METHOD OF FORMING HOLE IN GLASS SUBSTRATE BY USING PULSED LASER, AND METHOD OF PRODUCING GLASS SUBSTRATE PROVIDED WITH HOLE
First Claim
1. A method of forming a hole in a glass substrate by using a pulsed laser, the method comprising:
- (1) preparing the glass substrate including a first surface and a second surface that face each other;
(2) forming a concave portion on the first surface by irradiating, with a first condition, the pulsed laser onto the first surface of the glass substrate through a lens, wherein the concave portion on the first surface has a diameter φ and
a depth d, wherein the diameter φ
is greater than or equal to a diameter S (φ
≧
S) of a spot on the first surface formed by the pulsed laser, the diameter S being expressed by a formula (i),
the spot diameter S=(4×
λ
×
f×
M2)/(π
×
r)
(i),where λ
is a wavelength of the pulsed laser, f is a focal length of the lens, M2 is an M-squared value, and r is a diameter of a beam of the pulsed laser entering the lens, and wherein the depth d is greater than or equal to 0.7 times the diameter φ
; and
(3) forming the hole by irradiating the pulsed laser onto the concave portion with a second condition such that energy density of the pulsed laser is less than or equal to a processing threshold value of the glass substrate.
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Accused Products
Abstract
Disclosed is a method of forming a hole in a glass substrate by using a pulsed laser, the method including (1) preparing the glass substrate including a first surface and a second surface that face each other; (2) forming a concave portion on the first surface by irradiating, with a first condition, the pulsed laser onto the first surface of the glass substrate through a lens; and (3) forming the hole by irradiating the pulsed laser onto the concave portion with a second condition such that energy density of the pulsed laser is less than or equal to a processing threshold value of the glass substrate.
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Citations
10 Claims
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1. A method of forming a hole in a glass substrate by using a pulsed laser, the method comprising:
-
(1) preparing the glass substrate including a first surface and a second surface that face each other; (2) forming a concave portion on the first surface by irradiating, with a first condition, the pulsed laser onto the first surface of the glass substrate through a lens, wherein the concave portion on the first surface has a diameter φ and
a depth d, wherein the diameter φ
is greater than or equal to a diameter S (φ
≧
S) of a spot on the first surface formed by the pulsed laser, the diameter S being expressed by a formula (i),
the spot diameter S=(4×
λ
×
f×
M2)/(π
×
r)
(i),where λ
is a wavelength of the pulsed laser, f is a focal length of the lens, M2 is an M-squared value, and r is a diameter of a beam of the pulsed laser entering the lens, and wherein the depth d is greater than or equal to 0.7 times the diameter φ
; and(3) forming the hole by irradiating the pulsed laser onto the concave portion with a second condition such that energy density of the pulsed laser is less than or equal to a processing threshold value of the glass substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method of producing a glass substrate with a hole, the method comprising:
-
(1) preparing the glass substrate including a first surface and a second surface that face each other; (2) forming a concave portion on the first surface by irradiating, with a first condition, a pulsed laser onto the first surface of the glass substrate through a lens, wherein the concave portion on the first surface has a diameter φ and
a depth d, wherein the diameter φ
is greater than or equal to a diameter S (φ
≧
S) of a spot on the first surface formed by the pulsed laser, the diameter S being expressed by a formula (i),
the spot diameter S=(4×
λ
×
f×
M2)/(π
×
r)
(i),where λ
is a wavelength of the pulsed laser, f is a focal length of the lens, M2 is an M-squared value, and r is a diameter of a beam of the pulsed laser entering the lens, and wherein the depth d is greater than or equal to 0.7 times the diameter φ
; and(3) forming the hole by irradiating the pulsed laser onto the concave portion with a second condition such that energy density of the pulsed laser is less than or equal to a processing threshold value of the glass substrate.
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Specification