SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE
First Claim
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1. A semiconductor device, comprising:
- a chip mounting portion;
a first semiconductor chip mounted over the chip mounting portion and including a power transistor;
a second semiconductor chip mounted over the chip mounting portion to control the first semiconductor chip; and
a sealing body sealing therein the first and second semiconductor chips and at least a part of the chip mounting portion,wherein a first thickness of a first portion of the chip mounting portion over which the first semiconductor chip is mounted is smaller than a second thickness of a second portion of the chip mounting portion over which the second semiconductor chip is mounted.
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Abstract
An improvement is achieved in the reliability of a semiconductor device. Over a die pad, first and second semiconductor chips are mounted. The first and second semiconductor chips and a part of the die pad are sealed in a sealing portion. The first semiconductor chip includes a power transistor. The second semiconductor chip controls the first semiconductor chip. The thickness of the portion of the die pad over which the first semiconductor chip is mounted is smaller than the thickness of the portion of the die pad over which the second semiconductor chip is mounted.
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Citations
19 Claims
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1. A semiconductor device, comprising:
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a chip mounting portion; a first semiconductor chip mounted over the chip mounting portion and including a power transistor; a second semiconductor chip mounted over the chip mounting portion to control the first semiconductor chip; and a sealing body sealing therein the first and second semiconductor chips and at least a part of the chip mounting portion, wherein a first thickness of a first portion of the chip mounting portion over which the first semiconductor chip is mounted is smaller than a second thickness of a second portion of the chip mounting portion over which the second semiconductor chip is mounted. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A semiconductor device, comprising:
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a chip mounting portion; a first semiconductor chip mounted over the chip mounting portion; a second semiconductor chip mounted over the chip mounting portion; and a sealing body sealing therein the first and second semiconductor chips and at least a part of the chip mounting portion, wherein an amount of heat generated in the first semiconductor chip during an operation thereof is larger than an amount of heat generated in the second semiconductor chip during an operation thereof, and wherein a thickness of a first portion of the chip mounting portion over which the first semiconductor chip is mounted is smaller than a thickness of a second portion of the chip mounting portion over which the second semiconductor chip is mounted. - View Dependent Claims (9, 10)
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11. An electronic device, comprising:
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a wiring substrate; and a semiconductor device mounted over a first main surface of the wiring substrate, wherein the semiconductor device includes; a chip mounting portion having a second main surface and a third main surface opposite to the second main surface; a first semiconductor chip mounted over the second main surface of the chip mounting portion and including a power transistor; a second semiconductor chip mounted over the second main surface of the chip mounting portion to control the first semiconductor chip; and a sealing body sealing therein the first and second semiconductor chips and at least a part of the chip mounting portion, wherein the third main surface of the chip mounting portion of the semiconductor device is exposed from the sealing body, wherein the wiring substrate has first and second electrodes formed over the first main surface and isolated from each other, wherein a first portion of the chip mounting portion is bonded to the first electrode via a first conductive bonding layer, wherein a second portion of the chip mounting portion is bonded to the second electrode via a second conductive bonding layer, wherein the first semiconductor chip is mounted over the first portion of the chip mounting portion, and wherein the second semiconductor chip is mounted over the second portion of the chip mounting portion. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19)
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Specification