SUBSTRATE WITH ARRAY OF LEDS FOR BACKLIGHTING A DISPLAY DEVICE

• US 20170053901A1
• Filed: 11/07/2016
• Published: 02/23/2017
• Est. Priority Date: 03/20/2015
• Status: Active Grant

• Current Assignee: Rohinni LLC
• Original Assignee: Rohinni LLC
• Inventors: Huska, Andrew, Kupcow, Sean, Peterson, Cody, Adams, Clinton
• Granted Patent: US 9,985,003 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: G02F 1/133603 with LEDs
• CPC Class Codes: G02F 1/133605 including specially adapted reflectors
• CPC Class Codes: G02F 1/133606 including a specially adapted diffusing, scattering or light controlling members
• CPC Class Codes: G02F 1/133612 Electrical details
• CPC Class Codes: H01L 21/4853 Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
• CPC Class Codes: H01L 21/67132 Apparatus for placing on an insulating substrate, e.g. tape
• CPC Class Codes: H01L 21/67144 Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
• CPC Class Codes: H01L 21/67196 characterized by the construction of the transfer chamber
• CPC Class Codes: H01L 21/67265 of substrates stored in a container, a magazine, a carrier, a boat or the like
• CPC Class Codes: H01L 21/67715 Changing the direction of the conveying path
• CPC Class Codes: H01L 21/67778 involving loading and unloading of wafers
• CPC Class Codes: H01L 21/681 using optical controlling means
• CPC Class Codes: H01L 21/6836 Wafer tapes, e.g. grinding or dicing support tapes adhesive tapes in general C09J7/20
• CPC Class Codes: H01L 21/68742 characterised by a lifting arrangement, e.g. lift pins
• CPC Class Codes: H01L 22/12 for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions electrical measurement of diffusions H01L22/14
• CPC Class Codes: H01L 22/20 Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
• CPC Class Codes: H01L 2221/68322 Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
• CPC Class Codes: H01L 2221/68327 used during dicing or grinding
• CPC Class Codes: H01L 2221/68354 used to support diced chips prior to mounting
• CPC Class Codes: H01L 2221/68363 used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate
• CPC Class Codes: H01L 2221/68381 : Details of chemical or physical process used for separating the auxiliary support from a device or wafer
• CPC Class Codes: H01L 2223/54413 : comprising digital information, e.g. bar codes, data matrix
• CPC Class Codes: H01L 2223/54426 : for alignment
• CPC Class Codes: H01L 2223/54433 : containing identification or tracking information
• CPC Class Codes: H01L 2223/54486 : Located on package parts, e.g. encapsulation, leads, package substrate
• CPC Class Codes: H01L 2224/16238 : the bump connector connecting to a bonding area protruding from the surface of the item
• CPC Class Codes: H01L 2224/75252 : in the upper part of the bonding apparatus, e.g. in the bonding head
• CPC Class Codes: H01L 2224/75261 : Laser
• CPC Class Codes: H01L 2224/75262 : in the lower part of the bonding apparatus, e.g. in the apparatus chuck
• CPC Class Codes: H01L 2224/75303 : of the pressing surface
• CPC Class Codes: H01L 2224/7531 : of other parts
• CPC Class Codes: H01L 2224/75314 : Auxiliary members on the pressing surface
• CPC Class Codes: H01L 2224/75317 : Removable auxiliary member
• CPC Class Codes: H01L 2224/75651 : Belt conveyor
• CPC Class Codes: H01L 2224/75753 : Means for optical alignment, e.g. sensors
• CPC Class Codes: H01L 2224/75824 : Translational mechanism
• CPC Class Codes: H01L 2224/75842 : Rotational mechanism
• CPC Class Codes: H01L 2224/75843 : Pivoting mechanism
• CPC Class Codes: H01L 2224/81191 : wherein the bump connectors are disposed only on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/81205 : Ultrasonic bonding
• CPC Class Codes: H01L 2224/81224 : using a laser
• CPC Class Codes: H01L 2224/83224 : using a laser
• CPC Class Codes: H01L 23/53242 : the principal metal being a noble metal, e.g. gold
• CPC Class Codes: H01L 23/544 : Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps test patterns for characterising or monitoring manufacturing processes H01L22/00
• CPC Class Codes: H01L 24/75 : Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 24/89 : using at least one connector not provided for in any of the groups H01L24/81 - H01L24/86
• CPC Class Codes: H01L 25/0753 : the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/405 : Wavelength
• CPC Class Codes: H01L 2933/0066 : relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

An apparatus includes a substrate and a circuit trace having a predetermined pattern disposed on the substrate. A plurality of LEDs are connected to the substrate via the circuit trace. The predetermined pattern is arranged as an array of lines along a surface of the substrate, and the plurality of LEDs are distributed along the lines of the array.

Claims

1. An apparatus, comprising:

a substrate;

a circuit trace having a predetermined pattern disposed on a surface of the substrate, the predetermined pattern being arranged as an array of lines along the surface of the substrate; and

a plurality of unpackaged LEDs connected to the substrate via the circuit trace, the plurality of LEDs being distributed along the lines of the array.

2. The apparatus according to claim 1, wherein a material of the substrate includes a polymer.

3. The apparatus according to claim 2, wherein the polymer includes one of a polyester, an acrylic, a polyimide, or a polycarbonate.

4. The apparatus according to claim 1, wherein the substrate is a flexible sheet.

5. The apparatus according to claim 1, wherein a thickness of the circuit trace ranges from about 5 microns to about 20 microns.

6. The apparatus according to claim 1, wherein a height of the plurality of unpackaged LEDs ranges from about 12.5 microns to about 200 microns.

7. The apparatus according to claim 1, wherein a manner in which at least one LED of the plurality of unpackaged LEDs is connected to the circuit trace and the substrate includes a direct transfer process in which the at least one LED is transferred directly from a surface of a wafer tape containing the at least one LED to the circuit trace on the surface of the substrate.

8. The apparatus according to claim 7, wherein steps of the direct transfer process include:

positioning the surface of the substrate to face a first surface of the wafer tape having the at least one LED thereon;

causing a needle to thrust against a second surface of the wafer tape at a position corresponding to a location of the at least one LED on the first surface of the wafer tape, the second surface of the wafer tape being opposite the first surface of the wafer tape; and

attaching the at least one LED to the substrate.

9. A display device backlighting component, the component comprising:

a flexible polymer substrate; and

a plurality of unpackaged LEDs being aligned in an array and connected to a surface of the substrate.

10. The component according to claim 9, wherein a height of the plurality of unpackaged LEDs ranges from about 12.5 microns to about 200 microns.

11. The component according to claim 9, wherein the plurality of unpackaged LEDs are electrically connected to produce light via a conductive trace.

12. The component according to claim 11, wherein the conductive trace includes a conductive ink.

13. The component according to claim 11, wherein the conductive trace includes a silver-coated copper particle.

14. The component according to claim 9, wherein the polymer substrate includes a sheet of one of polyester, an acrylic, or a polycarbonate.

15. The component according to claim 9, wherein a conductive trace is pre-formed in the array prior to the plurality of unpackaged LEDs being connected to the surface of the substrate.

16. A circuit component for a display including:

a flexible substrate,

a circuit trace having a predetermined pattern disposed on a surface of the substrate, and

a plurality of unpackaged LEDs connected to the substrate via the circuit trace, the plurality of LEDs being distributed across the surface of the substrate, and

the circuit component being formed by a method comprising;

positioning the surface of the substrate to face a first surface of a wafer tape having at least one LED of the plurality of unpackaged LEDs thereon;

causing a needle to thrust against a second surface of the wafer tape at a position corresponding to a location of the at least one LED on the first surface of the wafer tape, the second surface of the wafer tape being opposite the first surface of the wafer tape; and

attaching the at least one LED to the substrate.

17. The circuit component according to claim 16, wherein the attaching the at least one LED includes emitting energy to the circuit trace via the substrate at a position of the substrate whereon the at least one LED is being attached.

18. The circuit component according to claim 17, wherein the emitting energy included activating a laser to heat the circuit trace to a softening point.

19. The circuit component according to claim 16, wherein positioning the surface of the substrate includes:

securing the substrate in a first frame,

securing the wafer tape in a second frame, and

aligning the substrate with the wafer tape to a transfer position.

20. The circuit component according to claim 16, wherein the circuit trace is a conductive ink and a thickness of the circuit trace ranges from about 5 microns to about 20 microns.