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METHOD OF FORMING HOLE IN GLASS SUBSTRATE BY USING PULSED LASER, AND METHOD OF PRODUCING GLASS SUBSTRATE PROVIDED WITH HOLE

  • US 20170096361A1
  • Filed: 09/27/2016
  • Published: 04/06/2017
  • Est. Priority Date: 10/01/2015
  • Status: Active Grant
First Claim
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1. A method of forming a hole in a glass substrate by using a pulsed laser, the method comprising:

  • (1) preparing the glass substrate including a first surface and a second surface that face each other;

    (2) forming a concave portion on the first surface by irradiating, with a first condition, the pulsed laser onto the first surface of the glass substrate through a lens, wherein the concave portion on the first surface has a diameter φ and

    a depth d, wherein the diameter φ

    is greater than or equal to a diameter S (φ



    S) of a spot on the first surface formed by the pulsed laser, the diameter S being expressed by a formula (i),
    the spot diameter S=(4×

    λ

    ×



    M
    2)/(π

    ×

    r) 



    (i),where λ

    is a wavelength of the pulsed laser, f is a focal length of the lens, M2 is an M-squared value, and r is a diameter of a beam of the pulsed laser entering the lens, and wherein the depth d is greater than or equal to 0.7 times the diameter φ

    ; and

    (3) forming the hole by irradiating the pulsed laser onto the concave portion with a second condition such that energy density of the pulsed laser is less than or equal to a processing threshold value of the glass substrate.

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