Packaging Structure for OLED Device, Packaging Method and Electronic Equipment

• US 20170077442A1
• Filed: 11/17/2015
• Published: 03/16/2017
• Est. Priority Date: 05/07/2015
• Status: Abandoned Application

• Current Assignee: BOE Technology Group Co., Ltd., Chengdu BOE Optoelectronics Technology Company Limited (BOE Technology Group Co., Ltd.)
• Original Assignee: BOE Technology Group Co., Ltd., Chengdu BOE Optoelectronics Technology Company Limited (BOE Technology Group Co., Ltd.)
• Inventors: ZHAO, Deyou, WANG, Yongmao
• Application Number:
  US15/123,222
• Publication Number:
  US 20170077442A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01L 23/3142 Sealing arrangements between parts, e.g. adhesion promotors
• CPC Class Codes: H10K 50/8426 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 50/846 comprising getter material or desiccants
• CPC Class Codes: H10K 71/00 Manufacture or treatment specially adapted for the organic devices covered by this subclass
• CPC Class Codes: H10K 77/111 Flexible substrates

Abstract

The embodiments of the present invention provide a packaging structure for OLED device, packaging method and electronic equipment. According to the embodiments of the invention, an anaerobic sealant is applied in the OLED packaging process as a packaging material. Since anaerobic sealant can be cured at room temperature without heat curing or UV curing, the technological process can be simplified, saving the cost. Meanwhile, the OLED process per se should be performed in a vacuum or inert gas environment (i.e., an anaerobic environment), which is advantageous for applying the anaerobic sealant; therefore no more investment is required, and the cost is saved. Moreover, the bonding strength of the cured anaerobic sealant is relatively strong, thus the sealed bonding between the cover plate and the substrate can be realized without an additional dam coating process, simplifying the technological process.

Claims

1. A packaging structure for OLED device comprising:

a basal substrate, an OLED device arranged on a surface of the basal substrate, a sealant covering the OLED device and overlapping with the surface of the basal substrate, and a cover plate covering the sealant;

wherein the sealant consists of an anaerobic sealant;

alternatively, the sealant consists of an anaerobic sealant and a frame sealant surrounding the anaerobic sealant.

2. The packaging structure for OLED device according to claim 1, wherein the cover plate is a glass cover plate, a metal cover plate or a plastic cover plate.

3. The packaging structure for OLED device according to claim 1, wherein the basal substrate is a glass substrate or a flexible substrate.

4. The packaging structure for OLED device according to claim 1, wherein the anaerobic sealant consists of a single component material of methacrylate.

5. The packaging structure for OLED device according to claim 1, wherein the anaerobic sealant is a modified anaerobic sealant.

6. The packaging structure for OLED device according to claim 5, wherein the modified anaerobic sealant comprises dimethacrylate, modifier, additive, filler, oxidation reduction catalyst and stabilizer.

15. An electronic equipment comprising the packaging structure for OLED device according to claim 1.

16. The electronic equipment according to claim 15, wherein the cover plate is a glass cover plate, a metal cover plate or a plastic cover plate.

17. The electronic equipment according to claim 15, wherein the basal substrate is a glass substrate or a flexible substrate.

18. The electronic equipment according to claim 15, wherein the anaerobic sealant consists of a single component material of methacrylate.

19. The electronic equipment according to claim 15, wherein the anaerobic sealant is a modified anaerobic sealant.

20. The electronic equipment according to claim 19, wherein the modified anaerobic sealant comprises dimethacrylate, modifier, additive, filler, oxidation reduction catalyst and stabilizer.

7. A packaging method for OLED device, comprising:

providing a basal substrate, an OLED device being arranged on a surface of the basal substrate;

applying a sealant on the basal substrate, the sealant covering the OLED device and overlapping with the surface of the basal substrate; and

attaching a cover plate on the sealant;

wherein the sealant consists of an anaerobic sealant;

alternatively, the sealant consists of an anaerobic sealant and a frame sealant surrounding the anaerobic sealant.

8. The packaging method for OLED device according to claim 7, wherein applying a sealant on the basal substrate, the sealant covering the OLED device and overlapping with the surface of the basal substrate comprises:

applying an anaerobic sealant on the surface of the basal substrate in an inert gas environment;

alternatively, disposing a frame sealant on the surface of the basal substrate in an inert gas environment, and applying an anaerobic sealant in a region defined by the frame sealant.

9. The packaging method for OLED device according to claim 7, further comprising:

after attaching a cover plate on the sealant, performing heat curing or UV curing to the frame sealant.

10. The packaging method for OLED device according to claim 7, wherein the cover plate is a glass cover plate, a metal cover plate or a plastic cover plate.

11. The packaging method for OLED device according to claim 7, wherein the basal substrate is a glass substrate or a flexible substrate.

12. The packaging method for OLED device according to claim 7, wherein the anaerobic sealant consists of a single component material of methacrylate.

13. The packaging method for OLED device according to claim 7, wherein the anaerobic sealant is a modified anaerobic sealant.

14. The packaging method for OLED device according to claim 13, wherein the modified anaerobic sealant comprises dimethacrylate, modifier, additive, filler, oxidation reduction catalyst and stabilizer.