COVER OF A MOBILE DEVICE AND MOBILE DEVICE INCLUDING THE SAME

• US 20170093455A1
• Filed: 12/08/2016
• Published: 03/30/2017
• Est. Priority Date: 07/03/2013
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: LEE, Young-Ki, ROH, Hyoung-Hwan, SONG, II-Jong, JANG, Yo-Han, LEE, Byeong-Hoon
• Granted Patent: US 10,461,793 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01Q 1/243 with built-in antennas
• CPC Class Codes: H01Q 13/10 Resonant slot antennas
• CPC Class Codes: H04B 1/3888 Arrangements for carrying or protecting transceivers
• CPC Class Codes: H04B 5/72 for local intradevice communication
• CPC Class Codes: H04M 1/7246 by connection of exchangeable housing parts
• CPC Class Codes: H04M 2250/04 including near field communication means, e.g. RFID

Abstract

A cover of a mobile device includes a metal structure disposed to cover one surface of the mobile device. The metal structure includes a metal material, and operates as an antenna for a wireless communication of the mobile device.

Claims

1. A mobile device comprising:

a wireless communication chip configured to perform a wireless communication;

a matching circuit coupled to the wireless communication chip; and

a cover including;

a plate configured to cover at least one surface of the mobile device, and including a slit and an opening; and

two terminals configured to be electrically coupled with the matching circuit,

wherein the slit is located between the two terminals, and extends to the opening,

a signal path from one of the two terminals to the other of the two terminals is formed on the plate,

at least a portion of the cover operates as an antenna for a wireless communication of the mobile device,

the matching circuit is directly connected to the two terminals, and

the matching circuit is configured to perform an impedance matching between the wireless communication chip and the antenna for the wireless communication.

2. The mobile device of claim 1, wherein the plate includes a first region, a second region and a third region that are divided by insulation material.

3. The mobile device of claim 2, wherein the first region is disposed at a top portion of the plate,

the second region includes the opening, and

the third region is disposed at a bottom portion of the plate.

4. The mobile device of claim 3, wherein the second region is configured to operate as the antenna for the wireless communication.

5. The mobile device of claim 3, wherein the slit extends to at least one of the first region, the second region and the third region.

6. The mobile device of claim 1, wherein the plate includes metal material.

7. The mobile device of claim 1, wherein the antenna operates for a near field communication (NFC).

8. The mobile device of claim 1, wherein the plate includes an inner region and an outer region that are divided by insulation material,

the slit is formed at the inner region,

the two terminals is formed on the inner region,

the opening is formed at the inner region, and

the inner region operates as the antenna for the wireless communication of the mobile device.

9. The mobile device of claim 1, wherein the mobile device does not include a separate antenna for the wireless communication.

10. A mobile device comprising:

a wireless communication chip configured to perform a wireless communication;

a matching circuit coupled to the wireless communication chip; and

a cover including a plate configured to cover at least one surface of the mobile device, the plate including an opening, a slit, and two terminals configured to be electrically directly coupled with the matching circuit,

wherein the plate includes a first region, a second region and a third region that are divided by insulation material,

the slit is located between the two terminals, and extends from the opening to one of the first region, the second region and the third region,

at least a portion of the plate operates as an antenna for a wireless communication of the mobile device, and

the matching circuit is configured to perform an impedance matching between the wireless communication chip and the antenna for the wireless communication.

11. The mobile device of claim 10, wherein the first region is disposed at a top portion of the plate,

the second region includes the opening,

the third region is disposed at a bottom portion of the plate, and

the second region is configured to operate as the antenna for the wireless communication.

12. The mobile device of claim 10, wherein the plate includes metal material.

13. The mobile device of claim 10, wherein the plate includes a capacitor at the slit.

14. The mobile device of claim 10, wherein the opening has a triangular shape, a rectangular shape, a polygonal shape, a circular shape, or an elliptical shape.

15. The mobile device of claim 10, wherein the mobile device does not include a separate antenna for the wireless communication.

16. A mobile device comprising:

a wireless communication chip configured to perform a wireless communication;

a matching circuit coupled to the wireless communication chip; and

a cover including a plate configured to cover at least one surface of the mobile device, the plate including an opening, a slit, and two terminals configured to be electrically directly coupled with the matching circuit,

wherein the plate includes a first region, a second region and a third region that are divided by insulation material, the first region being disposed at a top portion of the plate, the second region including the opening, the third region being disposed at a bottom portion of the plate,

the slit is located between the two terminals, and extends to the opening,

the second region of the plate is configured to operate as an antenna for the wireless communication, and

the wireless communication chip is configured to perform the wireless communication via the matching circuit and the cover.

17. The mobile device of claim 16, wherein the two terminals are coupled to a capacitor included in the matching circuit.

18. The mobile device of claim 16, wherein the mobile device does not include a separate antenna for the wireless communication.

19. The mobile device of claim 16, wherein the plate includes metal material.

20. The mobile device of claim 16, wherein the second metal region surrounds the opening.