SMART CARD CONSTRUCTIONS

• US 20170077589A1
• Filed: 11/22/2016
• Published: 03/16/2017
• Est. Priority Date: 08/10/2014
• Status: Active Grant

• Current Assignee: AmaTech Group Limited (Paragon Group Limited)
• Original Assignee: Féinics AmaTech Teoranta (Paragon Group Limited)
• Inventors: Finn, David, Lotya, Mustafa, Molloy, Darren
• Granted Patent: US 9,960,476 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: G06K 19/077 Constructional details, e.g. mounting of circuits in the carrier
• CPC Class Codes: H01Q 1/2225 used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H04B 5/77 for interrogation

Abstract

A conductive coupling frame (CF) or a discontinuous metal layer disposed surrounding and closely adjacent a transponder chip module (TCM), and substantially coplanar with an antenna structure (AS, CES, LES) in the transponder chip module (TCM). A metal card body (MCB, CB) or a transaction card with a discontinuous metal layer having a slit (S), extending from an inner end to a periphery of the metal layer, and not terminating in a distinct opening sized to accommodate a transponder chip module (TCM).

Claims

1. Smartcard comprising:

a metal layer (ML); and

a discontinuity, comprising a slit (S) in the metal layer (ML) extending from an inner end to a periphery of the metal layer and not terminating in a distinct opening sized to accommodate a transponder chip module (TCM).

2. Smartcard comprising:

a card front layer;

a metal interlayer having a slit (S); and

a card rear layer,

wherein;

the front and rear card layers comprise non-conductive or electromagnetic transparent materials and the metal interlayer to function as a coupling frame featuring a slit extending from the edge of the metal interlayer to an opening for a transponder chip module (TCM).

3. Smartcard comprising:

a front layer;

a first metal interlayer having no slit;

a second metal interlayer having a slit; and

a rear layer;

wherein;

the front layer and first metal interlayer comprise an opening to accommodate a transponder chip module (TCM), and a second metal interlayer with slit featuring an opening that allows for the overlap of the metal interlayer with the module antenna (MA) of a TCM.