STRATEGIC PLACEMENT OF PLASTIC STRUCTURES FOR EMI MANAGEMENT OF TRANSCEIVER MODULE

• US 20170097484A1
• Filed: 10/02/2015
• Published: 04/06/2017
• Est. Priority Date: 10/02/2015
• Status: Active Grant

• Current Assignee: II-VI Delaware, Inc. (Coherent Corp.)
• Original Assignee: Finisar Corporation (II-VI Incorporated)
• Inventors: Wee, Hon Siu, Teo, Tat Ming, Hsieh, John, Wang, William H., Liu, Jinxiang, Chiang, Troy Wy Piew
• Granted Patent: US 10,359,586 B2
• Time in Patent Office: Days
• CPC Class Codes: G02B 6/3874 using tubes, sleeves to align ferrules
• CPC Class Codes: G02B 6/423 using guiding surfaces for the alignment
• CPC Class Codes: G02B 6/4246 Bidirectionally operating package structures
• CPC Class Codes: G02B 6/4255 Moulded or casted packages
• CPC Class Codes: G02B 6/4277 Protection against electromagnetic interference [EMI], e.g. shielding means shielding of electric apparatus H05K9/00, of instruments G12B17/00
• CPC Class Codes: G02B 6/428 containing printed circuit boards [PCB]
• CPC Class Codes: G02B 6/4284 of optical modules with disconnectable electrical connectors latching arms for electrical connectors H01R13/627
• CPC Class Codes: G02B 6/4292 the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
• CPC Class Codes: H05K 1/0216 Reduction of cross-talk, noise or electromagnetic interference grounding H05K1/0215
• CPC Class Codes: H05K 1/0274 Optical details, e.g. printed circuits comprising integral optical means H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42
• CPC Class Codes: H05K 2201/10121 Optical component, e.g. opto-electronic component
• CPC Class Codes: H05K 7/1427 Housings
• CPC Class Codes: H05K 9/0058 specially adapted for optoelectronic applications

Abstract

An example optoelectronic module includes a housing that extends between a first end portion and a second end portion. The optoelectronic module includes a printed circuit board (“PCB”) that includes an electrical connector at the second end portion of the housing, at least one transmitter electrically coupled to the PCB and optically coupled with at least one optical fiber, at least one receiver electrically coupled to the PCB and optically coupled with at least one optical fiber, and at least one electromagnetic interference (“EMI”) attenuating component formed of a plastic material that is configured to attenuate EMI. The EMI attenuating component is configured to attenuate EMI generated by one or more other components of the optoelectronic module.

Claims

1. An optoelectronic module comprising:

a housing that extends along a longitudinal axis between a first end portion and a second end portion, the first end portion configured to interface with at least one fiber optic cable including one or more optical fibers;

a printed circuit board (“

PCB”

) within the housing that includes an electrical connector at the second end portion of the housing;

at least one transmitter positioned inside of the housing, the transmitter electrically coupled to the PCB and optically coupled with at least one of the one or more optical fibers;

at least one receiver positioned inside of the housing, the receiver electrically coupled to the PCB and optically coupled with at least another one of the one or more optical fibers;

at least one electromagnetic interference (“

EMI”

) attenuating component formed of a plastic material that is configured to attenuate EMI, wherein the at least one EMI attenuating component is configured to attenuate EMI generated by one or more other components of the optoelectronic module and wherein the EMI attenuating component is selected from a group consisting of;

an alignment guide received in an alignment guide receptacle defined by the housing, the alignment guide configured to receive a connector attached to the fiber optic cable;

an optoelectronic subassembly (“

OSA”

) block retained by the housing, wherein the OSA block defines a port configured to receive a ferrule attached to ends of the one or more optical fibers;

a moveable member of a latching mechanism configured to fasten or disengage the optoelectronic module from a host receptacle;

a PCB compression plate configured to retain the PCB with respect to the housing in at least one direction transverse to the longitudinal axis;

a PCB spacer, wherein the PCB spacer is positioned between the PCB and a second PCB in a double-deck PCB arrangement;

an adapter operably connected between the fiber optic cable and one or more components within the housing;

a flex EMI absorber positioned within the housing proximate the first end portion in a flex region of the optoelectronic module and configured to attenuate EMI emitted in the flex region;

a socket EMI absorber positioned within the housing proximate the electrical connector of the PCB positioned at the second end portion of the housing, the socket EMI absorber configured to attenuate EMI generated in a socket region;

a three-dimensional EMI absorber positioned between the PCB and one or both of a transmitter optical subassembly (“

TOSA”

) and a receiver optical subassembly (“

ROSA”

);

a port retention bar positioned inside of the housing, the port retention bar configured to support one or both of a transmitter optical subassembly (“

TOSA”

) and a receiver optical subassembly (“

ROSA”

); and

a fiber tray supporting one or more internal optical cables positioned inside of the housing.

2. The optoelectronic module of claim 1, wherein the plastic material comprises a plastic filled with one or more of:

nickel coated carbon fiber, stainless steel filler, and electrically conductive filler.

3. The optoelectronic module of claim 1, wherein the at least one EMI attenuating component is injection molded.

4. The optoelectronic module of claim 1, wherein the at least one EMI attenuating component includes the PCB spacer and wherein the PCB spacer is configured to support the PCB and the second PCB inside of the housing.

5. The optoelectronic module of claim 1, wherein the at least one EMI attenuating component includes the alignment guide, the connector is configured to retain ends of the one or more optical fibers, and the alignment guide is configured to optically align the one or more optical fibers with one or both of the transmitter and the receiver.

6. The optoelectronic module of claim 1, wherein the at least one EMI attenuating component includes the moveable member and the moveable member comprises a slider extending along sides of the housing.

7. The optoelectronic module of claim 1, wherein the at least one EMI attenuating component includes the fiber tray, the one or more internal optical cables is coupled to a transmitter optical subassembly (“

TOSA”

) and a receiver optical subassembly (“

ROSA”

), and the fiber tray supports the TOSA and the ROSA.

8. The optoelectronic module of claim 1, wherein the EMI attenuating component includes the port retention bar that is disposed against the housing to retain the TOSA and the ROSA with respect to one another.

9. An optoelectronic module comprising:

a housing that extends along a longitudinal axis between a first end portion and a second end portion, the first end portion configured to interface with at least one fiber optic cable including one or more optical fibers;

a printed circuit board (“

PCB”

) within the housing that includes an electrical connector at the second end portion of the housing;

at least one transmitter positioned inside of the housing, the transmitter electrically coupled to the PCB and optically coupled with at least one of the one or more optical fibers;

at least one receiver positioned inside of the housing, the receiver electrically coupled to the PCB, and optically coupled with at least another one of the one or more optical fibers; and

at least one electromagnetic interference (“

EMI”

) attenuating component formed of a plastic material that is configured to attenuate EMI, wherein the at least one EMI attenuating component is configured to attenuate EMI generated by one or more other components of the optoelectronic module,

wherein the EMI attenuating component includes a flex EMI absorber positioned within the housing proximate the first end portion in a flex region of the optoelectronic module and configured to attenuate EMI emitted in the flex region.

10. The optoelectronic module of claim 9, wherein the flex EMI absorber is coupled with the housing and positioned proximate a transmitter optical subassembly (“

TOSA”

) and a receiver optical subassembly (“

ROSA”

).

11. The optoelectronic module of claim 9, wherein the plastic material comprises a plastic filled with one or more of:

nickel coated carbon fiber, stainless steel filler, and electrically conductive filler.

12. The optoelectronic module of claim 9, wherein the EMI attenuating component is injection molded.

13. The optoelectronic module of claim 9, further comprising a second EMI attenuating component selected from a group consisting of:

an alignment guide received in an alignment guide receptacle defined by the housing, the alignment guide configured to receive a connector attached to the fiber optic cable;

an optoelectronic subassembly (“

OSA”

) block retained by the housing, wherein the OSA block defines a port configured to receive a ferrule attached to ends of the one or more optical fibers;

a moveable member of a latching mechanism configured to fasten or disengage the optoelectronic module from a host receptacle;

a PCB compression plate configured to retain the PCB with respect to the housing in at least one direction transverse to the longitudinal axis;

a PCB spacer, wherein the PCB spacer is positioned between the PCB and a second PCB in a double-deck PCB arrangement;

an adapter operably connected between the fiber optic cable and one or more components within the housing;

a socket EMI absorber positioned within the housing proximate the electrical connector of the PCB positioned at the second end portion of the housing, the socket EMI absorber configured to attenuate EMI generated in a socket region;

a three-dimensional EMI absorber positioned between the PCB and one or both of a transmitter optical subassembly (“

TOSA”

) and a receiver optical subassembly (“

ROSA”

);

a port retention bar positioned inside of the housing, the port retention bar configured to support one or both of a transmitter optical subassembly (“

TOSA”

) and a receiver optical subassembly (“

ROSA”

); and

a fiber tray supporting one or more internal optical cables positioned inside of the housing.

14. A method comprising:

forcing a molten plastic material that includes nickel-coated carbon fiber or electrically conductive filler into a mold cavity of a mold;

solidifying the molten plastic material that includes the nickel-coated carbon fiber or electrically conductive filler into a shape that conforms to a contour of the mold to form a component of an optoelectronic module from the plastic material that includes the nickel-coated carbon fiber or electrically conductive filler, wherein the component comprises an electromagnetic interference (“

EMI”

) attenuating component selected from a group consisting of;

an alignment guide configured to receive a connector attached to at least one fiber optic cable including one or more optical fibers, wherein the connector retains ends of the one or more optical fibers, and the alignment guide is configured to optically align the one or more optical fibers with one or both of a transmitter and a receiver of the optoelectronic module;

an optoelectronic subassembly (“

OSA”

) block retained by a housing that extends along a longitudinal axis between a first end portion and a second end portion, the first end portion configured to interface with the fiber optic cable including the one or more optical fibers, wherein the OSA block defines a port configured to receive a ferrule attached to ends of the one or more optical fibers;

a moveable member of a latching mechanism configured to fasten or disengage the optoelectronic module from a host receptacle;

a printed circuit board (“

PCB”

) compression plate configured to retain a PCB that includes an electrical connector at the second end portion of the housing, wherein the PCB compression plate is configured to retain the PCB within the housing in at least one direction transverse to the longitudinal axis;

a PCB spacer, wherein the PCB spacer is positioned between the PCB and a second PCB in a double-deck PCB arrangement;

an adapter operably connected between the fiber optic cable and one or more components within the housing;

a flex EMI absorber positioned within the housing proximate the first end portion in a flex region of the optoelectronic module and configured to attenuate EMI emitted in the flex region;

a socket EMI absorber positioned within the housing proximate the electrical connector of the PCB positioned at the second end portion of the housing, the socket EMI absorber configured to attenuate EMI generated in a socket region;

a three-dimensional EMI absorber positioned between the PCB and one or both of a transmitter optical subassembly (“

TOSA”

) and a receiver optical subassembly (“

ROSA”

);

a port retention bar positioned inside of the housing, the port retention bar configured to support one or both of a transmitter optical subassembly (“

TOSA”

) and a receiver optical subassembly (“

ROSA”

); and

a fiber tray supporting one or more internal optical cables positioned inside of the housing.

15. The method of claim 14, wherein the EMI attenuating component is injection molded.

16. The method of claim 14, wherein the EMI attenuating component includes the PCB spacer and wherein the PCB spacer is configured to support the PCB and the second PCB inside of the housing.

17. The method of claim 14, wherein the EMI attenuating component includes the alignment guide, the connector is configured to retain ends of the one or more optical fibers, and the alignment guide is configured to optically align the one or more optical fibers with one or both of the transmitter and the receiver.

18. The method of claim 14, wherein the EMI attenuating component includes the moveable member and the moveable member comprises a slider extending along sides of the housing.

19. The method of claim 14, wherein the EMI attenuating component includes the fiber tray, the one or more internal optical cables is coupled to a transmitter optical subassembly (“

TOSA”

) and a receiver optical subassembly (“

ROSA”

), and the fiber tray supports the TOSA and the ROSA.

20. The method of claim 14, wherein the EMI attenuating component includes the port retention bar that is disposed against the housing to retain the TOSA and the ROSA with respect to one another.