FLUID CONNECTIONS USING GUIDE MECHANISMS

• US 20170056880A1
• Filed: 08/26/2016
• Published: 03/02/2017
• Est. Priority Date: 08/26/2015
• Status: Abandoned Application

• Current Assignee: Emulate, Inc.
• Original Assignee: Emulate, Inc.
• Inventors: Levner, Daniel, Sliz, Josiah Daniel, Hinojosa, Christopher David, Thompson, Guy Robert, Martinus van Ruijven, Petrus Wilhelmus, Solomon, Matthew Daniel, Potzner, Christian Alexander, Tuohy, Patrick Sean, Gomes, Joshua
• Application Number:
  US15/248,588
• Publication Number:
  US 20170056880A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: A01N 1/021 Preservation or perfusion media, liquids, solids or gases used in the preservation of cells, tissue, organs or bodily fluids
• CPC Class Codes: A01N 1/0247 for perfusion, i.e. for circulating fluid through organs, blood vessels or other living parts
• CPC Class Codes: B01L 2200/025 Align devices or objects to ensure defined positions relative to each other
• CPC Class Codes: B01L 2200/027 for microfluidic devices
• CPC Class Codes: B01L 2200/12 Specific details about manufacturing devices
• CPC Class Codes: B01L 2300/0681 Filter
• CPC Class Codes: B01L 2300/0887 Laminated structure
• CPC Class Codes: B01L 2300/123 Flexible; Elastomeric
• CPC Class Codes: B01L 2300/14 Means for pressure control
• CPC Class Codes: B01L 2300/161 Control and use of surface tension forces, e.g. hydrophobic, hydrophilic
• CPC Class Codes: B01L 2300/165 Specific details about hydrophobic, oleophobic surfaces
• CPC Class Codes: B01L 2400/0481 squeezing of channels or chambers
• CPC Class Codes: B01L 2400/0487 fluid pressure, pneumatics
• CPC Class Codes: B01L 2400/06 Valves, specific forms thereof
• CPC Class Codes: B01L 3/502707 characterised by the manufacture of the container or its components by shaping or joining plastic parts B29C59/00, B29C65/00; by laminating B32B37/00; manufacture of microstructural devices in general B81C
• CPC Class Codes: B01L 3/502715 characterised by interfacing components, e.g. fluidic, electrical, optical or mechanical interfaces
• CPC Class Codes: B01L 3/50273 characterised by the means or forces applied to move the fluids micropumps F04B19/006, of the membrane type F04B43/043
• CPC Class Codes: B01L 3/502738 characterised by integrated valves microvalves F16K99/0001
• CPC Class Codes: B01L 9/527 for microfluidic devices, e.g. used for lab-on-a-chip
• CPC Class Codes: C12M 21/08 for producing artificial tissue or for ex-vivo cultivation of tissue prostheses A61F2/00, grafts A61L27/00
• CPC Class Codes: C12M 23/16 : Microfluidic devices; Capillary tubes integrated microfluidic structures B01L3/5027; microreactors B01J19/0093
• CPC Class Codes: C12M 23/38 : Caps; Covers; Plugs; Pouring means
• CPC Class Codes: C12M 23/40 : Manifolds; Distribution pieces fluid transfer means B01L3/563
• CPC Class Codes: C12M 23/42 : Integrated assemblies, e.g. cassettes or cartridges
• CPC Class Codes: C12M 29/10 : Perfusion
• CPC Class Codes: C12M 35/04 : Mechanical means, e.g. sonic waves, stretching forces, pressure or shear stimuli
• CPC Class Codes: C12M 41/40 : of pressure
• CPC Class Codes: C12M 41/48 : Automatic or computerized control automatic analysis G01N35/00
• CPC Class Codes: C12N 2521/00 : Culture process characterised by the use of hydrostatic pressure, flow or shear forces
• CPC Class Codes: C12N 5/0602 : Vertebrate cells

Abstract

Drop-to-drop connection schemes are described for putting a microfluidic device in fluidic communication with a fluid source or another microfluidic device. Methods for establishing fluid connections with guide mechanisms are described.

Claims

1. A system comprising:

a) a first substrate comprising a first fluidic port,

b) a second substrate comprising a second fluidic port,

c) a guide mechanism adapted to align the first port and the second port, and

d) a retention mechanism adapted to retain the first substrate in contact with the second substrate.

2. The system of claim 1, wherein the guide mechanism is a guide track positioned on said first substrate, said guide track configured to engage a portion of said second substrate.

3. The system of claim 1, wherein the retention mechanism is a clip positioned on said second substrate, said clip configured to engage said first substrate.

4. A system comprising:

a) a first substrate comprising a first set of one or more fluidic ports,

b) a second substrate comprising a second set of one or more fluidic ports,

c) a guide mechanism adapted to align the first set of ports and the second set of ports, and

d) a retention mechanism adapted to retain the first substrate in contact with the second substrate.

5. The system of claim 4, wherein the guide mechanism is a guide track positioned on said first substrate, said guide track configured to engage a portion of said second substrate.

6. The system of claim 4, wherein the retention mechanism is a clip positioned on said second substrate, said clip configured to engage said first substrate.

7. A method for establishing a fluidic connection, comprising:

a) providing a first substrate comprising a first fluidic port, a second substrate comprising a second fluidic port, and a guide mechanism adapted to guide the second substrate,

b) engaging the second substrate with the guide mechanism,

c) aligning the first and second sets of fluidic ports by help of the guide mechanism, and

d) contacting the first and second fluidic ports to establish a fluidic connection.

8. The method of claim 7 wherein said guide mechanism comprises a guide track positioned on said first substrate, said guide track configured to engage a portion of said second substrate.

9. The method of claim 7, wherein said second substrate comprises a microfluidic device comprising a mating surface, wherein said second fluidic port is positioned on said mating surface and comprises a droplet protruding above said mating surface.

10. The method of claim 9, wherein said first substrate comprises a mating surface, wherein said first fluidic port is positioned on said mating surface and comprises a protruding droplet.

11. The method of claim 10, wherein said contacting of step d) causes a droplet-to-droplet connection when said first and second fluidic ports to establish a fluidic connection.

12. The method of claim 11, wherein said droplet-to-droplet connection does not permit air to enter said one or more fluid inlet ports.

13. The method of claim 8, wherein said aligning of step c) comprises sliding the second substrate by means of the guide track.

14. The method of claim 8, wherein said guide track comprises first and second sections, said first section shaped to support the aligning of step c), said second section shaped to support the contacting of step d).

15. The method of claim 7, wherein said second substrate comprises a retention mechanism adapted to retain the first substrate in contact with the second substrate.

16. The method of claim 15, further comprising the step of e) activating the retention mechanism.

17. A system comprising:

a) a first substrate comprising a first fluidic port,

b) a second substrate comprising a second fluidic port,

c) a third substrate configured to support said second substrate;

a) a guide mechanism adapted to align the first port with second port, and

b) a retention mechanism means adapted to retain the first substrate in contact with the second substrate.

18. The system of claim 17, wherein the guide mechanism comprises a guide track.

19. The system of claim 18, wherein the guide track is positioned on said first substrate.

20. The system of claim 19, wherein the third substrate comprises edges configured to engage said guide track.

21. The system of claim 20, wherein said retention mechanism is positioned on said third substrate.

22. The system of claim 21, wherein said retention mechanism comprises a clip configured to engage said first substrate.

23. The system of claim 21, wherein said retention mechanism comprises a clamp configured to engage said first substrate under conditions such that contact between said first and second substrates is maintained.

24. The system of claim 21, wherein said retention mechanism comprises a stud configured to engage a hole on said first substrate.

25. The system of claim 21, wherein said retention mechanism engages a portion of said first substrate in a friction fit.

26. The system of claim 21, wherein said retention mechanism is selected from the group consisting of an adhesive, a heat stake, and a screw.

27. The system of claim 26, wherein said adhesive is a laminate.

28. An assembly, comprising:

a) a first substrate comprising a first fluidic port and a guide mechanism, said first substrate positioned against and in contact with

b) a second substrate comprising a second fluidic port, wherein said first and second ports are aligned so as to permit fluidic communication, said second substrate supported by

c) a carrier, said carrier comprising a portion engaging said guide mechanism of said first substrate.

29. The assembly of claim 28, wherein said carrier further comprises a retention mechanism for retaining said contact between said first and second substrates.

30. The assembly of claim 28, wherein the guide mechanism comprises a guide track.

31. The assembly of claim 30, wherein the guide track is positioned on one or more sides of said first substrate.

32. The assembly of claim 31, wherein the carrier portion engaging said first substrate comprises one or more edges configured to engage said guide track.

33. The assembly of claim 28, wherein said retention mechanism comprises a clip configured to engage said first substrate.

34. The assembly of claim 28, wherein said retention mechanism comprises a clamp configured to engage said first substrate.

35. The assembly of claim 28, wherein said retention mechanism comprises a stud configured to engage a hole on said first substrate.

36. The assembly of claim 28, wherein said retention mechanism engages a portion of said first substrate in a friction fit.

37. The assembly of claim 28, wherein said retention mechanism is selected from the group consisting of an adhesive, a heat stake, and a screw.

38. The assembly of claim 37, wherein said adhesive is a laminate.

39. A method for establishing a fluidic connection, comprising:

a) providing a first substrate comprising a first fluidic port, a second substrate comprising a second fluidic port, a third substrate configured to support said second substrate, and a guide mechanism;

b) aligning said first and second ports with said guide mechanism; and

c) contacting said first port with said second port under conditions such that a fluidic connection is established between said first and second substrate.

40. The method of claim 39, wherein the guide mechanism comprises a guide track.

41. The method of claim 40, wherein the guide track is positioned on said first substrate.

42. The method of claim 41, wherein the third substrate comprises edges configured to engage said guide track.

43. The method of claim 42, wherein said aligning of step b) comprises sliding said third substrate by means of said guide track.

44. The method of claim 41, wherein said guide track comprises first and second sections, said first section shaped to support the aligning of step b), said second section shaped to support the contacting of step c).

45. The method of claim 44, wherein said first section is linear and said second section is curved.

46. The method of claim 39, wherein said guide mechanism comprises a mechanism on which said third substrate rotates or pivots during step d).

47. The method of claim 46, wherein said guide mechanism comprises a hinge.

48. The method of claim 39, wherein said third substrate further comprises a retention mechanism for retaining alignment of said first and second ports.

49. The method of claim 48, wherein said retention mechanism comprises a clip configured to engage said first substrate.

50. The method of claim 48, wherein said retention mechanism comprises a clamp configured to engage said first substrate under conditions such that contact between said first and second substrates is maintained.

51. The method of claim 48, wherein said retention mechanism comprises a stud configured to engage a hole on said first substrate.

52. The method of claim 48, wherein said retention mechanism engages a portion of said first substrate in a friction fit.

53. The method of claim 48, wherein said retention mechanism is selected from the group consisting of an adhesive, a heat stake, and a screw.

54. The method of claim 53, wherein said adhesive is a laminate.

55. The method of claim 39, wherein said second substrate comprises a microfluidic device comprising a mating surface, wherein said second fluidic port is positioned on said mating surface and comprises a droplet protruding above said mating surface.

56. The method of claim 55, wherein said first substrate comprises a mating surface, wherein said first fluidic port is positioned on said mating surface and comprises a protruding droplet.

57. The method of claim 56, wherein said contacting of step c) causes a droplet-to-droplet connection when said first and second fluidic ports to establish a fluidic connection.

58. The method of claim 57, wherein said droplet-to-droplet connection does not permit air to enter said one or more fluid inlet ports.

59. A method for establishing a fluidic connection, comprising:

a) providing a first substrate comprising a guide mechanism and a first fluidic port on a first mating surface, a second substrate comprising a second fluidic port on a second mating surface and a bottom surface, and a carrier in contact with said bottom surface of said second substrate, said carrier comprising a retention mechanism and one or more edges for engaging said guide mechanism;

b) engaging said guide mechanism of said first substrate with one or more edges of said carrier;

c) aligning said first and second ports with said guide mechanism;

d) contacting said first mating surface with said second mating surface under conditions such that said first port contacts said second port and a fluidic connection is established between said first and second substrate.

60. The method of claim 59, wherein the guide mechanism comprises a guide track.

61. The method of claim 60, wherein the guide track is positioned on one or more sides of said first substrate.

62. The method of claim 61, wherein the carrier comprises one or more edges configured to engage said guide track.

63. The method of claim 62, wherein said aligning of step c) comprises sliding said carrier by means of said guide track.

64. The method of claim 63, wherein said guide track comprises first and second sections, said first section shaped to support the aligning of step c), said second section shaped to support the contacting of step d).

65. The method of claim 64, wherein said first section is linear and said second section is curved.

66. The method of claim 59, wherein said guide mechanism comprises a mechanism on which said carrier rotates or pivots during step d).

67. The method of claim 66, wherein said guide mechanism comprises a hinge.

68. The method of claim 59, further comprising the step of e) activating said retention mechanism under condition such that said alignment of said first and second ports is retained.

69. The method of claim 59, wherein said retention mechanism comprises a clip configured to engage said first substrate.

70. The method of claim 59, wherein said retention mechanism comprises a clamp configured to engage said first substrate under conditions such that contact between said first and second substrates is maintained.

71. The method of claim 59, wherein said retention mechanism comprises a stud configured to engage a hole on said first substrate.

72. The method of claim 59, wherein said retention mechanism engages a portion of said first substrate in a friction fit.

73. The method of claim 59, wherein said retention mechanism is selected from the group consisting of an adhesive, a heat stake, and a screw.

74. The method of claim 73, wherein said adhesive is a laminate.

75. The method of claim 59, wherein said second fluidic port comprises a droplet protruding above said mating surface of said second substrate

76. The method of claim 75, wherein said first fluidic port comprises a protruding droplet.

77. The method of claim 76, wherein said contacting of step d) causes a droplet-to-droplet connection when said first and second fluidic ports to establish a fluidic connection.

78. The method of claim 77, wherein said droplet-to-droplet connection does not permit air to enter said one or more fluid inlet ports.