DUAL-INTERFACE IC CARD MODULE

• US 20170092612A1
• Filed: 09/30/2016
• Published: 03/30/2017
• Est. Priority Date: 09/30/2015
• Status: Active Grant

• Current Assignee: NXP B.V. (NXP Semiconductors NV)
• Original Assignee: NXP B.V. (NXP Semiconductors NV)
• Inventors: Zenz, Christian
• Granted Patent: US 10,461,057 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: G06K 19/07747 at least one of the integrated circuit chips being mounted as a module
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07754 the connection being galvanic
• CPC Class Codes: G06K 19/07769 the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
• CPC Class Codes: H01L 2224/04042 Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
• CPC Class Codes: H01L 2224/08111 the bonding area being disposed in a recess of the surface of the body
• CPC Class Codes: H01L 2224/08501 at the bonding interface
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/4912 Layout
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/85355 having an external coating, e.g. protective bond-through coating
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 24/08 of an individual bonding area
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 24/85 using a wire connector wire bonding in general B23K20/004
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01Q 1/2208 : associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems methods or arrangements for sensing record carriers, e.g. for reading patterns G06K7/00; record carrier for use with machines and with at least a part designed to carry digital markings G06K19/00

Abstract

The disclosure relates to a dual-interface integrated circuit (IC) card module for use in a dual-interface IC card. Embodiments disclosed include a dual-interface integrated circuit card module (150), the module comprising: a substrate (104) having first and second opposing surfaces; a contact pad (102) on the first surface of the substrate; an integrated circuit (110) on the second surface of the substrate (104), the integrated circuit (110) having electrical connections to the contact pad (102) through the substrate (104); and a pair of antenna pads (108) disposed in recesses (103) in the second surface of the substrate (104) and electrically connected to corresponding antenna connections on the integrated circuit (110).

Claims

1. A dual-interface integrated circuit card module, the module comprising:

a substrate having first and second opposing surfaces;

a contact pad on the first surface of the substrate;

an integrated circuit on the second surface of the substrate, the integrated circuit having electrical connections to the contact pad through the substrate; and

a pair of antenna pads disposed in recesses in the second surface of the substrate and electrically connected to corresponding antenna connections on the integrated circuit.

2. The module of claim 1, wherein the recesses pass through the substrate, the antenna pads being attached to a back surface of the contact pad.

3. The module of claim 1, wherein the antenna pads are electrically connected to the corresponding antenna connections on the integrated circuit by bond wires.

4. The module of claim 3, wherein the integrated circuit and bond wires are encapsulated in a protective material.

5. The module of claim 1, wherein each antenna pad comprises a metal contact.

6. The module of claim 1, wherein each antenna pad comprises a laminate with a metal contact layer.

7. The module of claim 1, wherein each antenna pad comprises a first part that is entirely contained within a recess, and a second part extending out of the recess.

8. The module of claim 1, wherein each antenna pad is adhered to a bottom surface of a recess with a non-conductive adhesive.

9. The module of claim 1, wherein each antenna pad is attached to a bottom surface of a recess, and wherein an area of the antenna pad attached to the bottom surface is less than the total area of the antenna pad.

10. A dual-interface card comprising:

a card body containing an antenna, the antenna having a pair of antenna connections; and

a dual-interface integrated circuit card module according to claim 1;

wherein the antenna pads of the module are electrically connected to the electrical contact pads in the card body.

15. A method of constructing a dual-interface integrated circuit card, the method comprising:

providing a card body containing an antenna, the antenna having a pair of antenna connections;

providing a dual-interface integrated circuit card module according to claim 1;

electrically connecting the antenna connections to the antenna pads of the module; and

bonding the module to the card body.

11. A method of manufacturing a dual-interface integrated circuit card module, the method comprising:

providing a substrate having first and second opposing surfaces, with a contact pad on the first surface of the substrate;

forming first and second recesses in the second surface of the substrate;

placing an antenna pad into each of the first and second recesses;

placing an integrated circuit on the second surface of the substrate;

forming electrical connections between the integrated circuit and the contact pad through the substrate; and

forming an electrical connection between each antenna pad and a corresponding antenna connection on the integrated circuit.

12. The method of claim 11, wherein forming an electrical connection between each antenna pad and a corresponding antenna connection on the integrated circuit comprises electrically connecting bond wires between each antenna pad and the corresponding antenna connection,

wherein the method further comprises encapsulating the integrated circuit and bond wires in a protective material.

13. The method of claim 11, wherein placing an antenna pad into each of the first and second recesses comprises adhering the antenna pad to a bottom surface of the recess.

14. The method of claim 13, wherein bonding the antenna pad to the bottom surface of the recess comprises applying an adhesive to a portion of the bottom surface.