CHIP-ON-FILM PACKAGE

• US 20170092572A1
• Filed: 12/15/2015
• Published: 03/30/2017
• Est. Priority Date: 09/24/2015
• Status: Active Grant

• Current Assignee: Novatek Microelectronics Corporation (Novatek Microelectronics Corp Limited)
• Original Assignee: Novatek Microelectronics Corporation (Novatek Microelectronics Corp Limited)
• Inventors: Cheng, Jhih-Siou, Cho, Chun-Yung, Tseng, Po-Yu
• Granted Patent: US 11,069,586 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01L 22/32 Additional lead-in metallisation on a device or substrate, e.g. additional pads or pad portions, lines in the scribe line, sacrificed conductors arrangements for conducting electric current to or from the solid state body in operation H01L23/48
• CPC Class Codes: H01L 23/49838 Geometry or layout
• CPC Class Codes: H01L 23/4985 Flexible insulating substrates H01L23/49572 and H01L23/49855 take precedence

Abstract

A chip-on-film package including a flexible substrate, first test pads, second test pads, first connecting wires, second connecting wires and a chip is provided. The flexible substrate includes at least one segment. Each segment has a central portion and a first side portion and a second side portion located at two opposite sides of the central portion. The chip disposed on the central portion includes first connecting pads and second connecting pads. The first test pads and the second test pads are disposed on the first side portion. Two ends of each of the first connecting wires are connected to the corresponding first connecting pad and the corresponding first test pad. Two ends of each of the second connecting wires are connected to the corresponding second connecting pad and the corresponding second test pad. Each of the second connecting wires includes a first section located at the second side portion.

Claims

1. A chip-on-film package, comprising:

a flexible substrate, comprising at least one segment, wherein the at least one segment comprises a central portion, a first side portion, and a second side portion, and the first side portion and the second side portion are located at two opposite sides of the central portion respectively;

a chip, disposed on the central portion and comprising a plurality of first connecting pads and a plurality of second connecting pads for bonding to the flexible substrate;

a plurality of first test pads and a plurality of second test pads, disposed on the first side portion;

a plurality of first connecting wires, wherein two ends of each of the first connecting wires are respectively connected to the corresponding first connecting pad and the corresponding first test pad; and

a plurality of second connecting wires, wherein two ends of each of the second connecting wires are respectively connected to the corresponding second connecting pad and the corresponding second test pad, and each of the second connecting wires comprises a first section located at the second side portion.

2. The chip-on-film package as recited in claim 1, wherein the first connecting pads are output pads, the second connecting pads are input pads.

3. The chip-on-film package as recited in claim 1, wherein the first connecting pads are input pads, the second connecting pads are output pads.

4. The chip-on-film package as recited in claim 1, wherein the number of the first connecting pads are greater than the number of the second connecting pads.

5. The chip-on-film package as recited in claim 1, wherein the flexible substrate is a film, each of two sides of the flexible substrate has a row of sprocket holes, and the central portion, the first side portion, and the second side portion are located between two rows of the sprocket holes.

6. The chip-on-film package as recited in claim 1, wherein when the number of the at least one segment are greater than or equal to 2, the first side portions of two adjacent segments are adjacent to each other, and each of the second side portions of the two adjacent segments are respectively located at another side of each of the central portions of the two adjacent segments.

7. The chip-on-film package as recited in claim 1, wherein when the number of the at least one segment are greater than or equal to 3, the first side portions of two segments that are located at outer sides of three successive segments are adjacent to a segment located at middle of the three successive segments, and each of the second side portions of the two outer segments are respectively located at another side of each of the central portions of the two outer segments.

8. The chip-on-film package as recited in claim 1, further comprising at least one third test pad disposed at the second side portion and located on the first section of at least one corresponding second connecting wire of the second connecting wires.

9. The chip-on-film package as recited in claim 1, further comprising:

at least one third test pad, disposed at the second side portion; and

at least one third connecting wire, wherein the chip further comprises at least one third connecting pad for bonding to the flexible substrate, and the at least one third connecting wire connects the at least one third connecting pad with the at least one third test pad.

10. The chip-on-film package as recited in claim 1, wherein each of the second connecting wires further comprises a second section and a third section located at the central portion, the second section connects the corresponding second connecting pad with the first section, the third section connects the first section with the corresponding second test pad located at the first side portion.