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LIGHT EMITTING DEVICE PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

  • US 20170084800A1
  • Filed: 09/19/2016
  • Published: 03/23/2017
  • Est. Priority Date: 09/18/2015
  • Status: Abandoned Application
First Claim
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1. A light emitting device package structure comprising:

  • at least one light emitting device having an upper surface, a lower surface opposite to the upper surface, and a side surface connecting the upper surface and the lower surface;

    a wavelength conversion layer disposed on the upper surface of the at least one light emitting device, the wavelength conversion layer having a first side surface and a second side surface opposite to each other;

    a protection element encapsulating the side surface of the at least one light emitting device and the second side surface of the wavelength conversion layer and exposing the lower surface of the at least one light emitting device, wherein a third side surface of the protection element is aligned with the first side surface of the wavelength conversion layer.

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