INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME
First Claim
1. An integrated circuit device comprising:
- a fin type active area protruding from a substrate and having an upper surface at a first level;
a nanosheet extending in parallel to the upper surface of the fin type active area and comprising a channel area, the nanosheet being located at a second level spaced apart from the upper surface of the fin type active area;
a gate disposed on the fin type active area and surrounding at least a part of the nanosheet, the gate extending in a direction crossing the fin type active area;
a gate dielectric layer disposed between the nanosheet and the gate;
a source and drain region formed on the fin type active area and connected to one end of the nanosheet;
a first insulating spacer on the nanosheet, the first insulating spacer covering sidewalls of the gate; and
a second insulating spacer disposed between the gate and the source and drain region in a space between the upper surface of the fin type active area and the nanosheet, the second insulating spacer having a multilayer structure.
1 Assignment
0 Petitions
Accused Products
Abstract
An integrated circuit device includes a fin type active area protruding from a substrate and having an upper surface at a first level; a nanosheet extending in parallel to the upper surface of the fin type active area and comprising a channel area, the nanosheet being located at a second level spaced apart from the upper surface of the fin type active area; a gate disposed on the fin type active area and surrounding at least a part of the nanosheet, the gate extending in a direction crossing the fin type active area; a gate dielectric layer disposed between the nanosheet and the gate; a source and drain region formed on the fin type active area and connected to one end of the nanosheet; a first insulating spacer on the nanosheet, the first insulating spacer covering sidewalls of the gate; and a second insulating spacer disposed between the gate and the source and drain region in a space between the upper surface of the fin type active area and the nanosheet, the second insulating spacer having a multilayer structure.
137 Citations
36 Claims
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1. An integrated circuit device comprising:
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a fin type active area protruding from a substrate and having an upper surface at a first level; a nanosheet extending in parallel to the upper surface of the fin type active area and comprising a channel area, the nanosheet being located at a second level spaced apart from the upper surface of the fin type active area; a gate disposed on the fin type active area and surrounding at least a part of the nanosheet, the gate extending in a direction crossing the fin type active area; a gate dielectric layer disposed between the nanosheet and the gate; a source and drain region formed on the fin type active area and connected to one end of the nanosheet; a first insulating spacer on the nanosheet, the first insulating spacer covering sidewalls of the gate; and a second insulating spacer disposed between the gate and the source and drain region in a space between the upper surface of the fin type active area and the nanosheet, the second insulating spacer having a multilayer structure. - View Dependent Claims (2, 3, 4, 5, 11, 12, 13, 14)
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6-10. -10. (canceled)
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15. An integrated circuit device comprising:
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a fin type active area protruding from a substrate and extending in a first direction; at least one nanosheet stack structure facing and spaced apart from an upper surface of the fin type active area, the at least one nanosheet stack structure comprising a plurality of nanosheets each having a channel area; at least one gate disposed on the fin type active area and covering the at least one nanosheet stack structure, the at least one gate extending in a direction crossing the first direction; at least one gate dielectric layer disposed between the at least one nanosheet stack structure and the at least one gate; source and drain regions connected to the plurality of nanosheets; and insulating spacers each having a multilayer structure and contacting the source and drain regions in spaces between the plurality of nanosheets. - View Dependent Claims (16, 17, 18, 19, 20)
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21-30. -30. (canceled)
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31. An integrated circuit device, comprising:
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a substrate; a fin type active area that protrudes from the substrate; a plurality of source and drain regions on the fin type active area; a plurality of nanosheets that are adjacent to the plurality of source and drain regions, the plurality of source and drain regions being respectively connected to opposing ends of the plurality of nanosheets; and a plurality of insulating spacers between ones of the plurality of nanosheets, each of the insulating spacers having a multi-layer structure. - View Dependent Claims (32, 33, 34, 35)
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36-40. -40. (canceled)
Specification