MEMS DEVICE, LIQUID EJECTING HEAD, LIQUID EJECTING APPARATUS, AND MANUFACTURING METHOD OF MEMS DEVICE

• US 20170066239A1
• Filed: 09/07/2016
• Published: 03/09/2017
• Est. Priority Date: 09/08/2015
• Status: Abandoned Application

• Current Assignee: Seiko Epson Corporation (Seiko Group)
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: HIRAI, Eiju, HAMAGUCHI, Toshiaki
• Application Number:
  US15/258,697
• Publication Number:
  US 20170066239A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: B41J 2/14233 of film type, deformed by bending and disposed on a diaphragm
• CPC Class Codes: B41J 2/161 of film type, deformed by bending and disposed on a diaphragm
• CPC Class Codes: B41J 2/1623 bonding and adhesion
• CPC Class Codes: B41J 2/1626 etching
• CPC Class Codes: B41J 2/1631 photolithography
• CPC Class Codes: B41J 2/1632 machining
• CPC Class Codes: B41J 2/1642 thin film formation by CVD [chemical vapor deposition]
• CPC Class Codes: B41J 2/1646 thin film formation by sputtering
• CPC Class Codes: B41J 2002/14491 Electrical connection

Abstract

A MEMS device includes a first substrate which has a first electrode and a protective layer that covers the first electrode; a second substrate that is disposed laminated on the first substrate and that has a second electrode that is electrically connected to the first electrode; and a photosensitive adhesive which joins the protective layer and the second substrate, in which a joining surface of the protective layer which is joined by the photosensitive adhesive is flat.

Claims

1. A MEMS device comprising:

a first substrate which has a first electrode and a protective layer that covers the first electrode;

a second substrate that is disposed laminated on the first substrate and that has a second electrode that is electrically connected to the first electrode; and

a photosensitive adhesive which joins the protective layer and the second substrate,

wherein a joining surface of the protective layer which is joined by the photosensitive adhesive is flat.

2. The MEMS device according to claim 1,

wherein the first electrode is electrically connected to the second electrode via a bump electrode that is formed on the surface on the opposite side from the first electrode side of the protective layer.

3. The MEMS device according to claim 1,

wherein the first substrate has a driving circuit.

4. A liquid ejecting head that is the MEMS device according to claim 1,

wherein the second substrate is provided with a piezoelectric element that is electrically connected to the second electrode and generates pressure variation in liquid within a pressure generating chamber.

5. A liquid ejecting head that is the MEMS device according to claim 2,

wherein the second substrate is provided with a piezoelectric element that is electrically connected to the second electrode and generates pressure variation in liquid within a pressure generating chamber.

6. A liquid ejecting head that is the MEMS device according to claim 3,

wherein the second substrate is provided with a piezoelectric element that is electrically connected to the second electrode and generates pressure variation in liquid within a pressure generating chamber.

7. The liquid ejecting head according to claim 4,

wherein the photosensitive adhesive is formed to enclose the piezoelectric element.

8. A liquid ejecting apparatus comprising:

the lid ejecting head according to claim 4.

9. A liquid ejecting apparatus comprising:

the lid ejecting head according to claim 5.

10. A liquid ejecting apparatus comprising:

the lid ejecting head according to claim 6.

11. A liquid ejecting apparatus comprising:

the lid ejecting head according to claim 7.

12. A manufacturing method of a MEMS device which includes a first substrate that has the protective layer, a second substrate that is disposed laminated on the first substrate, and a photosensitive adhesive which joins the protective layer and the second substrate, the manufacturing method comprising:

forming the protective layer on the first substrate and carrying out a process for flattening;

coating the second substrate with the photosensitive adhesive and patterning by photolithography; and

curing in a state in which the photosensitive adhesive abuts the flat joining surface of the protective layer.