THERMAL DISSIPATION MODULE

• US 20170074596A1
• Filed: 08/02/2016
• Published: 03/16/2017
• Est. Priority Date: 09/16/2015
• Status: Abandoned Application

• Current Assignee: Acer, Inc.
• Original Assignee: Acer, Inc.
• Inventors: Wang, Yung-Chih, Ke, Jau-Han, Liao, Wen-Neng, Hsieh, Cheng-Wen
• Application Number:
  US15/226,501
• Publication Number:
  US 20170074596A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: F28D 15/02 in which the medium condenses and evaporates, e.g. heat pipes heat pipes used in solar heat collectors F24S10/95; in radiators F28D1/0226; in nuclear reactors G21C15/257
• CPC Class Codes: F28D 15/025 having non-capillary condensate return means
• CPC Class Codes: F28D 15/0266 with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers F28D15/043 takes precedence
• CPC Class Codes: F28D 2021/0028 for cooling heat generating elements, e.g. for cooling electronic components or electric devices
• CPC Class Codes: F28F 1/006 with variable shape, e.g. with modified tube ends, with different geometrical features F28F1/025, F28F1/06, F28F1/08, F28F9/16, F28F9/18 take precedence
• CPC Class Codes: F28F 13/08 by varying the cross-section of the flow channels
• CPC Class Codes: G06F 1/203 for portable computers, e.g. for laptops
• CPC Class Codes: H05K 7/20336 Heat pipes, e.g. wicks or capillary pumps

Abstract

A heat dissipation module used for an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator, a pipe, and a working fluid. The evaporator thermally contacts the heat source and absorbs heat generated from the heat source. The evaporator has a chamber connected to the pipe to form a loop, and the working fluid is filled in the loop. A structure of the chamber located at a connection portion between the chamber and the pipe gradually converges towards the pipe in relation to other structure of the chamber.

Claims

1. A heat dissipation module, adapted to be used in an electronic device, the electronic device having a heat source, the heat dissipation module comprising:

an evaporator, thermally contacting the heat source to absorb heat generated from the heat source, and the evaporator having a chamber;

a pipe, connected to the chamber to form a loop, wherein a structure at a connection portion between the chamber and the pipe presents a profile gradually converging towards the pipe in relation to other structure of the chamber; and

a working fluid, filled in the loop.

2. The heat dissipation module as recited in claim 1, wherein the evaporator has a pair of openings located at two opposite sides of the chamber, two opposite ends of the pipe are respectively connected to the pair of openings to form the loop, and the gradually converging profile comprises at least one guiding surface tilting from the chamber towards each of the openings.

3. The heat dissipation module as recited in claim 2, wherein the evaporator has a first opening and a second opening, the at least one guiding surface comprises a first guiding surface, a second guiding surface and a third guiding surface, the first guiding surface and the second guiding surface are located at two opposite sides of the second opening, and the third guiding surface is adjacent to first opening.

4. The heat dissipation module as recited in claim 3, wherein the chamber is divided into a heating zone and a flowing zone, the second guiding surface and the third guiding surface are located in the heating zone, the first guiding surface is located in the flowing zone, and the pipe is connected to the flowing zone.

5. The heat dissipation module as recited in claim 4, wherein the evaporator further comprising:

a plurality of heat conducting members, disposed at the heating zone and located between the second guiding surface and the third guiding surface.

6. The heat dissipation module as recited in claim 1, further comprising:

a heat pipe, thermally contacting between the heat source and the evaporator to transfer the heat generated from the heat source to the evaporator.

7. A heat dissipation module, adapted to be used in an electronic device, the electronic device having a heat source, the heat dissipation module comprising:

an evaporator, thermally contacting the heat source;

a pipe, having two opposite end portions to connect to the evaporator to form a loop, at least one of the end portions of the pipe gradually converging towards the evaporator; and

a working fluid, filled in the loop.

8. The heat dissipation module as recited in claim 7, wherein the pipe comprising the two end portions and a main segment connected therebetween, and a pipe diameter of the main segment is greater than or equal to a chamber thickness of the evaporator and is greater than a pipe diameter of each of the end portions.

9. The heat dissipation module as recited in claim 8, further comprising:

a plate body, covering the heat source, and the main segment of the pipe thermally contacts the plate body.

10. The heat dissipation module as recited in claim 9, further comprising:

a heat pipe, thermally contacting between the heat source and the evaporator to transfer heat generated from the heat source to the evaporator, and a portion of the heat pipe thermally contacting the plate body.