INTERCONNECTION OF HARDWARE COMPONENTS

• US 20170077661A1
• Filed: 09/14/2015
• Published: 03/16/2017
• Est. Priority Date: 09/17/2014
• Status: Active Grant

• Current Assignee: Corning Optical Communications LLC (Corning Incorporated)
• Original Assignee: Corning Optical Communications Wireless Ltd. (Corning Incorporated)
• Inventors: Vinnik, Roman, Assif, Lior, Rozenvax, Alon
• Granted Patent: US 9,653,861 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01R 13/631 for engagement only
• CPC Class Codes: H01R 24/52 mounted in or to a panel or structure
• CPC Class Codes: H01R 25/006 the coupling part being secured to apparatus or structure, e.g. duplex wall receptacle
• CPC Class Codes: H01R 43/26 for engaging or disengaging the two parts of a coupling device structural association with two-part coupling device H01R13/629
• CPC Class Codes: H05K 7/1452 Mounting of connectors; Switching; Reinforcing of back panels

Abstract

A method and related apparatuses for disconnecting components of a hardware assembly. The components each include two connectors configured to disengage in a staged manner so that one set of connectors disconnects before the other set. If power connectivity is provided across one set of connectors, that connection can be configured to end before the connectivity between the other connectors.

Claims

1-13. -13. (canceled)

14. A method of disengaging a module from a backplane, comprising:

providing a module, comprising;

a module support;

a first module connector supported on the module support and comprising at least one electrical conductor; and

a second module connector supported on the module support;

providing a backplane engaged with the module, comprising;

a backplane support;

a first backplane connector supported on the backplane support and connected to the first module connector; and

a second backplane connector supported on the backplane support and connected to the second module connector;

moving the module and backplane away from one another a first distance to cause the first module connector to disconnect from the first backplane connector, wherein the second module connector remains connected to the second backplane connector at the first distance; and

further moving the module and backplane away from one another a second distance to cause the second module connector to disconnect from the second backplane connector.

15. The method of claim 14, wherein the second backplane connector comprises at least one bias element and a translatable section, and wherein moving the module and backplane away from one another the first distance causes the translatable section to translate relative to the backplane support under a bias of the at least one bias element.

16. The method of claim 15, wherein:

the translatable section comprises a plate having at least one aperture, and

the at least one bias element comprises at least one pin extending through the at least one aperture, and at least one spring that engages the plate and that is arranged on the pin.

17. The method of claim 14, wherein the at least one electrical conductor of the first backplane connector comprises a plurality of electrical conductors, and wherein prior to disengagement of the module from the backplane, a plurality of conductive paths extend through the module and the backplane in part via the plurality of electrical conductors.

18. The method of claim 14, wherein when connected, the first module connector and the first backplane connector are configured establish at least one of a power and a data connection between the module and the backplane, and the second module connector and the second backplane connector are configured establish an RF connection between the module and the backplane.

19. The method of claim 14, wherein the module support includes a plate section and the backplane support has a generally planar facing surface, and wherein moving the module and backplane away from one another the first distance comprises moving the module along a direction generally parallel to the plate section of the module support.

20. (canceled)