LIGHT SOURCE, METHOD OF MANUFACTURING THE LIGHT SOURCE, AND METHOD OF MOUNTING THE LIGHT SOURCE

• US 20170077372A1
• Filed: 11/03/2016
• Published: 03/16/2017
• Est. Priority Date: 09/30/2014
• Status: Active Grant

• Current Assignee: Nichia Corporation
• Original Assignee: Nichia Corporation
• Inventors: HOSOTANI, Takuji
• Granted Patent: US 10,833,235 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/13144 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/13147 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 24/13 of an individual bump connector
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/3512 Cracking
• CPC Class Codes: H01L 2933/0033 relating to semiconductor body packages
• CPC Class Codes: H01L 2933/005 relating to encapsulations
• CPC Class Codes: H01L 2933/0066 relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 2933/0075 relating to heat extraction or cooling elements
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/641 characterized by the materials

Abstract

A light source includes a light emitting element configured to emit a light; a mounting substrate; and a ceramic substrate having a light emitting element mounted thereon and being bonded to the mounting substrate via a plurality of metal bumps made of gold, copper, a gold alloy, or a copper alloy. A method of manufacturing a light source includes forming a plurality of metal bumps on a mounting substrate; providing a ceramic substrate having at least one light emitting element mounted thereon; and bonding the mounting substrate and a ceramic substrate to each other via the metal bumps.

Claims

1. A method of manufacturing a light source comprising:

forming a plurality of metal bumps on a mounting substrate;

providing a ceramic substrate having at least one light emitting element mounted thereon; and

bonding the mounting substrate and a ceramic substrate to each other via the metal bumps.

2. The method of manufacturing a light source according to claim 1, further comprising, after the bonding step, filling a space between the metal bumps with a resin.

3. A method of manufacturing a light source comprising:

forming a plurality of metal bumps on a mounting substrate;

placing a ceramic substrate on the mounting substrate;

bonding the mounting substrate and the ceramic substrate to each other via the metal bumps; and

mounting at least one light-emitting element on the ceramic substrate.

4. The method of manufacturing a light source according to claim 3, further comprising, after the bonding step, filling space between the metal bumps with a resin.

5. A method of manufacturing a light source comprising:

forming a plurality of metal bumps made of gold, copper, a gold alloy, or a copper alloy on a ceramic substrate;

placing the ceramic substrate on a mounting substrate;

bonding the mounting substrate and the ceramic substrate to each other via the metal bumps; and

mounting at least one light-emitting element on the ceramic substrate.

6. The method of manufacturing a light source according to claim 5, further comprising, after the bonding step, filling a space between the metal bumps with a resin.

7. A method of manufacturing a light source comprising:

forming a plurality of metal bumps made of gold, copper, a gold alloy, or a copper alloy on a ceramic substrate on which at least one light-emitting element is mounted;

placing the ceramic substrate on a mounting substrate; and

bonding the mounting substrate and the ceramic substrate to each other via the metal bumps.

8. The method of manufacturing a light source according to claim 7, further comprising, after the bonding step, filling a space between the metal bumps with a resin.

9. A method of mounting comprising:

forming a plurality of metal bumps on a mounting substrate; and

bonding the mounting substrate and a ceramic substrate placed on the mounting substrate to each other via the metal bumps.

10. A method of mounting comprising:

forming a plurality of metal bumps made of gold or a gold alloy at a ceramic substrate;

placing the ceramic substrate on a mounting substrate; and

bonding the mounting substrate and the ceramic substrate to each other via the metal bumps.