Electronic module and method of manufacturing the same
First Claim
1. An electronic module comprising,an electronic chip comprising at least one electronic component,a spacing element comprising a main surface arranged on the electronic chip and being in thermal conductive connection with the at least one electronic component;
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wherein the spacing element comprises a lateral surface comprising at least one surface structure which provides an interface with the mold compound,wherein the surface structure comprises a three-dimensional form.
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Accused Products
Abstract
According to an exemplary aspect an electronic module is provided, wherein the electronic module comprises an electronic chip comprising at least one electronic component, a spacing element comprising a main surface arranged on the electronic chip and being in thermally conductive connection with the at least one electronic component, and a mold compound at least partially enclosing the electronic chip and the spacing element, wherein the spacing element comprises a lateral surface which is in contact to the mould compound and comprises surface structures.
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Citations
20 Claims
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1. An electronic module comprising,
an electronic chip comprising at least one electronic component, a spacing element comprising a main surface arranged on the electronic chip and being in thermal conductive connection with the at least one electronic component; - and
a mold compound at least partially enclosing the electronic chip and the spacing element; wherein the spacing element comprises a lateral surface comprising at least one surface structure which provides an interface with the mold compound, wherein the surface structure comprises a three-dimensional form. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A method of manufacturing an electronic module, the method comprising:
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providing an electronic chip comprising at least one electronic component; forming a spacing element comprising a main surface arranged on the electronic chip and a lateral surface comprising at least one surface structure; contacting the main surface of the spacing element to the electronic chip in a thermally conductive way; molding a molding compound at least partially enclosing the spacing element and the electronic chip, so that the molding compound provides an interface with the at least one surface structure of the spacing element, wherein the surface structure comprises a three-dimensional form. - View Dependent Claims (15, 16)
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17. An electronic module, the module comprising:
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an electronic arrangement; and a mold compound at least partially enclosing the electronic arrangement, wherein the electronic arrangement comprises a substrate, an electronic chip arranged on the substrate, and a spacing element arranged on the electronic chip, wherein the electronic arrangement further comprises a lateral surface comprising surface structures adapted to increase a surface area of the electronic arrangement, wherein the surface structures comprise a three-dimensional form, wherein the mold compound provides an interface with the surface structures. - View Dependent Claims (18, 19, 20)
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Specification