FINGERPRINT SENSOR UNDER THIN FACE-SHEET WITH APERTURE LAYER
First Claim
1. An input device for fingerprint sensing and proximity sensing, the input device comprising:
- a glass cover layer, wherein a top surface of the glass cover layer is configured to provide an input surface for a finger;
a printed circuit board disposed below the glass cover layer, the printed circuit board comprising a cavity;
a fingerprint sensor disposed below the glass cover layer and disposed in the cavity of the printed circuit board layer;
a first adhesive layer disposed between a top surface of the fingerprint sensor and a bottom surface of the glass cover layer, the first adhesive layer being disposed in a fingerprint sensing area that is within an area of the cavity; and
a second adhesive layer disposed between a top surface of the printed circuit board and the bottom surface of the glass cover layer, the second adhesive layer being disposed in a proximity sensing area that is outside of the area of the cavity.
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Accused Products
Abstract
An input device for fingerprint sensing and proximity sensing includes a cover layer, where a top surface of the cover layer is configured to provide an input surface for a finger, a substrate having a cavity disposed below the cover layer, and a fingerprint sensor disposed below the cover layer and in the cavity of the substrate. A first adhesive layer is disposed between a top surface of the fingerprint sensor and a bottom surface of the cover layer in a fingerprint sensing area. A second adhesive layer is disposed between a top surface of the substrate and the bottom surface of the cover layer in a proximity sensing area.
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Citations
25 Claims
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1. An input device for fingerprint sensing and proximity sensing, the input device comprising:
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a glass cover layer, wherein a top surface of the glass cover layer is configured to provide an input surface for a finger; a printed circuit board disposed below the glass cover layer, the printed circuit board comprising a cavity; a fingerprint sensor disposed below the glass cover layer and disposed in the cavity of the printed circuit board layer; a first adhesive layer disposed between a top surface of the fingerprint sensor and a bottom surface of the glass cover layer, the first adhesive layer being disposed in a fingerprint sensing area that is within an area of the cavity; and a second adhesive layer disposed between a top surface of the printed circuit board and the bottom surface of the glass cover layer, the second adhesive layer being disposed in a proximity sensing area that is outside of the area of the cavity. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. An input device for fingerprint sensing and proximity sensing, the input device comprising:
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a cover layer, wherein a top surface of the cover layer is configured to provide an input surface for a finger; a substrate disposed below the cover layer, the substrate comprising a cavity; a fingerprint sensor disposed below the cover layer and disposed in the cavity of the substrate; a first adhesive layer disposed between a top surface of the fingerprint sensor and a bottom surface of the cover layer, the first adhesive layer being disposed in a fingerprint sensing area that is within an area of the cavity; and a second adhesive layer disposed between a top surface of the substrate and the bottom surface of the cover layer, the second adhesive layer being disposed in a proximity sensing area that is outside of the area of the cavity. - View Dependent Claims (18, 19, 20, 21, 22, 23, 24, 25)
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Specification