MASK CLEANING
First Claim
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1. A lithography system comprising:
- a load lock chamber comprising an opening configured to receive a mask;
an exposure module configured to expose a semiconductor wafer to a light source through use of the mask; and
a cleaning module embedded inside the lithography tool, the cleaning module being configured to clean carbon particles from the mask.
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Abstract
A lithography system includes a load lock chamber comprising an opening configured to receive a mask, an exposure module configured to expose a semiconductor wafer to a light source through use of the mask, and a cleaning module embedded inside the lithography tool, the cleaning module being configured to clean carbon particles from the mask.
13 Citations
20 Claims
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1. A lithography system comprising:
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a load lock chamber comprising an opening configured to receive a mask; an exposure module configured to expose a semiconductor wafer to a light source through use of the mask; and a cleaning module embedded inside the lithography tool, the cleaning module being configured to clean carbon particles from the mask. - View Dependent Claims (2, 3, 5, 6, 7, 8, 9, 10)
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4. The lithography system of claim I, wherein the cleaning module is located within a discrete chamber positioned along a mask path between the load lock chamber and the exposure module.
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11. A lithography system comprising:
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an opening; an exposure module to expose a wafer to a light source; a robotic mechanism to move a mask between the opening and the exposure module; a cleaning module; and a control system comprising a processor and a memory comprising machine readable instructions that when executed by the processor to; cause the robotic mechanism to receive the mask through the opening; cause the robotic mechanism to place the mask in the cleaning module; and cause the cleaning module to clean the mask. - View Dependent Claims (12, 13, 14, 15, 16, 17)
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18. A method comprising:
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loading a mask into a lithography tool; while the mask is in the lithography tool, causing the mask to be within a vacuum environment; using a gas to remove carbon particles from a surface of the mask while the mask is in the lithography tool; and while keeping the mask in a vacuum environment, transferring the mask to an exposure module for implementing a lithography exposure process using the mask. - View Dependent Claims (19, 20)
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Specification