DRIVER ASSEMBLY

• US 20170110984A1
• Filed: 02/19/2015
• Published: 04/20/2017
• Est. Priority Date: 03/31/2014
• Status: Active Grant

• Current Assignee: Lemforder Electronic GmbH (Zeppelin - Stiftung der Stadt Friedrichshafen)
• Original Assignee: Lemforder Electronic GmbH (Zeppelin - Stiftung der Stadt Friedrichshafen)
• Inventors: Palit, Ajoy, Jahn, Jorg, Erdmann, Thomas
• Granted Patent: US 9,917,533 B2
• Time in Patent Office: Days
• CPC Class Codes: H02K 11/33 Drive circuits, e.g. power electronics H02K11/38 takes precedence
• CPC Class Codes: H02K 9/02 by ambient air flowing through the machine
• CPC Class Codes: H02M 7/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections
• CPC Class Codes: H02M 7/537 using semiconductor devices only, e.g. single switched pulse inverters
• CPC Class Codes: H02P 27/06 using dc to ac converters or inverters H02P27/05 takes precedence
• CPC Class Codes: H05K 7/209 Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20909 takes precedence

Abstract

A driver assembly comprises several semiconductor switches that are arranged in a plane so that distances between adjacent semiconductor switches in the plane are equally large, and so that each semiconductor switch has the same number of adjacent semiconductor switches.

Claims

1. A driver assembly comprising a plurality of semiconductor switches, wherein the plurality of semiconductor switches are arranged in a plane so that distances between adjacent semiconductor switches are equally large, respectively, and so that each semiconductor switch has the same number of adjacent semiconductor switches.

2. The driver assembly according to claim 1, wherein the plurality of semiconductor switches are evenly distributed on a circle.

3. The driver assembly according to claim 1, wherein distances between non-adjacent semiconductor switches are at least 1.5 times as large as distances between adjacent semiconductor switches.

4. The driver assembly according to claim 1, wherein the plurality of semiconductor switches are evenly aligned with one another.

5. The driver assembly according to claim 1, wherein six semiconductor switches are included and the driver assembly is coupled to a three-phase inverter.

6. The driver assembly according to claim 5, further comprising two additional semiconductor switches, wherein the two additional semiconductor switches form a half bridge assigned to one of the three phases and the half bridge is electrically coupled with a third additional semiconductor switch.

7. The driver assembly according to claim 6, further comprising a plurality of third additional semiconductor switches, wherein each of the plurality of third additional semiconductor switches are electrically coupled among each other using a joint connecting line.

8. The driver assembly according to claim 7, wherein the plurality of third additional semiconductor switches are arranged in a different plane than the two additional semiconductor switches forming the half bridge.

9. The driver assembly according to claim 1, further comprising a heat sink for the thermal coupling with the plurality of semiconductor switches, wherein the heat sink comprises several contact sections located in one respective plane for installation on the semiconductor switches.

10. The driver assembly according to claim 9, wherein the contact sections are encompassed by a contact surface that has the shape of a circle.

11. The driver assembly according to claim 9, wherein the contact sections are encompassed by a contact surface which has the shape of a regular polygon with as many angles as are located on semiconductor switches adjacent to the heat sink.

12. The driver assembly according to claim 9, wherein the plurality of semiconductor switches comprise surface-mounted components, wherein the plurality of semiconductor switches are in electrical contact through conducting paths and the heat sink comprises a protrusion located outside of the plane for the thermal coupling with at least one conducting path.

13. The driver assembly according to claim 12, wherein the conducting paths for the electrical connection of lines of the plurality of semiconductor switches have equally sized surfaces.

14. A driver assembly with a predetermined number of semiconductor switches, wherein each semiconductor switch is assigned to one of at least two driver assemblies according to claim 1.

15. The driver assembly according to claim 1, wherein the plurality of semiconductor switches comprise a first group of semiconductor switches and a second group of semiconductor switches, wherein the first group of semiconductor switches and the second group of semiconductor switches are mechanically and electrically attached to a board, wherein the first group of semiconductor switches are arranged on a first side of the board and the second group of semiconductor switches are arranged on a second side of the board.

16. The driver assembly according to claim 15, further comprising a plurality of heat sinks coupled to the first group of semiconductor switches and the second group of semiconductor switches, wherein the plurality of heat sinks extend in opposing directions away from the board.

17. The driver assembly according to claim 15, further comprising a heat sink coupled to the first group of semiconductor switches and the second group of semiconductor switches.

18. The driver assembly according to claim 6, further comprising a short-circuit switch electrically connected to the half-bridge.

19. The driver assembly according to claim 10, further comprising an insulator located between the contact section and the contact surface, wherein the insulator is thermally conductive and electrically insulating.

20. The driver assembly according to claim 19, wherein the insulator is a thermally conductive pad, a heat-conducting paste, or a mica wafer.