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VAPOR PHASE DEPOSITION OF ORGANIC FILMS

  • US 20170100743A1
  • Filed: 03/15/2016
  • Published: 04/13/2017
  • Est. Priority Date: 10/09/2015
  • Status: Active Grant
First Claim
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1. A method for reducing the aspect ratio of three-dimensional structures on a substrate, comprising:

  • vaporizing a first reactant to form a first reactant vapor;

    exposing a substrate in a reaction space to the first reactant vapor, the substrate comprising a topography with a three-dimensional structure; and

    depositing an organic film over the substrate preferentially over lower features of the topography compared to higher features of the topography such that the organic film reduces an aspect ratio of the three-dimensional structure on the substrate as it deposits, wherein depositing includes exposing the substrate to the first reactant vapor.

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