SIGNAL STRENGTH ENHANCEMENT IN A BIOMETRIC SENSOR ARRAY

• US 20170098115A1
• Filed: 12/19/2016
• Published: 04/06/2017
• Est. Priority Date: 10/28/2010
• Status: Active Grant

• Current Assignee: Synaptics Incorporated
• Original Assignee: Synaptics Incorporated
• Inventors: WICKBOLDT, Paul, DEAN, Gregory Lewis, THOMPSON, Erik Jonathon, JANDU, Jaswinder, SMITH, Patrick, MOLESA, Steven
• Granted Patent: US 10,049,254 B2
• Time in Patent Office: Days
• CPC Class Codes: G06F 21/32 using biometric data, e.g. fingerprints, iris scans or voiceprints
• CPC Class Codes: G06F 3/0443 using a single layer of sensing electrodes
• CPC Class Codes: G06F 3/0446 using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
• CPC Class Codes: G06K 19/07756 the connection being non-galvanic, e.g. capacitive
• CPC Class Codes: G06V 40/1306 non-optical, e.g. ultrasonic or capacitive sensing
• CPC Class Codes: G06V 40/1335 Combining adjacent partial images (e.g. slices) to create a composite input or reference pattern; Tracking a sweeping finger movement
• CPC Class Codes: G06V 40/1365 Matching; Classification
• CPC Class Codes: G07C 9/25 using biometric data, e.g. fingerprints, iris scans or voice recognition
• CPC Class Codes: G07C 9/26 using a biometric sensor integrated in the pass
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 27/14678 Contact-type imagers
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/15788 Glasses, e.g. amorphous oxides, nitrides or fluorides
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/19107 off-chip wires
• CPC Class Codes: H04L 9/3231 Biological data, e.g. fingerprint, voice or retina network architectures or network communication protocols for supporting authentication of entities using biometrical features in a packet data network H04L63/0861
• CPC Class Codes: H04N 21/4415 using biometric characteristics of the user, e.g. by voice recognition or fingerprint scanning cryptography using biological data H04L9/3231; authentication in networks using biometric H04L63/0861

Abstract

A biometric imager may comprise a plurality of sensor element traces formed in or on a sensor substrate which may comprise at least a portion of a display screen defining a biometric sensing area and forming in-active pixel locations; an auxiliary active circuit formed in or on the sensor substrate on the periphery of the biometric sensing area and in direct or indirect electrical contact with the sensor element traces; and providing a signal processing interface to a remotely located controller integrated circuit. The sensor element traces may form a portion of one dimensional linear sensor array or pixel locations in a two dimensional grid array capacitive gap biometric imaging sensor. The auxiliary circuit may provide pixel location selection or pixel signal amplification. The auxiliary circuit may be mounted on a surface of the display screen. The auxiliary circuit further comprising a separate pixel location selection controller circuit.

Claims

1. A biometric imager comprising:

a plurality of sensor element traces formed in or on a sensor substrate comprising at least a portion of a display screen defining a biometric sensing area and forming in-active pixel locations;

an auxiliary active circuit formed in or on the sensor substrate on the periphery of the biometric sensing area and in direct or indirect electrical contact with each of the plurality of sensor element traces;

the auxiliary active circuit providing a signal processing interface between the plurality of sensor element traces and a remotely located controller integrated circuit.

2. The imager of claim 1 further comprising:

the plurality of sensor element traces forming a portion of one dimensional linear capacitive gap biometric imaging sensor.

3. The imager of claim 1 further comprising:

the plurality of sensor element traces forming the rows and columns of pixel locations in a two dimensional grid array capacitive gap biometric imaging sensor.

4. The imager of claim 2 further comprising:

the auxiliary circuit comprising a pixel location selection circuit.

5. The imager of claim 3 further comprising:

the auxiliary circuit comprising a pixel location selection circuit.

6. The imager of claim 2 further comprising:

the auxiliary circuit comprising a pixel signal amplification circuit.

7. The imager of claim 3 further comprising:

the auxiliary circuit comprising a pixel signal amplification circuit.

8. The imager of claim 2 further comprising:

the auxiliary circuit is mounted to a surface of the display screen.

9. The imager of claim 3 further comprising:

the auxiliary circuit is mounted to a surface of the display screen.

10. The imager of claim 1 further comprising:

the auxiliary circuit further comprising a separate pixel location selection controller circuit.

11. A method of biometric imaging comprising:

providing a plurality of sensor element traces formed in or on a sensor substrate comprising at least a portion of a display screen defining a biometric sensing area and forming in-active pixel locations;

providing an auxiliary active circuit formed in or on the sensor substrate on the periphery of the biometric sensing area and in direct or indirect electrical contact with each of the plurality of sensor element traces;

the auxiliary active circuit providing a signal processing interface between the plurality of sensor element traces and a remotely located controller integrated circuit.

12. The method of claim 11 further comprising:

forming a portion of one dimensional linear capacitive gap biometric imaging sensor with the plurality of sensor element traces.

13. The method of claim 11 further comprising:

forming the rows and columns of pixel locations in a two dimensional grid array capacitive gap biometric imaging sensor with the plurality of sensor element traces.

14. The method of claim 12 further comprising:

the auxiliary circuit comprising a pixel location selection circuit.

15. The method of claim 13 further comprising:

the auxiliary circuit comprising a pixel location selection circuit.

16. The method of claim 12 further comprising:

the auxiliary circuit comprising a pixel signal amplification circuit.

17. The method of claim 13 further comprising:

the auxiliary circuit comprising a pixel signal amplification circuit.

18. The method of claim 12 further comprising:

the auxiliary circuit is mounted to a surface of the display screen.

19. The method of claim 13 further comprising:

the auxiliary circuit is mounted to a surface of the display screen.

20. The method of claim 11 further comprising:

the auxiliary circuit further comprising a separate pixel location selection controller circuit.