CAPACITIVE SENSOR ARCHITECTURE FOR BIOMETRIC SENSING

• US 20170061187A1
• Filed: 12/18/2015
• Published: 03/02/2017
• Est. Priority Date: 08/28/2015
• Status: Active Grant

• Current Assignee: Synaptics Incorporated
• Original Assignee: Synaptics Incorporated
• Inventors: Wen, Shengmin
• Granted Patent: US 9,785,821 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: G06V 40/1306 non-optical, e.g. ultrasonic or capacitive sensing

Abstract

A capacitive sensor a method of making a capacitive sensor are disclosed. The capacitive sensor includes: a plurality of rows of sensor electrodes included in a first layer; a plurality of columns of sensor electrodes included in a second layer, where the plurality of columns of sensor electrodes are arranged orthogonally to the plurality of rows of sensor electrodes to form a two-dimensional sensing array; and, a plurality of conductive elements included in a third layer disposed between the first and second layers, wherein, for each conductive element of the plurality of conductive elements, a first end of the conductive element is electrically connected to a sensor electrode in the plurality of rows of sensor electrodes and a second end of the conductive element is capacitively coupled to a sensor electrode in the plurality of columns of sensor electrodes to form a trans-capacitive sensing pixel of the two-dimensional sensing array.

Claims

1. A capacitive sensor, comprising:

a plurality of rows of sensor electrodes included in a first layer;

a plurality of columns of sensor electrodes included in a second layer, wherein the plurality of columns of sensor electrodes are arranged orthogonally to the plurality of rows of sensor electrodes to form a two-dimensional sensing array; and

a plurality of conductive elements included in a third layer disposed between the first layer and the second layer, wherein, for each conductive element of the plurality of conductive elements, a first end of the conductive element is electrically connected to a sensor electrode in the plurality of rows of sensor electrodes and a second end of the conductive element is capacitively coupled to a sensor electrode in the plurality of columns of sensor electrodes to form a trans-capacitive sensing pixel of the two-dimensional sensing array.

2. The capacitive sensor of claim 1, further comprising a cover layer, wherein the second layer is closer to the cover layer than the first layer.

3. The capacitive sensor of claim 1, wherein the plurality of rows of sensor electrodes comprises receiver electrodes and the plurality of columns of sensor electrodes comprises transmitter electrodes.

4. The capacitive sensor of claim 1, wherein the plurality of columns of sensor electrodes comprises receiver electrodes and the plurality of rows of sensor electrodes comprises transmitter electrodes.

5. The capacitive sensor of claim 1, wherein each conductive element in the plurality of conductive element comprises a via that extends through a thickness of the third layer.

6. The capacitive sensor of claim 1, further comprising:

a plurality of plates included in the second layer, wherein each of the plates is electrically connected to a conductive element in the plurality of conductive elements and capacitively coupled to a sensor electrode in the plurality of columns of sensor electrodes.

7. The capacitive sensor of claim 6, wherein:

each of the plates comprises a metal pad electrically connected to a single conductive element in the plurality of conductive elements;

or

each of the plates comprises a metal trace electrically connected to multiple conductive elements in the plurality of conductive elements.

8. The capacitive sensor of claim 1, wherein the two-dimensional sensing array has a resolution configured to capture features of a fingerprint.

9. A method of making a capacitive sensor, the method comprising:

forming a first conductive layer on a first dielectric layer, wherein the first conductive layer includes a plurality of rows of sensor electrodes;

forming a second dielectric layer over the first conductive layer;

forming a second conductive layer over the second dielectric layer, wherein the second conductive layer includes a plurality of columns of sensor electrodes, and the plurality of columns of sensor electrodes are arranged orthogonally to the plurality of rows of sensor electrodes to form a two-dimensional sensing array; and

forming a plurality of conductive vias in the second dielectric layer between the first conductive layer and the second conductive layer, wherein, for each conductive via of the plurality of conductive vias, a first end of the conductive via is electrically connected to a sensor electrode in the plurality of rows of sensor electrodes and a second end of the conductive via is capacitively coupled to a sensor electrode in the plurality of columns of sensor electrodes to form a trans-capacitive sensing pixel of the two-dimensional sensing array.

10. The method of claim 9, wherein forming the plurality of conductive vias comprises drilling a through hole to a sensor electrode in the first conductive layer at each trans-capacitive sensing pixel in the two-dimensional array and plating the through hole at each trans-capacitive sensing pixel in the two-dimensional array.

11. The method of claim 9, wherein forming the plurality of conductive vias comprises building up a via from a sensor electrode in the first conductive layer at each trans-capacitive sensing pixel in the two-dimensional array, and wherein forming the second dielectric layer comprises filling dielectric between the conductive vias at each trans-capacitive sensing pixel in the two-dimensional array.

12. The method of claim 9, wherein the second conductive layer further includes a plurality of plates, wherein each of the plates is electrically connected to a conductive via and capacitively coupled to a sensor electrode in the plurality of columns of sensor electrodes.

13. The method of claim 9, further comprising:

forming a cover layer over the second conductive layer and the plurality of conductive vias, wherein an input object placed on or near the cover layer alters an electric field near the plurality of columns of sensor electrodes.

14. The method of claim 9, wherein the plurality of rows of sensor electrodes comprises receiver electrodes and the plurality of columns of sensor electrodes comprises transmitter electrodes.

15. The method of claim 9, wherein the plurality of columns of sensor electrodes comprises receiver electrodes and the plurality of rows of sensor electrodes comprises transmitter electrodes.

16. A capacitive sensor, comprising:

a first layer comprising a plurality of rows of transmitter electrodes;

a second layer disposed above the first layer comprising a plurality of columns of receiver electrodes, wherein the plurality of columns of transmitter electrodes overlap the plurality of rows of receiver electrodes to form a two-dimensional sensing array having a resolution configured to capture features of an input;

a plurality of conductive vias between the first layer to the second layer, the plurality of conductive vias comprising a conductive via disposed at a sensing pixel of the two-dimensional sensing array, wherein the conductive via has a first end capacitively coupled to a receiver electrode in the plurality of columns of receiver electrodes and a second end electrically connecting a transmitter electrode of the plurality of rows of transmitter electrodes;

a cover layer disposed above the second layer, wherein the cover layer comprises a top surface that forms an input surface for the input and a dielectric separating the top surface from the conductive vias and the second layer;

driver circuitry connected to the transmitter electrodes, wherein the driver circuitry is configured to drive a transmitter signal onto the transmitter electrodes; and

receiver circuitry connected to the receiver electrodes, wherein the receiver circuitry is configured to process resulting signals corresponding to the transmitter signals, wherein the resulting signals vary based on presence of the input at the top surface of the cover layer.

17. The capacitive sensor of claim 16, wherein the plurality of conductive vias are formed by drilling a through hole to a transmitter electrode in the plurality of rows of transmitter electrodes at each sensing pixel in the two-dimensional array and plating the through hole at each sensing pixel in the two-dimensional array.

18. The capacitive sensor of claim 16, wherein the second layer further includes a plurality of plates, wherein each of the plates is electrically connected to a conductive via and capacitively coupled to a receiver electrode in the plurality of columns of receiver electrodes.

19. The capacitive sensor of claim 16, wherein the capacitive sensor comprises a fingerprint sensor and the input comprises a finger.

20. The capacitive sensor of claim 19, wherein the resulting signals vary based on presence of fingerprint ridges or fingerprint valleys of the finger at the top surface of the cover layer.