LIGHT-EMITTING APPARATUS, ILLUMINATION APPARATUS, AND METHOD OF MANUFACTURING LIGHT-EMITTING APPARATUS

• US 20170077369A1
• Filed: 09/07/2016
• Published: 03/16/2017
• Est. Priority Date: 09/10/2015
• Status: Abandoned Application

• Current Assignee: Panasonic Intellectual Property Management Co., Ltd. (Panasonic Holdings Corporation)
• Original Assignee: Panasonic Intellectual Property Management Co., Ltd. (Panasonic Holdings Corporation)
• Inventors: NAGAHAMA, Katsuyuki
• Application Number:
  US15/258,567
• Publication Number:
  US 20170077369A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/45139 Silver (Ag) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48095 Kinked
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/49113 the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 24/85 using a wire connector wire bonding in general B23K20/004
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A light-emitting apparatus includes: a substrate; targets to be connected (LED chips and wiring), mounted on the substrate and arranged linearly; wires that individually connect adjacent ones of the targets to each other; and a sealing member provided on the substrate and sealing the targets and the wires. At least one of the wires in a region of the sealing member corresponding to one of ends of a line of the targets is a first wire, at least one of the wires in a region of the sealing member corresponding to the other of the ends is a second wire, and each of the first and second wires has a standing portion attached to one of the targets that is the inner one in the sealing member, and an inclined portion attached to the other of the targets that is the outer one in the sealing member.

Claims

1. A light-emitting apparatus comprising:

a substrate;

a plurality of targets to be connected, mounted on the substrate and arranged linearly;

a plurality of wires that connect the plurality of targets in series by individually connecting adjacent ones of the plurality of targets to each other; and

a sealing member provided on the substrate and sealing the plurality of targets and the plurality of wires,

wherein the plurality of wires includes at least a first wire and a second wire,

the first wire is included in a region of the sealing member corresponding to one of ends of a line of the plurality of targets,

the second wire is included in a region of the sealing member corresponding to the other of the ends,

each of the first wire and the second wire has a standing portion attached to one of targets, and an inclined portion attached to an other of the targets, and

the one of the targets is located at an inner position in the sealing member than the other of the targets in a plan view.

2. The light-emitting apparatus according to claim 1,

wherein the plurality of targets include a plurality of light-emitting elements and a conductive layer provided on the substrate.

3. The light-emitting apparatus according to claim 1,

wherein the first wire and the second wire are positioned to give the plurality of wires line symmetry with respect to a vertical line passing through a center of a line of the plurality of wires.

4. The light-emitting apparatus according to claim 1, further comprising

a dam member provided on the substrate and surrounding the plurality of targets and the plurality of wires,

wherein in a region surrounded by the dam member, the plurality of targets and the plurality of wires are provided in a plurality of lines, and

the sealing member fills the region surrounded by the dam member.

5. The light-emitting apparatus according to claim 4,

wherein the plurality of lines of the plurality of targets and the plurality of wires intersect one another and are radially arranged.

6. An illumination apparatus comprising:

the light-emitting apparatus according to claim 1.

7. A method of manufacturing a light-emitting apparatus according to claim 1, comprising, when connecting the plurality of targets to each other by forming the plurality of wires by wire bonding;

forming the standing portion of each of the first wire and the second wire by first bonding in the wire bonding; and

forming the inclined portion of each of the first wire and the second wire by second bonding in the wire bonding.