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PACKAGE PROGRAMMABLE DECOUPLING CAPACITOR ARRAY

  • US 20170063355A1
  • Filed: 08/28/2015
  • Published: 03/02/2017
  • Est. Priority Date: 08/28/2015
  • Status: Active Grant
First Claim
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1. A semiconductor chip, comprising:

  • an integrated circuit disposed on a packaging substrate; and

    a power distribution network that is electrically connectable to the integrated circuit via a programmable connectivity array via the packaging substrate the programmable connectivity array comprising an array of on-die programmable decoupling capacitors formed on the semiconductor chip.

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