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Sputtering Apparatuses and Methods of Manufacturing a Magnetic Memory Device Using the Same

  • US 20170110301A1
  • Filed: 07/06/2016
  • Published: 04/20/2017
  • Est. Priority Date: 10/16/2015
  • Status: Active Grant
First Claim
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1. A sputtering apparatus, comprising:

  • a process chamber;

    a substrate holder within the process chamber and that is configured to fix a horizontal position of a substrate during a sputtering process; and

    a first sputter gun vertically spaced apart from the substrate in the process chamber,wherein the first sputter gun is horizontally spaced apart from the substrate by a first distance during the sputtering process,wherein the first sputter gun is fixed at a position during the sputtering process, and wherein the first distance is a distance between the substrate and the first sputter gun.

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