APPARATUS AND METHOD FOR ATTACHING INTERCONNECTOR OF SOLAR CELL PANEL

• US 20170104124A1
• Filed: 10/12/2016
• Published: 04/13/2017
• Est. Priority Date: 10/12/2015
• Status: Active Grant

• Current Assignee: Shangrao Xinyuan Yuedong Technology Development Company Limited
• Original Assignee: LG Electronics, Inc. (LG Corporation)
• Inventors: KIM, Jinsung, LEE, Hyunho, OH, Donghae, KANG, Woojoong, KIM, Jangho, KANG, Dongju, SIM, Kyuhyeok
• Granted Patent: US 10,290,761 B2
• Time in Patent Office: Days
• CPC Class Codes: B23K 1/0016 Brazing of electronic components
• CPC Class Codes: B23K 1/203 Fluxing, i.e. applying flux onto surfaces
• CPC Class Codes: B23K 3/082 Flux dispensers; Apparatus for applying flux
• CPC Class Codes: B23K 35/362 Selection of compositions of fluxes B23K35/365, B23K35/368 take precedence
• CPC Class Codes: H01L 31/05 Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells electrodes H01L31/0224; electrical interconnection of thin film solar cells formed on a common substrate H01L31/046; particular structures for electrical interconnecting of adjacent thin film solar cells in the module H01L31/0465; electrical interconnection means specially adapted for electrically connecting two or more PV modules H02S40/36
• CPC Class Codes: H01L 31/0504 specially adapted for series or parallel connection of solar cells in a module
• CPC Class Codes: H01L 31/18 Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
• CPC Class Codes: H01R 4/02 Soldered or welded connections H01R4/625, H01R4/723, H01R12/59 take precedence
• CPC Class Codes: Y02E 10/50 Photovoltaic [PV] energy

Abstract

Disclosed is a method for attaching an interconnector of a solar cell panel. The method includes forming a flux layer by spraying flux over the interconnector via spraying, the interconnector including a core layer and a solder layer formed on a surface of the core layer, and attaching the interconnector to a solar cell via soldering of the solder layer by pressing the interconnector onto the solar cell while applying heat.

Claims

1. A method for attaching an interconnector of a solar cell panel, the method comprising:

forming a flux layer by spraying flux over the interconnector via spraying, the interconnector including a core layer and a solder layer formed on a surface of the core layer; and

attaching the interconnector to a solar cell via soldering of the solder layer by pressing the interconnector onto the solar cell while applying heat.

2. The method according to claim 1, wherein the interconnector includes a plurality of interconnectors arranged side by side with a distance therebetween, and

wherein, in the forming the flux layer, the flux is sprayed to the respective interconnectors at the same time.

3. The method according to claim 2, wherein, in the forming the flux layer, a spray member including a spraying portion for spraying the flux is provided, and

wherein the spray member is provided in a plural number so that a plurality of spraying portions is provided, or so that each spray member includes a plurality of spraying portions.

4. The method according to claim 3, wherein, in the forming the flux layer, the interconnectors and the spray members have a distance therebetween within a range from 1 cm to 50 cm.

5. The method according to claim 3, wherein the spraying portions have a distance therebetween within a range from 1 cm to 3 cm.

6. The method according to claim 3, wherein a ratio of the distance between the interconnectors to a distance between the spraying portions ranges from 1:

1 to 1;

4.

7. The method according to claim 3, wherein the flux, sprayed from two neighboring spraying portions among the spraying portions, at least partially overlaps in a region in which the interconnectors are located.

8. The method according to claim 1, wherein the flux includes a halogen element.

9. The method according to claim 1, wherein the flux layer has a thickness within a range from 2 μ

m to 7 μ

m.

10. The method according to claim 1, wherein the flux, sprayed by the spray member, has a spraying pressure within a range from 0.15 MPa to 0.4 MPa.

11. The method according to claim 1, wherein the interconnector includes a rounded portion, or has a circular cross section.

12. An apparatus for attaching an interconnector of a solar cell panel, the apparatus comprising:

a flux unit including a spray member having a spraying portion for spraying flux over the interconnector, which includes a core layer and a solder layer formed on a surface of the core layer; and

an attachment unit for attaching the interconnector to a solar cell via soldering of the solder layer by pressing the interconnector onto the solar cell while applying heat.

13. The apparatus according to claim 12, wherein the interconnector is provided in a plural number so that a plurality of interconnectors is arranged side by side with a distance therebetween, and

wherein the spray member is provided in a plural number so that a plurality of spraying portions is provided, or so that each spray member includes a plurality of spraying portions.

14. The apparatus according to claim 12, wherein the interconnector and the spray member have a distance therebetween within a range from 1 cm to 50 cm.

15. The apparatus according to claim 13, wherein the spraying portions have a distance therebetween within a range from 1 cm to 3 cm.

16. The apparatus according to claim 13, wherein a ratio of the distance between the interconnectors to a distance between the spraying portions ranges from 1:

1 to 1;

4.

17. The apparatus according to claim 13, wherein the flux, sprayed from two neighboring spraying portions among the spraying portions, at least partially overlaps in a region in which the interconnectors are located.

18. The apparatus according to claim 12, wherein the flux includes a halogen element.

19. The apparatus according to claim 12, wherein the flux, sprayed by the spray member, has a spraying speed or spraying pressure within a range from 0.15 MPa to 0.4 MPa.

20. The apparatus according to claim 12, wherein the interconnector includes a rounded portion, or has a circular cross section.