The acoustic imaging sensor of claim 22, wherein the second distribution of transducers is vertically aligned with the first distribution of transducers.