METHOD MANUFACTURING LIGHT EMITTING DIODE HAVING SUPPORTING LAY7ER ATTACHED TO TEMPORARY ADHESIVE
First Claim
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1. A method for manufacturing at least one light emitting diode (LED), the method comprising:
- epitaxially growing at least one light emitting diode (LED) structure on a growth substrate, wherein the LED structure has a top surface away from the growth substrate;
forming at least one supporting layer on the LED structure;
temporarily adhering the supporting layer to a carrier substrate through an adhesive layer, wherein the supporting layer has a Young'"'"'s modulus greater than that of the adhesive layer, and a shortest distance between the adhesive layer and the growth substrate is greater than a shortest distance between the top surface of the LED structure and the growth substrate; and
removing the growth substrate from the LED structure.
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Abstract
A method for manufacturing at least one light emitting diode (LED) includes epitaxying at least one light emitting diode (LED) structure on a growth substrate; forming at least one supporting layer on the LED structure; temporarily adhering the supporting layer to a carrier substrate through an adhesive layer, in which the supporting layer has a Young'"'"'s modulus greater than that of the adhesive layer; and removing the growth substrate from the LED structure.
32 Citations
20 Claims
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1. A method for manufacturing at least one light emitting diode (LED), the method comprising:
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epitaxially growing at least one light emitting diode (LED) structure on a growth substrate, wherein the LED structure has a top surface away from the growth substrate; forming at least one supporting layer on the LED structure; temporarily adhering the supporting layer to a carrier substrate through an adhesive layer, wherein the supporting layer has a Young'"'"'s modulus greater than that of the adhesive layer, and a shortest distance between the adhesive layer and the growth substrate is greater than a shortest distance between the top surface of the LED structure and the growth substrate; and removing the growth substrate from the LED structure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. An intermediate light emitting diode (LED) comprising:
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a carrier substrate; at least one LED structure; a supporting layer disposed between the LED structure and the carrier substrate; and an adhesive layer temporarily adhering a combination of the supporting layer and the LED structure to the carrier substrate, wherein the supporting layer has a Young'"'"'s modulus greater than that of the adhesive layer. - View Dependent Claims (18, 19, 20)
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Specification