MEMS DIE WITH SENSING STRUCTURES
First Claim
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1. A microelectromechanical systems die comprising:
- a thermally conductive substrate including an outer surface; and
a plurality of low mass sensing structures disposed within the thermally conductive substrate to form a plurality of inter-structure spaces therebetween, each of the plurality of low mass sensing structures include a sensing structure proximal top surface, a sensing structure distal top surface, and a sensing structure width dimension.
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Abstract
A microelectromechanical systems die including a thermally conductive substrate including an outer surface, a plurality of low mass sensing structures disposed within the thermally conductive substrate to form a plurality of inter-structure spaces therebetween, each of the plurality of low mass sensing structures include a sensing structure proximal top surface, a sensing structure distal top surface, and a sensing structure width dimension.
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Citations
32 Claims
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1. A microelectromechanical systems die comprising:
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a thermally conductive substrate including an outer surface; and a plurality of low mass sensing structures disposed within the thermally conductive substrate to form a plurality of inter-structure spaces therebetween, each of the plurality of low mass sensing structures include a sensing structure proximal top surface, a sensing structure distal top surface, and a sensing structure width dimension. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A gas detector package comprising:
a microelectromechanical systems die comprising; a thermally conductive substrate; and a plurality of low mass sensing structures disposed within the thermally conductive substrate, the plurality of low mass sensing structures including a sensing structure proximal top surface, a sensing structure distal top surface, and a sensing structure width dimension. - View Dependent Claims (18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32)
Specification