ENCAPSULATION FILM

• US 20170077450A1
• Filed: 02/17/2016
• Published: 03/16/2017
• Est. Priority Date: 02/17/2015
• Status: Abandoned Application

• Current Assignee: LG Chem Limited (LG Corporation)
• Original Assignee: LG Chem Limited (LG Corporation)
• Inventors: Kim, Hyun Suk, YOO, Hyun Jee, MOON, Jung Ok, YANG, Se Woo
• Application Number:
  US15/309,376
• Publication Number:
  US 20170077450A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H10K 2101/00 Properties of the organic materials covered by group H10K85/00
• CPC Class Codes: H10K 2102/00 Constructional details relating to the organic devices covered by this subclass
• CPC Class Codes: H10K 2102/351 Thickness
• CPC Class Codes: H10K 2102/361 Temperature
• CPC Class Codes: H10K 30/80 Constructional details
• CPC Class Codes: H10K 30/88 Passivation; Containers; Encapsulations
• CPC Class Codes: H10K 50/844 Encapsulations
• CPC Class Codes: H10K 50/846 comprising getter material or desiccants
• CPC Class Codes: H10K 71/00 Manufacture or treatment specially adapted for the organic devices covered by this subclass
• CPC Class Codes: H10K 77/111 Flexible substrates
• CPC Class Codes: Y02E 10/549 Organic PV cells
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

Provided are an encapsulation film, an organic electronic device including the same, and a method of manufacturing the organic electronic device using the same. Particularly, the encapsulation film, which effectively blocks moisture or oxygen entering the organic electronic device from the outside, and has excellent mechanical properties such as handleability and processability, and the organic electronic device including the same are provided.

Claims

1. An encapsulation film for an organic electronic element, comprising:

a protective layer comprising a magnetic particle;

a metal layer formed on the protective layer; and

an encapsulation layer formed on the metal layer.

2. The film of claim 1, wherein the protective layer and the metal layer satisfy General Equation 1:

T_p/T_m≧

1 

 

[General Equation 1]

where T_p is a thickness of the protective layer, and T_m is a thickness of the metal layer.

3. The film of claim 1, wherein the protective layer has a thickness of 40 to 400 μ

m.

4. The film of claim 1, wherein the metal layer has a thickness of 10 to 100 μ

m.

5. The film of claim 1, wherein the protective layer has a tensile modulus of 0.01 to 500 MPa at 25°

C.

6. The film of claim 1, wherein the protective layer comprises one or more resin components selected from the group consisting of polyorganosiloxane, polyimide, a styrene-based resin or elastomer thereof, a polyolefin-based resin or elastomer thereof, a polyoxyalkylene-based resin or elastomer thereof, a polyester-based resin or elastomer thereof, a polyvinylchloride-based resin or elastomer thereof, a polycarbonate-based resin or elastomer thereof, a polyphenylenesulfide-based resin or elastomer thereof, a polyamide-based resin or elastomer thereof, an acrylate-based resin or elastomer thereof, an epoxy-based resin or elastomer thereof, a silicone-based resin or elastomer thereof, and a fluorine-based resin or elastomer thereof.

7. The film of claim 6, wherein the magnetic particle is comprised at 50 to 400 parts by weight with respect to 100 parts by weight of the resin component.

8. The film of claim 1, wherein the magnetic particle comprises one or more selected from the group consisting of Fe₃O₄, Fe₂O₃, MnFe₂O₄, BaFe₁₂O₁₉, SrFe₁₂O₁₉, CoFe₂O₄, Fe, CoPt, and FePt.

9. The film of claim 1, wherein the metal layer comprises any one of a metal, a metal oxide, a metal nitride, a metal carbide, a metal oxynitride, a metal oxyboride, and mixtures thereof.

10. The film of claim 1, wherein the metal layer comprises any one of aluminum, copper, nickel, silicon oxide, aluminum oxide, titanium oxide, indium oxide, tin oxide, indium tin oxide, tantalum oxide, zirconium oxide, niobium oxide and mixtures thereof.

11. The film of claim 1, wherein the encapsulation layer is formed in a single layer or two or more layers.

12. The film of claim 1, wherein the encapsulation layer comprises an encapsulation resin.

13. The film of claim 12, wherein the encapsulation layer further comprises an active energy ray polymerizable compound.

14. The film of claim 1, wherein the encapsulation layer comprises a moisture absorbent.

15. An organic electronic device, comprising:

a substrate;

an organic electronic element formed on the substrate; and

the encapsulation film of claim 1, which encapsulates the organic electronic element.

16. The device of claim 15, wherein the encapsulation layer of the encapsulation film covers entire surfaces of the organic electronic element.

17. A method of manufacturing an organic electronic device, comprising:

applying the encapsulation film of claim 1 to a surface on which an organic electronic element is formed to cover the organic electronic element; and

curing the encapsulation film.