INTEGRATED HEAT SPREADER AND EMI SHIELD
First Claim
1. An electronic device comprising:
- a printed circuit board (PCB), the PCB including at least one grounding pad;
an integrated circuit mounted on the PCB;
an electrically-conductive frame mounted on the PCB and surrounding the integrated circuit, the frame being electrically connected to the at least one grounding pad; and
a flexible electrically-conductive, high-thermal-conductivity heat spreader in electrical contact with the frame and in thermal contact with the integrated circuit,wherein the frame, the heat spreader, and the at least one grounding pad form an EMI shield that reduces EMI leakage from the integrated circuit outside a volume defined by the frame, the heat spreader, and the at least one grounding pad.
2 Assignments
0 Petitions
Accused Products
Abstract
An electronic device includes a printed circuit board (PCB), the PCB including at least one grounding pad, an integrated circuit mounted on the PCB; an electrically-conductive frame mounted on the PCB and surrounding the integrated circuit, the frame being electrically connected to the at least one grounding pad, and a flexible electrically-conductive, high-thermal-conductivity heat spreader in electrical contact with the frame and in thermal contact with the integrated circuit. The frame, the heat spreader, and the at least one grounding pad form an EMI shield that reduces EMI leakage from the integrated circuit outside a volume defined by the frame, the heat spreader, and the at least one grounding pad.
14 Citations
20 Claims
-
1. An electronic device comprising:
-
a printed circuit board (PCB), the PCB including at least one grounding pad; an integrated circuit mounted on the PCB; an electrically-conductive frame mounted on the PCB and surrounding the integrated circuit, the frame being electrically connected to the at least one grounding pad; and a flexible electrically-conductive, high-thermal-conductivity heat spreader in electrical contact with the frame and in thermal contact with the integrated circuit, wherein the frame, the heat spreader, and the at least one grounding pad form an EMI shield that reduces EMI leakage from the integrated circuit outside a volume defined by the frame, the heat spreader, and the at least one grounding pad. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
-
-
11. A method comprising:
-
mounting an integrated circuit on printed circuit board (PCB), the PCB including at least one grounding pad, and having an electrically-conductive frame mounted on the PCB and surrounding a location at which the integrated circuit in mounted, the frame being electrically connected to the at least one grounding pad; and installing a flexible electrically-conductive, high-thermal-conductivity heat spreader in electrical contact with the frame and in thermal contact with the integrated circuit, wherein the frame, the heat spreader, and the at least one grounding pad form an EMI shield that reduces EMI leakage from the integrated circuit outside a volume defined by the frame, the heat spreader, and the at least one grounding pad. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
-
Specification